Lapping and polishing are currently the most precise surface finishing processes for mechanical and electronic components. Unfortunately, most improvements in either methods or understanding of the physical processes involved are closely guarded as proprietary information. The Handbook of Lapping and Polishing is the first source in English to brin

Handbook of Ceramics Grinding and Polishing meets the growing need in manufacturing industries for a clear understanding of the latest techniques in ceramics processing. The properties of ceramics make them very useful as components—they withstand high temperatures and are durable, resistant to wear, chemical degradation, and light. In recent years the use of ceramics has been expanding, with applications in most industry sectors that use machined parts, especially where corrosion-resistance is required, and in high temperature environments. However, they are challenging to produce and their use in high-precision manufacturing often requires adjustments to be made at the micro and nano scale. This book helps ceramics component producers to do cost-effective, highly precise machining. It provides a thorough grounding in the fundamentals of ceramics—their properties and characteristics—and of the abrasive processes used to manipulate their final shape as well as the test procedures vital for success. The second edition has been updated throughout, with the latest developments in technologies, techniques, and materials. The practical nature of the book has also been enhanced; numerous case studies illustrating how manufacturing (machining) problems have been handled are complemented by a highly practical new chapter on the selection and efficient use of machine tools. - Provides readers with experience-based insights into complex and expensive processes, leading to improved quality control, lower failure rates, and cost savings - Covers the fundamentals of ceramics side-by-side with processing issues and machinery selection, making this book an invaluable guide for downstream sectors evaluating the use of ceramics, as well as those involved in the manufacturing of structural ceramics - Numerous case studies from a wide range of applications (automotive, aerospace, electronics, medical devices)

Focusing on the machining of ceramic materials such as silicon nitride, silicon carbide, and zirconia, this handbook meets the growing need in industry for a clear understanding of modern improvements in ceramic processing. The presentation is international in scope, with techniques and information represented from the USA, Japan, Germany, and the United Kingdomùcountries that have made important contributions to the field. The 20 expert chapter authors explore the challenge of reducing the costs of machining operations, a continuing problem in an industry where ceramic parts must be machined into final form to achieve a proper fit. The handbook reveals that the abrasive machining of ceramic materials will always be a requirement because of the difficulty of controlling parts dimensions at the high temperatures required in their creation. The contributors then explain the properties and characteristics of ceramics, the various types of abrasive processes, and typical tests used in the procedures. An entire section of the handbook concerns grinding tools, their conditioning, lubrication, and cooling, checking for wear on the tools, and using them efficiently. The book also examines modern honing and superfinishing tools and machines, and describes advances in the technology, as well as lapping and polishing techniques using chemical compounds and ultrasound.Ceramics is a field where more advanced products are sure to appear. Many of the products will require advanced, better-controlled processing technologies; vastly improved productivity in manufacturing; and increased product reliability. The contributors to this Handbook will assist readers in the attainment of these important goals.

Reflecting the life-long dedication of an unsurpassed team of experts from industry and academia, the Handbook of Advanced Ceramics Machining explores the latest developments in our understanding of the mechanisms of ceramics machining as well as state-of-the-art technologies. Covering methods that offer high-rate material removal and others that provide extremely high-quality surface finish, this book examines conventional, new, and lesser-known methods including ductile grinding, belt centerless grinding, lapping, polishing, double-side grinding, laser-assisted grinding, ultrasonic machining, and the new electrolytic in-process dressing (ELID) grinding method.

Presents a general overview of the grinding, lapping, honing and polishing of metal, as well as the materials used to make grinding wheels, belts and papers. This volume describes the uses of various machines and grinding mediums, including the off-hand grinder, modern miniature hand drill/grinders and toolpost grinders.

A two-volume reference set for all ceramicists, both in research and working in industry The only definitive reference covering the entire field of advanced ceramics from fundamental science and processing to application Contributions from over 50 leading researchers from around the world This new Handbook will be an essential resource for ceramicists. It includes contributions from leading researchers around the world, and includes sections on: Basic Science of Advanced Ceramic, Functional Ceramics (electro-ceramics and optoelectro-ceramics) and engineering ceramics.Contributions from over 50 leading researchers from around the world

Grinding offers capabilities that range from high-rate material removal to high-precision superfinishing, and has become one of the most widely used industrial machining and surface finishing operations. Reflecting modern developments in the science and practice of modern grinding processes, the Handbook of Machining with Grinding Wheels presents a

CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field - making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience. Building on the fundamentals of tribology - the science of friction, wear and lubrication - the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries. Demystifies scientific developments and technological innovations, opening them up for new applications and process improvements in the semiconductor industry and other areas of precision engineering Explores stock removal mechanisms in CMP and polishing, and the challenges involved in predicting the outcomes of abrasive processes in high-precision environments The authors bring together the latest innovations and research from the USA and Japan

Presenting modern advances in the machining of ceramics and composites, this work offers broadly based, fundamental information for selecting the appropriate machining processes and parameters, developing successful manufacturing strategies, and designing novel machining systems. It focuses on scientific and engineering developments affecting the present and future of machining processes.

Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.