Soldering Handbook for Printed Circuits and Surface Mounting, Second Edition, covers every aspect of this packaging technology, and contains the latest information on design, presolder operations, materials, equipment, surface mount technology, cleaning, quality and inspection, touch-up and repair, process economy, line management, and more.

The printed circuit industry has achieved maturity and universal accep tance. No known interconnection technology threatens to render it obso lete in the foreseeable future. It offers two unique advantages that are important for any assembly technology: quality (reliability) and economy. The mode of component attachment to printed circuit boards, however, is undergoing a radical change. Technical and economic pressures are forcing the industry to convert some or all of its assembly to surface mounting techniques. We are moving away from the traditional large through-the-hole connection with its mechanical security. It is being re placed by a small surface butt and/or lap joint, sometimes with no added mechanical support to the solder. This change requires a complete reas sessment of design, production, and inspection techniques. A major por tion of this book is devoted to the changes imposed by surface mounting. This recent development is an extension of the established hybrid (thick and thin-film) industry. Yet when it is applied to conventional printed circuits, there are major differences. One must view the printed circuit board as a planar surface designed to provide interconnections between electronic devices. The electronic in dustry is using them for mass-production techniques to join discrete, integrated, and special components (leaded and leadless). This book ap plies to all board variations including single-sided, double-sided, multi layer, and flexible circuits.

The printed circuit industry has achieved maturity and universal accep tance. No known interconnection technology threatens to render it obso lete in the foreseeable future. It offers two unique advantages that are important for any assembly technology: quality (reliability) and economy. The mode of component attachment to printed circuit boards, however, is undergoing a radical change. Technical and economic pressures are forcing the industry to convert some or all of its assembly to surface mounting techniques. We are moving away from the traditional large through-the-hole connection with its mechanical security. It is being re placed by a small surface butt and/or lap joint, sometimes with no added mechanical support to the solder. This change requires a complete reas sessment of design, production, and inspection techniques. A major por tion of this book is devoted to the changes imposed by surface mounting. This recent development is an extension of the established hybrid (thick and thin-film) industry. Yet when it is applied to conventional printed circuits, there are major differences. One must view the printed circuit board as a planar surface designed to provide interconnections between electronic devices. The electronic in dustry is using them for mass-production techniques to join discrete, integrated, and special components (leaded and leadless). This book ap plies to all board variations including single-sided, double-sided, multi layer, and flexible circuits.

Surface Mount Technology has had a profound influence on the electronics industry, and has led to the use of new materials, techniques and manufacturing processes. Since the first edition of this book was written, electronic assemblies have continued to become still smaller and more complex, while soldering still remains the dominant connecting technique. This is a comprehensive guide to current methods of soldering components to their substrates, written by one of the founding fathers of the technology. It also covers component placement, the post-CFC technology of cleaning after soldering, and the principles and methods of quality control and rework. New sections deal with Ball-Grid-Array (BGA) technology, lead-free solders, no-clean fluxes, and the current standard specifications for solders and fluxes. Dr Rudolf Strauss has spent most of his working life with a leading manufacturer of solders and fluxes. He was responsible for a number of innovations including the concept of wave soldering, and for many years has been active as lecturer, consultant, and technical author. His book explains the principles of soldering and surface mount technology in practical terms and plain language, free from jargon. It is addressed to the man, or woman, who has to do the job, but it will also be of help in planning manufacturing strategy and in making purchasing decisions relating to consumables and equipment. - Written by founding father of SMT technology - Standard specifications have been fully updated - New chapter covering Ball Grid Array (BGA) technology

