Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.

This book provides the most comprehensive and in-depth coverage of the latest circuit design developments in RF CMOS technology. It is a practical and cutting-edge guide, packed with proven circuit techniques and innovative design methodologies for solving challenging problems associated with RF integrated circuits and systems. This invaluable resource features a collection of the finest design practices that may soon drive the system-on-chip revolution. Using this book's state-of-the-art design techniques, one can apply existing technologies in novel ways and to create new circuit designs for the future.

This book presents materials fundamentals of novel gate dielectrics that are being introduced into semiconductor manufacturing to ensure the continuous scalling of the CMOS devices. This is a very fast evolving field of research so we choose to focus on the basic understanding of the structure, thermodunamics, and electronic properties of these materials that determine their performance in device applications. Most of these materials are transition metal oxides. Ironically, the d-orbitals responsible for the high dielectric constant cause sever integration difficulties thus intrinsically limiting high-k dielectrics. Though new in the electronics industry many of these materials are wel known in the field of ceramics, and we describe this unique connection. The complexity of the structure-property relations in TM oxides makes the use of the state of the art first-principles calculations necessary. Several chapters give a detailed description of the modern theory of polarization, and heterojunction band discontinuity within the framework of the density functional theory. Experimental methods include oxide melt solution calorimetry and differential scanning calorimetry, Raman scattering and other optical characterization techniques, transmission electron microscopy, and x-ray photoelectron spectroscopy. Many of the problems encounterd in the world of CMOS are also relvant for other semiconductors such as GaAs. A comprehensive review of recent developments in this field is thus also given. The book should be of interest to those actively engaged in the gate dielectric research, and to graduate students in Materials Science, Materials Physics, Materials Chemistry, and Electrical Engineering.

This book contains chapters on cutting-edge developments presented at the TMS annual conference of 2012.

Dynamic and Robust Streaming in and between Connected Consumer-Electronic Devices addresses a subject that is becoming more important over the years. On the one hand the arrival of home networks is imminent, and on the other hand we notice that chips integrate more and more functionality. The home network interconnects the Consumer Electronic (CE) devices in the home, and the individual CE-devices incorporate the chips to realize a ubiquitous streaming of video streams over this network. This book provides a comprehensive overview of the challenges that face us. The book shows that there are many similarities between traditional networking and networks in the chip. However, there are some different operational conditions that lead to original solutions. Dynamic and Robust Streaming in and between Connected Consumer-Electronic Devices focuses on the robustness aspects of the chosen technologies in the area of video streaming. Management of resources such as memory, bandwidth, CPU cycles, bus–cycles is an aspect that is prominent in many of the sections.

This book (CCIS 839) constitutes the refereed proceedings of the First International Conference on Communication, Networks and Computings, CNC 2018, held in Gwalior, India, in March 2018. The 70 full papers were carefully reviewed and selected from 182 submissions. The papers are organized in topical sections on wired and wireless communication systems, high dimensional data representation and processing, networks and information security, computing techniques for efficient networks design, electronic circuits for communication system.