Proceedings Of The 2016 Ieee 23rd International Symposium On The Physical And Failure Analysis Of Integrated Circuits Ipfa
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: |
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: |
Total Pages |
: 438 |
Release |
: 2016 |
ISBN-10 |
: OCLC:972636834 |
ISBN-13 |
: |
Rating |
: 4/5 (34 Downloads) |
Synopsis Proceedings of the 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) by :
Author |
: IEEE Staff |
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: |
Total Pages |
: |
Release |
: 2016-07-18 |
ISBN-10 |
: 1467382604 |
ISBN-13 |
: 9781467382601 |
Rating |
: 4/5 (04 Downloads) |
Synopsis 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) by : IEEE Staff
IPFA is devoted to the fundamental understanding of the physical mechanisms of semiconductor device failures and issues related to semiconductor device reliability, yield and performance, especially those related to advanced process technologies
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: |
Publisher |
: ASM International |
Total Pages |
: 540 |
Release |
: 2019-12-01 |
ISBN-10 |
: 9781627082730 |
ISBN-13 |
: 1627082735 |
Rating |
: 4/5 (30 Downloads) |
Synopsis ISTFA 2019: Proceedings of the 45th International Symposium for Testing and Failure Analysis by :
The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.
Author |
: ASM International |
Publisher |
: ASM International |
Total Pages |
: 593 |
Release |
: 2018-12-01 |
ISBN-10 |
: 9781627080996 |
ISBN-13 |
: 1627080996 |
Rating |
: 4/5 (96 Downloads) |
Synopsis ISTFA 2018: Proceedings from the 44th International Symposium for Testing and Failure Analysis by : ASM International
The International Symposium for Testing and Failure Analysis (ISTFA) 2018 is co-located with the International Test Conference (ITC) 2018, October 28 to November 1, in Phoenix, Arizona, USA at the Phoenix Convention Center. The theme for the November 2018 conference is "Failures Worth Analyzing." While technology advances fast and the market demands the latest and the greatest, successful companies strive to stay competitive and remain profitable.
Author |
: ASM International |
Publisher |
: ASM International |
Total Pages |
: 666 |
Release |
: 2017-12-01 |
ISBN-10 |
: 9781627081511 |
ISBN-13 |
: 1627081518 |
Rating |
: 4/5 (11 Downloads) |
Synopsis ISTFA 2017: Proceedings from the 43rd International Symposium for Testing and Failure Analysis by : ASM International
The theme for the November 2017 conference was Striving for 100% Success Rate. Papers focus on the tools and techniques needed for maximizing the success rate in every aspect of the electronic device failure analysis process.
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: |
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: |
Total Pages |
: 378 |
Release |
: 2005 |
ISBN-10 |
: UOM:39015058329940 |
ISBN-13 |
: |
Rating |
: 4/5 (40 Downloads) |
Synopsis Proceedings of the ... International Symposium on the Physical & Failure Analysis of Integrated Circuits by :
Author |
: Institute of Electrical and Electronics Engineers |
Publisher |
: |
Total Pages |
: |
Release |
: 2006 |
ISBN-10 |
: 1424402069 |
ISBN-13 |
: 9781424402069 |
Rating |
: 4/5 (69 Downloads) |
Synopsis Physical and Failure Analysis of Integrated Circuits, 2006. 13th International Symposium on the by : Institute of Electrical and Electronics Engineers
Author |
: Souvik Mahapatra |
Publisher |
: IEEE Computer Society Press |
Total Pages |
: 309 |
Release |
: 2007-01-01 |
ISBN-10 |
: 1424410142 |
ISBN-13 |
: 9781424410149 |
Rating |
: 4/5 (42 Downloads) |
Synopsis Proceedings of the 14th International Symposium on the Physical & Failure Analysis of Integrated Circuits by : Souvik Mahapatra
Author |
: Cher Ming Tan |
Publisher |
: Woodhead Publishing |
Total Pages |
: 190 |
Release |
: 2022-09-24 |
ISBN-10 |
: 9780128224076 |
ISBN-13 |
: 012822407X |
Rating |
: 4/5 (76 Downloads) |
Synopsis Reliability and Failure Analysis of High-Power LED Packaging by : Cher Ming Tan
Reliability and Failure Analysis of High-Power LED Packaging provides fundamental understanding of the reliability and failure analysis of materials for high-power LED packaging, with the ultimate goal of enabling new packaging materials. This book describes the limitations of the present reliability standards in determining the lifetime of high-power LEDs due to the lack of deep understanding of the packaging materials and their interaction with each other. Many new failure mechanisms are investigated and presented with consideration of the different stresses imposed by varying environmental conditions. The detailed failure mechanisms are unique to this book and will provide insights for readers regarding the possible failure mechanisms in high-power LEDs. The authors also show the importance of simulation in understanding the hidden failure mechanisms in LEDs. Along with simulation, the use of various destructive and non-destructive tools such as C-SAM, SEM, FTIR, Optical Microscopy, etc. in investigation of the causes of LED failures are reviewed. The advancement of LEDs in the last two decades has opened vast new applications for LEDs which also has led to harsher stress conditions for high-power LEDs. Thus, existing standards and reliability tests need to be revised to meet the new demands for high-power LEDs. - Introduces the failure mechanisms of high-power LEDs under varying environmental conditions and methods of how to test, simulate, and predict them - Describes the chemistry underlying the material degradation and its impact on LEDs - Discusses future directions of new packaging materials for improved performance and reliability of high-power LEDs
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: |
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: |
Total Pages |
: |
Release |
: 2002 |
ISBN-10 |
: OCLC:423948832 |
ISBN-13 |
: |
Rating |
: 4/5 (32 Downloads) |
Synopsis Proceedings of the 2001 8th International Symposium on the Physical & Failure Analysis of Integrated Circuits by :