Selected, peer reviewed papers from the 10th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS), September 20-22, 2010, Ostend, Belgium

14th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (14th UCPSS 2018) Selected, peer reviewed papers from the 14th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (14th UCPSS 2018), September 3-5, 2018, Leuven, Belgium

Selected peer-reviewed full text papers from the 15th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS) Selected, peer-reviewed papers from the 15-th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS), April 12-15, 2021, Mechelen, Belgium

A totally new concept for clean surface processing of Si wafers is introduced in this book. Some fifty distinguished researchers and engineers from the leading Japanese semiconductor companies, such as NEC, Hitachi, Toshiba, Sony and Panasonic as well as from several universities reveal to us for the first time the secrets of these highly productive institutions. They describe the techniques and equipment necessary for the preparation of clean high-quality semiconductor surfaces as a first step in high-yield/high-quality device production. This book thus opens the door to the manufacturing of reliable nanoscale devices and will be extremely useful for every engineer, physicist and technician involved in the production of silicon semiconductor devices.

Selected, peer reviewed papers from the 8th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS) held in Antwerp, Belgium, September 18-20, 2006

Wafer cleaning, microcontamination and surface passivation are the key focus of this proceedings volume, the 3rd in a successful series from MRS. It is a field in which control of surface chemistry and surface morphology, as well as particle and molecular contamination removal, are of critical importance. This volume expands the scope of the topic to include ultraclean technology in a broader sense, emphasizing the identification and characterization of trace contamination, strategies for removal, and equipment considerations, as well as critical limits for impact on devices. Novel processes, such as chemical mechanical polishing (CMP), and their ramifications for contamination removal are also addressed.

Selected, peer reviewed papers from the 13th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS), September 12-14, 2016, Knokke, Belgium