The Handbook of Organic Compounds: NIR, IR, Raman, and UV-Vis Spectra Featuring Polymers and Surfactants represents a compendium of practical spectroscopic methodology, comprehensive reviews, and basic information for organic materials, surfactants, and polymer spectra covering the Ultraviolet, Visible, Near Infrared, Infrared, Raman and Dielectric measurement techniques. This set represents a complementary organic compound handbook to the Nyquist inorganic handbook, published in 1996. This set comprises the first comprehensive multi-volume handbook to provide basic coverage for UV-Vis, 4th overtone NIR, 3rd overtone NIR, NIR, Infrared, Raman spectra, and Dielectric data for common organic compounds, polymers, surfactants, contaminants, and inorganic materials commonly encountered in the laboratory. The text includes a description and reviews of interpretive and chemometric techniques used for spectral data analysis. The spectra included within the atlas are useful for identification purposes as well as pedagogical for the instruction of the various interpretive and data processing methods discussed. This work is designed to be of help to students and vibrational spectroscopists in their efforts of daily spectral interpretation and data processing of organic spectra, polymers, and surfactants. All spectra are presented in wavenumber and transmittance, with the addition of ultraviolet, visible, 4th overtone NIR, 3rd overtone NIR, and NIR spectra also represented in nanometers and absorbance space. In addition, some Horizontal infrared ATR spectra are presented in wavenumber and absorbance space. All spectra are shown with essential peaks labeled in their respective units. The material in this handbook was contributed to by several individuals, and comments were received from a variety of prominent workers in the field of molecular spectroscopy. This type of handbookproject is a daunting task. This Handbook can provide a valuable reference for the daily activities of students and professionals working in modern molecular spectroscopy laboratories. * Indices for UV-Vis, fourth overtone NIR, third overtone NIR, NIR, IR, raman, and dielectric spectra* Unique detailed correlation charts for each of these spectral regions* Indices of spectra by alphabetical order, chemical class, and chemical formula* Cross referencing of common compounds for all spectral regions * Literature reviews of historical and most useful references in the field* Research oriented for those using molecular spectroscopy on a routine basis for interpretation, qualitative and quantitative analysis * An emphasis on near infrared and infrared spectral regions

The book includes fundamental concepts of theory, instrumentation, and experimental practice as well as practical applications. An important chapter setting the book apart from other publications describes the properties of materials and presents case studies from industry. In addition, a program called IRNDT accompanies the book and is available on the Wiley ftp site. The program includes an image bank that can be used to test the principles covered in the book. * All chapters end with summaries, problems, and questions. * Authored by an acknowledged expert in the field. * Material draws on case studies to illustrate major points.

This is the first book summarizing the theoretical basics of thermal nondestructive testing (TNDT) by combining elements of heat conduction, infrared thermography, and industrial nondestructive testing. The text contains the physical models of TNDT, heat transfer in defective and sound structures, and thermal properties of materials. Also included are the optimization of TNDT procedures, defect characterization, data processing in TNDT, active and passive TNDT systems, as well as elements of statistical data treatment and decision making. This text contains in-depth descriptions of applications in infrared/thermal testing within aerospace, power production, building, as well as the conservation of artistic monuments The book is intended for the industrial specialists who are involved in technical diagnostics and nondestructive testing. It may also be useful for academic researchers, undergraduate, graduate and PhD university students.

Acoustical imaging has become an indispensable tool in a variety of fields. Since its introduction, the applications have grown and cover a variety of techniques, producing significant results in fields as disparate as medicine and seismology. Cutting-edge trends continue to be discussed worldwide. This book contains the proceedings of the 27th International Symposium on Acoustical Imaging (AI27), which took place in Saarbrücken, Germany, from March 24th to March 27th 2003. The Symposium belongs to a conference series in existence since 1968. AI27 comprised sessions on: Medical Imaging, Non-Destructive Testing, Seismic Imaging, Physics and Mathematics of Acoustical Imaging, Acoustic Microscopy. During two well-attended workshops the applications of quantitative acoustical imaging in biology and medical applications, and in near-field imaging of materials, were discussed. Based on its cross-disciplinary aspects, the authors of the papers of AI27 present experiments, theory and construction of new instruments.

Demands for improvements in aerospace and automotive energy-efficiency, performance, corrosion resistance, body stiffness and style have increased the use of adhesive bonds to help meet those demands, by providing joining technology that accommodates a wider variety of materials and design options. However, the history of adhesive bond performance clearly indicates the need for a robust method of assuring the existence of the required consistent level of adhesive bond integrity in every bonded region. The Quality Assurance of Adhesive Bonds by Ultrasonic Nondestructive Testing technology put forth in this book meets that need by describing two new, complementary ultrasonic techniques for the evaluation of these bonds, and thus provide improvements over previous methods. The development of a 20 MHz pulse-echo method for nondestructive evaluation of adhesive bonds will accomplish the assessment of bond joints with adhesive as thin as 0.1 mm. This new method advances the state of the art by providing a high-resolution, phase-sensitive procedure that identifies the bond state at each interface of the adhesive with the substrate(s), by the acquisition and analysis of acoustic echoes reflected from interfaces between layers with large acoustic impedance mismatch. Because interface echo amplitudes are marginal when the acoustic impedance of the substrate is close to that of the adhesive, a 25 kHz Lamb wave technique was developed to be employed in such cases, albeit with reduced resolution. Modeling the ultrasonic echoes and Lamb-wave signals was accomplished using mathematical expressions developed from the physics of acoustic transmission, attenuation and reflection in layered media. The models were validated by experimental results from a variety of bond joint materials, geometries and conditions, thereby confirming the validity of the methodology used for extracting interpretations from the phase-sensitive indications, as well as identifying the range and limits of applications. Results from the application of both methodologies to laboratory specimens and to samples from production operations are reported herein, and show that bond-joint integrity can be evaluated effectively over the range of materials and geometries addressed.

Thorough explanation of heat transfer, with concepts supported by thermograms. Intended for all who work with thermal imaging systems: researchers, system designers, test engineers, sales staff, and military and civilian end users. Copublished with JCD Publishing.