Substrate stabilized metastable single crystal germanium (1-x) stannide (x) films can be grown by molecular beam epitaxy (MBE). We have grown for the first time single crystal Ge (1-x) Sn(x) alloys on lattice matched gallium antimonide (with x=0.5) and indium phosphides substrates up to a thickness of 0.3 micrometer. Reflection high energy electron diffraction (RHEED) observations and x-ray measurements show that even at very small lattice mismatch, single crystal Ge(1-x)Sn(x) films cannot be grown thicker than 0.3 micrometer. Our x-ray results suggest that the critical thickness of alpha-Sn and Ge(1-x)Sn(x) single crystal films is mainly determined by a phase transition mechanism, and the dislocation generation equivalent critical thickness is an overestimate. Under practical MBE growth conditions, it is very difficult to grow thick films, due to the sensitivity of the critical thickness to composition fluctuations. We have shown that even under an exact lattice match between substrate and film, the critical film thickness is limited. Keywords: Metastable alloys; Single crystals; Germanium; Antimony; X-Ray diffraction; Aluminum; Gallium; Tin; Surface structure; Infrared detectors. (jg).

Epitaxial Ni-Mn-Ga thin films have attracted considerable attention, since they are promising candidates for magnetic sensors and actuators in micro-electro-mechanical systems. Comprehensive information on the microstructural and crystallographic features of the NiMnGa films and their relationship with the constraints of the substrate is essential for further property optimization. In the present work, epitaxial Ni-Mn-Ga thin films were produced by DC magnetron sputtering and then characterized by x-ray diffraction technique (XRD) and backscatter electron diffraction equipped in scanning electron microscope (SEM-EBSD). Epitaxial NiMnGa thin films with nominal composition of Ni50Mn30Ga20 and thickness of 1.5 μm were successfully fabricated on MgO monocrystalline substrate by DC magnetron sputtering, after the optimization of sputtering parameters such as sputtering power, substrate temperature and seed layer by the present work. XRD diffraction measurements demonstrate that the epitaxial NiMnGa thin films are composed of three phases: austenite, NM martensite and 7M martensite. With the optimized measurement geometries, maximum number of diffraction peaks of the concerning phases, especially of the low symmetrical 7M martensite, are acquired and analyzed. The lattice constants of all the three phases under the constraints of the substrate in the films are fully determined. These serve as prerequisites for the subsequent EBSD crystallographic orientation characterizations. SEM-EBSD in film depth analyses further verified the co-existence situation of the three constituent phases: austenite, 7M martensite and NM martensite. NM martensite is located near the free surface of the film, austenite above the substrate surface, and 7M martensite in the intermediate layers between austenite and NM martensite. Microstructure characterization shows that both the 7M martensite and NM martensite are of plate morphology and organized into two characteristic zones featured with low and high relative second electron image contrast. Local martensite plates with similar plate morphology orientation are organized into plate groups or groups or variant colonies. Further EBSD characterization indicates that there are four distinct martensite plates in each variant groups for both NM and 7M martensite. Each NM martensite plate is composed of paired major and minor lamellar variants in terms of their thicknesses having a coherent interlamellar interface, whereas, each 7M martensite plate contains one orientation variant. Thus, there are four orientation 7M martensite variants and eight orientation NM martensite variants in one variant group. According to the crystallographic orientation of martensites and the crystallographic calculation, for NM martensite, the inter-plate interfaces are composed of compound twins in adjacent NM plates. The symmetrically distribution of compound twins results in the long and straight plate interfaces in the low relative contrast zone. The asymmetrically distribution leads to the change of inter-plate interface orientation in the high relative contrast zone. For 7M martensite, both Type-I and Type-II twin interfaces are nearly perpendicular to the substrate surface in the low relative contrast zones. The Type-I twin pairs appear with much higher frequency, as compared with that of the Type-II twin pairs. However, there are two Type-II twin interface trace orientations and one Type-I twin interface trace orientation in the high relative contrast zones. The Type-II twin pairs are more frequent than the Type-I twin pairs. The inconsistent occurrences of the different types of twins in different zones are originated from the substrate constrain. The crystallographic calculation also indicates that the martensitic transformation sequence is from Austenite to 7M martensite and then transform into NM martensite (A→7M→NM). [...].

This work represents the account of a NATO Advanced Research Workshop on "Thin Film Growth Techniques for Low Dimensional Structures", held at the University of Sussex, Brighton, England from 15-19 Sept. 1986. The objective of the workshop was to review the problems of the growth and characterisation of thin semiconductor and metal layers. Recent advances in deposition techniques have made it possible to design new material which is based on ultra-thin layers and this is now posing challenges for scientists, technologists and engineers in the assessment and utilisation of such new material. Molecular beam epitaxy (MBE) has become well established as a method for growing thin single crystal layers of semiconductors. Until recently, MBE was confined to the growth of III-V compounds and alloys, but now it is being used for group IV semiconductors and II-VI compounds. Examples of such work are given in this volume. MBE has one major advantage over other crystal growth techniques in that the structure of the growing layer can be continuously monitored using reflection high energy electron diffraction (RHEED). This technique has offered a rare bonus in that the time dependent intensity variations of RHEED can be used to determine growth rates and alloy composition rather precisely. Indeed, a great deal of new information about the kinetics of crystal growth from the vapour phase is beginning to emerge.

Proceedings of the NATO Advanced Research Workshop, held in Dasia, Corfu, Greece, June 25-30, 2001

Faculties, publications and doctoral theses in departments or divisions of chemistry, chemical engineering, biochemistry and pharmaceutical and/or medicinal chemistry at universities in the United States and Canada.

The book considers the main growth-related phenomena occurring during epitaxial growth, such as thermal etching, doping, segregation of the main elements and impurities, coexistence of several phases at the crystal surface and segregation-enhanced diffusion. It is complete with tables, graphs and figures, which allow fast determination of suitable growth parameters for practical applications.

Newly developed semiconductor microstructures can now guide light and electrons resulting in important consequences for state-of-the-art electronic and photonic devices. This volume introduces a new generation of epitaxial microstructures. Special emphasis has been given to atomic control during growth and the interrelationship between the atomic arrangements and the properties of the structures. - Atomic-level control of semiconductor microstructures - Molecular beam epitaxy, metal-organic chemical vapor deposition - Quantum wells and quantum wires - Lasers, photon(IR)detectors, heterostructure transistors