Understand how and why the separation between layers and tiers in service-oriented architectures holds software developers back from being truly productive, and how you can remedy that problem. Strong processes and development tools can help developers write more complex software, but large amounts of code can still be directly deduced from the underlying database model, hampering developer productivity. In a world with a shortage of developers, this is bad news. More code also increases maintenance costs and the risk of bugs, meaning less time is spent improving the quality of systems. You will learn that by making relationships first-class citizens within an item/relationship model, you can develop an extremely compact query language, inspired by natural language. You will also learn how this model can serve as both a database schema and an object model upon which to build business logic. Implicit services free you from writing code for standard read/write operations, while still supporting fine-grained authorization. Vertically Integrated Architectures explains how functional schema mappings can solve database migrations and service versioning at the same time, and how all this can support any client, from free-format to fully vertically integrated types. Unleash the potential and use VIA to drastically increase developer productivity and quality. What You'll Learn See how the separation between application server and database in a SOA-based architecture might be justifiable from a historical perspective, but can also hold us back Examine how the vertical integration of application logic and database functionality can drastically increase developer productivity and quality Review why application developers only need to write pure business logic if an architecture takes care of basic read/write client-server communication and data persistenceUnderstand why a set-oriented and persistence-aware programming language would not only make it easier to build applications, but would also enable the fully optimized execution of incoming service requests Who This Book Is For Software architects, senior software developers, computer science professionals and students, and the open source community.

Presents an analysis of the business model unique to Japanese firms, emphasising four special features: the vertical value chain model, cross-industry collaboration, dynamic knowledge integration, and strategic innovation capability. This book also emphasises on inter- and intra-organizational collaboration as a source of strategic innovation.

Exploring the theoretical concept of collaborative dynamic capabilities, this book illustrates how service innovation can be achieved in an era of technological convergence. Focusing on e-healthcare systems within hospitals and private businesses, the author provides detailed case studies and answers topical questions about generating service innovation across different industries. Making a new and thought-provoking contribution to research on innovation and technology management, this useful book engages with theory and provides applicable solutions for practitioners to implement in the future.

A detailed examination of how the underlying technical structure of the Internet affects the economic environment for innovation and the implications for public policy. Today—following housing bubbles, bank collapses, and high unemployment—the Internet remains the most reliable mechanism for fostering innovation and creating new wealth. The Internet's remarkable growth has been fueled by innovation. In this pathbreaking book, Barbara van Schewick argues that this explosion of innovation is not an accident, but a consequence of the Internet's architecture—a consequence of technical choices regarding the Internet's inner structure that were made early in its history. The Internet's original architecture was based on four design principles: modularity, layering, and two versions of the celebrated but often misunderstood end-to-end arguments. But today, the Internet's architecture is changing in ways that deviate from the Internet's original design principles, removing the features that have fostered innovation and threatening the Internet's ability to spur economic growth, to improve democratic discourse, and to provide a decentralized environment for social and cultural interaction in which anyone can participate. If no one intervenes, network providers' interests will drive networks further away from the original design principles. If the Internet's value for society is to be preserved, van Schewick argues, policymakers will have to intervene and protect the features that were at the core of the Internet's success.

Integrated Design and Delivery Solutions (IDDS) represent a significant new research trajectory in the integration of architecture and construction through the rapid adoption of new processes. This book examines the ways in which collaboration and new methods of contracting and procurement enhance skills and improve processes in terms of lean and sustainable construction. Based on high quality research and practice-based examples that provide key insights into IDDS and its future potential, this book surveys the technologies that are being employed to create more sustainable buildings with added value for clients, stakeholders and society as whole.

Illustrating the interdisciplinary implications for research on creativity development, this book focuses on the new concept of ‘knowledge differences’ that arise between people, organizations and various phenomena. It describes how these key differences create boundaries knowledge, a dynamic process that accelerates innovation.

WelcometotheproceedingsofPATMOS2004,thefourteenthinaseriesofint- national workshops. PATMOS 2004 was organized by the University of Patras with technical co-sponsorship from the IEEE Circuits and Systems Society. Over the years, the PATMOS meeting has evolved into an important - ropean event, where industry and academia meet to discuss power and timing aspects in modern integrated circuit and system design. PATMOS provides a forum for researchers to discuss and investigate the emerging challenges in - sign methodologies and tools required to develop the upcoming generations of integrated circuits and systems. We realized this vision this year by providing a technical program that contained state-of-the-art technical contributions, a keynote speech, three invited talks and two embedded tutorials. The technical program focused on timing, performance and power consumption, as well as architectural aspects, with particular emphasis on modelling, design, charac- rization, analysis and optimization in the nanometer era. This year a record 152 contributions were received to be considered for p- sible presentation at PATMOS. Despite the choice for an intense three-day m- ting, only 51 lecture papers and 34 poster papers could be accommodated in the single-track technical program. The Technical Program Committee, with the - sistance of additional expert reviewers, selected the 85 papers to be presented at PATMOS and organized them into 13 technical sessions. As was the case with the PATMOS workshops, the review process was anonymous, full papers were required, and several reviews were received per manuscript.

Ebook: Managerial Economics and Organizational Architecture

Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: - Manufacturing techniques for 3-D ICs with TSVs - Electrical modeling and closed-form expressions of through silicon vias - Substrate noise coupling in heterogeneous 3-D ICs - Design of 3-D ICs with inductive links - Synchronization in 3-D ICs - Variation effects on 3-D ICs - Correlation of WID variations for intra-tier buffers and wires - Offers practical guidance on designing 3-D heterogeneous systems - Provides power delivery of 3-D ICs - Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more - Provides experimental case studies in power delivery, synchronization, and thermal characterization