This is the first book to provide an in-depth presentation of photosensitive polyimides for electronic and photonic applications. The authors are leading specialists in this field from Japan, Europe and the U.S. From the Preface Aromatic polyimides were developed originally as thermostable flexible polymer films for space applications. Now polyimides have found widespread use in the manufacture of electronic devices and have been employed in increasingly diverse areas of electronics and information technology. In addition to their excellent thermal stability and high processability, a wide range of chemical and physical properties provided by molecular engineering makes polyimides highly versatile in the electronics and information industries. Lithography of polyimides is an inevitable process in using polyimides for microelectronic fields, and hence increasing research has been devoted to developing photosensitive polyimides, which make it unnecessary to use photoresists for patterning polyimides and diminishing markedly the number of steps in fabrication of various electronic devices. In addition, the development of technology of photosensitive polyimides is expected to play a great role in manufacturing photonic devices in the near future, when the design and control of hyper fine structures . . . including higher thermal stability and better processability would be essential.

Provides coverage on the full range of topics associated with polyimides, including structure, polymer fundamentals, and product areas. The text addresses both basic and applied aspects of the subject. It details the synthesis of polyimides, polyamideimides, and flourinated polyimides, explains the molecular design of photosensitive polyimides, and more.

This is the first book to provide an in-depth presentation of photosensitive polyimides for electronic and photonic applications. The authors are leading specialists in this field from Japan, Europe and the U.S. From the Preface Aromatic polyimides were developed originally as thermostable flexible polymer films for space applications. Now polyimides have found widespread use in the manufacture of electronic devices and have been employed in increasingly diverse areas of electronics and information technology. In addition to their excellent thermal stability and high processability, a wide range of chemical and physical properties provided by molecular engineering makes polyimides highly versatile in the electronics and information industries. Lithography of polyimides is an inevitable process in using polyimides for microelectronic fields, and hence increasing research has been devoted to developing photosensitive polyimides, which make it unnecessary to use photoresists for patterning polyimides and diminishing markedly the number of steps in fabrication of various electronic devices. In addition, the development of technology of photosensitive polyimides is expected to play a great role in manufacturing photonic devices in the near future, when the design and control of hyper fine structures . . . including higher thermal stability and better processability would be essential.

The last twenty years or so have seen a flurry of activity in the synthesis of new polymer systems. This interest has developed largely as a result of the increased need for advanced materials. Despite the emergence of a number of outstanding polymers, it is the polyimides that have captured the imagination of scientists and engineers alike as materials that offer outstanding promise for the high technology applic ations of the future. The reputation of the polyimide has been established on the bases of outstanding thermal stability, excellent mechanical properties and the ability to be fabricated into useful articles. Polyimides offer a versatility unparalleled in most other classes of macromolecules. Polymers can be prepared from a variety of starting materials, by a variety of synthetic routes. They can be tailor-made to suit specific applications. By judicious choice of starting materials, polymers can be made that offer variations in such properties as glass transition tempera ture, oxidative stability, toughness, adhesion, and permeability. It is this versatility that has led to the use of polyimides in a wide variety of applications. The electronics industry makes extensive use of poly imide films in, ior example, semiconductor applications. The leading polymer matrices for high temperature advanced composites are polyimides. High temperature adhesive systems for the bonding of metals or composites are often based on polyimides. In addition, polyimides are now finding use as fibres, foams, sealents and even membranes for the low energy separation of industrial gases.

Polyimides are a new generation of polymers that exhibit excellent mechanical, thermal, chemical, and electrical properties. Hence, they are highly reliable with little change in physical properties over a long time. They are currently used for practical applications in aerospace, energy, automotive, and electronics industries. This book presents a comprehensive overview of polyimides, including their properties, synthesis, and applications, as well as future research directions and challenges.

Advanced Polyimide Materials: Synthesis, Characterization and Applications summarizes and reviews recent research and developments on several key PI materials. A wide array of PI materials are included, including high performance PI films for microelectronic fabrication and packaging, display and space applications, fiber-reinforced PI composites for structural applications in aerospace and aviation industries, and PI photoresists for integrated circuit packaging. The chemical features of PI are also described, including semi-alicyclic PIs, fluorinated PIs, phosphorous-containing PIs, silicon-containing PIs and other new varieties, providing a comprehensive overview on PI materials while also summarizing the latest research. The book serves as a valuable reference book for engineers and students working on polymer materials, microelectronics manufacturing and packaging in industries such as aerospace and aviation. - Reviews the latest research, development and future prospective of polyimides - Describes the progress made in the research on polyimide materials, including polyimide films, matrices for carbon fiber composites, coatings for microelectronics and display devices, forms and fibers - Presents a highly organized work that is composed of different sections that are easily compared

This final volume in the Handbook of Engineering and Speciality Thermoplastics covers Nylons and details the developments of the last decade with respect to their polymerization, properties, synthesis, and applications. Volume 4 on Nylons is a unique compilation and covers many of the recent technical research accomplishments in the area of engineering polymers, such as nitrogen containing main chain polymers (Nylons). The book emphasizes the various aspects of preparation, structure, processing, morphology, properties and applications of engineering polymers. Recent advances in the development and characterization of multi component polymer blends and composites (maco, micro and nano) based on engineering polymers are also be discussed in detail. It covers an up-to-date record on the major findings and observations in the field. This state-of-the-art volume: Has chapters on Polyamide Imides, Polyphthalamides, Polyetherimides, Aromatic Polyamides, Polyanilines, Polyimides Comprehensive in an encyclopaedic fashion and includes material published in journals, books, conference proceedings, as well as the patent literature It serves as a "one stop" reference resource for recent important research accomplishments in this area The authors represent some of the best industry and academic researchers around the globe. Researchers, scientists, engineers and students in the field of polymer science, polymer technology, and materials science will benefit from reading this book. As it is highly applications oriented, the book will help the user to find solutions to both fundamental and applied problems.

The object of this book is to review and to discuss some important applications of polymers in electronics. The first three chapters discuss the current primary applications of polymers in semiconductor device manufacturing: polymers as resist materials for integrated circuit fabrication, polyimides as electronics packaging materials, and polymers as integrated circuits encapsulates.