The World's #1 Guide to Printed Circuit Boards_Now Completely Updated with the Latest Information on Lead-Free Manufacturing! The best reference in the field for over 30 years, the Printed Circuits Handbook equips you with definitive coverage of every facet of printed circuit assemblies_from design methods to fabrication processes. Now completely revised and updated, the Sixth Edition presents the latest information on lead-free manufacturing, including lead-free PCB design and fabrication techniques, lead-free materials, and lead-free reliability models. The new edition also explores best practices for High Density Interconnect (HDI), as well as flexible printed circuits. Written by a team of experts from around the world, the Sixth Edition of this renowned handbook contains cutting-edge material on engineering and design of printed circuits fabrication methods…assembly processes… solders and soldering…test and repair…waste minimization and treatment …quality and reliability of printed circuit processes…and much more. The updated Printed Circuits Handbook provides you with: Unsurpassed guidance on printed circuits_from design to manufacturing Over 500 illustrations, charts, and tables for quick access to essential data New to this edition: New coverage of lead-free PCB design and manufacturing techniques, lead-free materials, lead-free reliability models, best practices for High Density Interconnect (HDI), and flexible printed circuits Inside This State-of-the-Art Printed Circuits Guide • Introduction to Printed Circuits • Engineering and Design of Printed Circuits Fabrication Processes • Assembly Processes • Solders and Soldering • Test and Repair • Waste Minimization and Treatment • Quality and Reliability of Printed Circuit Processes • Flexible Circuits

Surface mount technology (SMT) is a mature technology. SMT allows placement of more surface mount components (SMC) into smaller and tighter printed circuit board (PCB) areas. This increased density means increased performance and power in smaller packaging systems, and allows manufacturing of smaller and higher performance products at lower cost. The advance of integrated circuit (IC) technology and the requirements of high density for high-speed circuity is driving the design of SM C to higher pin count and smaller package size. In general, the higher pin count and smaller package size are accomplished by reducing the bond pad size and spacing (pitch) on the chip level and the lead/pin/solder dimensions and pitch on the chip carrier (module) level. The last few years have witnessed an explosive growth in the research and development efforts devoted to FPT as a direct result of the rapid growth of SMT and miniaturization. Some examples are: hand held lightweight video recorders that can take sharp pictures, hand held lightweight devices that can track the worldwide package movements, and portable computers with tiny yet powerful microprocessors and large memory capability that can fit into a briefcase or into the palm of your hand.

Design Guidelines for Surface Mount Technology covers the basics and the mechanics of surface mounted design technology. Surface mount technology (SMT) embodies an automated circuit assembly process, using a generation of electronic components called surface mounted devices (SMDs). Organized into eight chapters, the book discusses the component selection, space planning, materials and processes, and total concept needed to ensure a manufacturable design. The opening chapters of the book examine the significant requirements and variables affecting SMT and SMDs. The book then deals with the substrate materials specifications, including fabrication and material planning, assembly, design rules, layout guidelines, package outlines, and bar code labeling. The next chapters describe the manufacturing and assembly processes in SMDs and process-proven footprint patterns for each of the component types used, as well as guidelines for creating a suitable pattern on future products. Other chapters discuss the component spacing requirements for SMT and the generation of footprint patterns for passive and active components of SMDs. The concluding chapter describes the design criteria for maximizing machine insertion of leaded electronic components into printed circuit boards (PCBs). These criteria aid the PCB designer by detailing the considerations and some of the trade-offs that will provide reliable insertion in a production environment. Supplementary texts on surface mount equipment, supplies, and services are also provided. Design engineers and researchers will find this book invaluable.

Newnes Electronics Assembly Handbook

Resolve all your workaday questions with the PCB answer book. Defining the best in printed circuit board design and technology and unparalleled in thoroughness and reliability, Coombs' PRINTED CIRCUITS HANDBOOK, Fifth Edition provides definitive coverage of every facet of printed circuit assemblies, from design methods to manufacturing processes. This new edition of the most trusted guide to pcbs gives you: * Exhaustive coverage of HDI (High Density Interconnect) technologies including design, material, microvia fabrication, sequential lamination, assembly, testing, and reliability * Coverage of fabrication developments including: blind and buried vias, controlled depth drilling, direct imaging, horizontal and pulse plating * Thorough examination of base materials, including traditional and alternative laminates * Understanding of effective quality and reliability programs, including: test & inspection, acceptability criteria, reliability of boards and assemblies, process capability and control * Full treatment of multi-layer and flexible printed circuit design, fabrication and assembly advanced single- and multi-chip component packaging * Contributions from pros at Motorola, Cisco, and other major companies * Included CD-ROM, with the entire book in searchable format * Hundreds of illustrations and instant-access tables, and formulas