Advanced Polyimide Materials: Synthesis, Characterization and Applications summarizes and reviews recent research and developments on several key PI materials. A wide array of PI materials are included, including high performance PI films for microelectronic fabrication and packaging, display and space applications, fiber-reinforced PI composites for structural applications in aerospace and aviation industries, and PI photoresists for integrated circuit packaging. The chemical features of PI are also described, including semi-alicyclic PIs, fluorinated PIs, phosphorous-containing PIs, silicon-containing PIs and other new varieties, providing a comprehensive overview on PI materials while also summarizing the latest research. The book serves as a valuable reference book for engineers and students working on polymer materials, microelectronics manufacturing and packaging in industries such as aerospace and aviation. - Reviews the latest research, development and future prospective of polyimides - Describes the progress made in the research on polyimide materials, including polyimide films, matrices for carbon fiber composites, coatings for microelectronics and display devices, forms and fibers - Presents a highly organized work that is composed of different sections that are easily compared

With contributions by numerous exeperts

These new volumes of Advances in Polymer Science inform the reader on a broad variety of topics in the field of synthesis, characterization and application of polyimides. They describe and discuss results of recent fundamental research and applied research and focus on topics such as new synthetic methods, thermostable nanofoams, insulating wire enamels, thermosetting resins and liquid-crystalline polyimides.

This volume chronicles the proceedings of the Third International Symposium on Polyimides and Other High Temperature Polymers: Synthesis, Characterization, and Applications, held in Orlando, December 17-19, 2003. This volume is divided into three parts. Part 1. “Synthesis, Properties and Bulk Characterization”; Part 2 “Hybrids and Composites” and Part 3 “Applications and General Papers”. The topics covered include: Synthesis, characterization and processing (including some novel approaches) of a variety of polyimides and other high temperature polymers; structure-property relationships; hybrids and nanocomposites using these materials and their characterization, properties and applications; segmental dynamics in polyimide materials; photoalignable polyimides; photoconductivity and photosensitivity of polyimides; ultrafiltration membranes from polyetherimide; polyimide as a tunneling barrier; polymer materials for nonlinear optical applications; alignment of SWNTs in rigid-rod polymer compositions; surface modification of polyimide; adhesion of Cu to polyimide surfaces; and polyimide erosion in a low Earth orbit space environment.

Polyimide is one of the most efficient polymers in many industries for its excellent thermal, electrical, mechanical, and chemical properties as well as its easy processability. In the electronic and electrical engineering industries, polyimide has widely been used for decades thanks to its very good dielectric and insulating properties at the high electric field and at high temperatures of around 200°C in long term-service. Moreover, polyimide appears essential for the development of new electronic devices where further considerations such as high power density, integration, higher temperature, thermal conduction management, energy storage, reliability, or flexibility are required in order to sustain the growing global electrical energy consumption. This book gathers interdisciplinary chapters on polyimide in various topics through state-of-the-art and original ongoing research.

This is a first attempt to provide a general analysis of developments in polyimide membrane synthesis and applications. It will serve as a valuable reference for those with an interest in synthesis of polyimides, the chemistry and physical chemistry of polyimide compounds, the separation properties of membranes and in their preparation and application. It is intended as a summary of the current status of polyimide membrane research for the specialist as well as a teaching aid for graduate studies in polymer chemistry. The authors collaboration demonstrates the high level of scientific research in Russia and the active development of applied research in Japan.

The feature of polyimides and other heterocyclic polymers are now well-established and used for long term temperature durability in the range of 250 - 350'C. This book will review synthesis, mechanisms, ultimate properties, physico-chemical properties, processing and applications of such high performance materials needed in advanced technologies. It presents interdisciplinary papers on the state of knowledge of each topic under consideration through a combination of overviews and original unpublished research. The volume contains eleven chapters divided into three sections: Chemistry; Chemical and Physical Properties; and Applications.

Summarizes the results published so far in the literature as an introduction to the third volume of the series, which will focus on the applications of heterocyclic polymers in the electronics industry. Considers the chemistry and applications of polyphenylquinoxalines and polymides, both of which have been used to make high-performance adhesives, composites, coatings, films, fibers, and foams that are now commercially available. Primarily a reference for materials scientists, polymer chemists, manufacturers of electronic components, and process engineers, but also potentially a textbook. Distributed in the US by Enfield Publishing and Distribution. Annotation copyrighted by Book News, Inc., Portland, OR

High Temperature Polymer Dielectrics Overview on how to achieve polymer dielectrics at high temperatures, with emphasis on diverse applications in various electrical insulation fields High Temperature Polymer Dielectrics: Fundamentals and Applications in Power Equipment systematically describes the latest research progress surrounding high-temperature polymer dielectric (HTPD) materials and their applications in electrical insulation fields such as high-temperature energy storage capacitors, motors, packaging, printed circuit board, new energy power equipment, and aerospace electrical equipment. The comprehensive text provides a description of the market demand and theoretical research value of HTPDs in electrical equipment and enables readers to improve the performance and design of existing HTPD materials, and to develop efficient new high temperature polymer dielectric materials in general. Specific sample topics covered in High Temperature Polymer Dielectrics include: Thermal and electrical properties of high-temperature polymers, and the excellent thermal stability, mechanical properties, and long service life of polymer dielectrics Why fluorinated polymers are more thermally stable than their corresponding hydrogen-substituted polymers Static Thermomechanical Analysis (TMA), a technique for measuring the functional relationship between the deformation of the materials and the temperature and time under different actions Polyetheretherketone (PEEK), a semi-crystalline polymer material with ether bonds and ketone carbonyl groups in molecular chains Providing a complete overview of the state-of-the-art high temperature polymer dielectrics, with a focus on fundamental background and recent advances, High Temperature Polymer Dielectrics is an essential resource for materials scientists, electrical engineers, polymer chemists, physicists, and professionals working in the chemical industry as a whole.