Thermal Management for LED Applications provides state-of-the-art information on recent developments in thermal management as it relates to LEDs and LED-based systems and their applications. Coverage begins with an overview of the basics of thermal management including thermal design for LEDs, thermal characterization and testing of LEDs, and issues related to failure mechanisms and reliability and performance in harsh environments. Advances and recent developments in thermal management round out the book with discussions on advances in TIMs (thermal interface materials) for LED applications, advances in forced convection cooling of LEDs, and advances in heat sinks for LED assemblies.

Thermal Management for Opto-electronics Packaging and Applications A systematic guide to the theory, applications, and design of thermal management for LED packaging In Thermal Management for Opto-electronics Packaging and Applications, a team of distinguished engineers and researchers deliver an authoritative discussion of the fundamental theory and practical design required for LED product development. Readers will get a solid grounding in thermal management strategies and find up-to-date coverage of heat transfer fundamentals, thermal modeling, and thermal simulation and design. The authors explain cooling technologies and testing techniques that will help the reader evaluate device performance and accelerate the design and manufacturing cycle. In this all-inclusive guide to LED package thermal management, the book provides the latest advances in thermal engineering design and opto-electronic devices and systems. The book also includes: A thorough introduction to thermal conduction and solutions, including discussions of thermal resistance and high thermal conductivity materials Comprehensive explorations of thermal radiation and solutions, including angular- and spectra-regulation radiative cooling Practical discussions of thermally enhanced thermal interfacial materials (TIMs) Complete treatments of hybrid thermal management in downhole devices Perfect for engineers, researchers, and industry professionals in the fields of LED packaging and heat transfer, Thermal Management for Opto-electronics Packaging and Applications will also benefit advanced students focusing on the design of LED product design.

Comprehensive in scope, this book covers the latest progresses of theories, technologies and applications of LEDs based on III-V semiconductor materials, such as basic material physics, key device issues (homoepitaxy and heteroepitaxy of the materials on different substrates, quantum efficiency and novel structures, and more), packaging, and system integration. The authors describe the latest developments of LEDs with spectra coverage from ultra-violet (UV) to the entire visible light wavelength. The major aspects of LEDs, such as material growth, chip structure, packaging, and reliability are covered, as well as emerging and novel applications beyond the general and conventional lightings. This book, written by leading authorities in the field, is indispensable reading for researchers and students working with semiconductors, optoelectronics, and optics. Addresses novel LED applications such as LEDs for healthcare and wellbeing, horticulture, and animal breeding; Editor and chapter authors are global leading experts from the scientific and industry communities, and their latest research findings and achievements are included; Foreword by Hiroshi Amano, one of the 2014 winners of the Nobel Prize in Physics for his work on light-emitting diodes.

A systematic guide to the theory, applications, and design of thermal management for LED packaging In Thermal Management for Opto-electronics Packaging and Applications, a team of distinguished engineers and researchers deliver an authoritative discussion of the fundamental theory and practical design required for LED product development. Readers will get a solid grounding in thermal management strategies and find up-to-date coverage of heat transfer fundamentals, thermal modeling, and thermal simulation and design. The authors explain cooling technologies and testing techniques that will help the reader evaluate device performance and accelerate the design and manufacturing cycle. In this all-inclusive guide to LED package thermal management, the book provides the latest advances in thermal engineering design and opto-electronic devices and systems. The book also includes: A thorough introduction to thermal conduction and solutions, including discussions of thermal resistance and high thermal conductivity materials Comprehensive explorations of thermal radiation and solutions, including angular- and spectra-regulation radiative cooling Practical discussions of thermally enhanced thermal interfacial materials (TIMs) Complete treatments of hybrid thermal management in downhole devices Perfect for engineers, researchers, and industry professionals in the fields of LED packaging and heat transfer, Thermal Management for Opto-electronics Packaging and Applications will also benefit advanced students focusing on the design of LED product design.

The complete editorial contents of Qpedia Thermal eMagazine, Volume 2, Issues 1 - 12 features in-depth, technical articles on the most critical topics in the thermal management of electronics.

Technological developments in the area of high power LED light sources have enabled their utilization in general illumination applications. Along with this advancement comes the need for progressive thermal management strategies in order to ensure device performance and reliability. Minimizing an LED's junction temperature is done by minimizing the total system's thermal resistance. For actively cooled systems, this may essentially be achieved by simultaneously engineering the conduction through the heat sink and creating a well-designed flow pattern over suitable convective surface area. While such systems are routinely used in cooling microelectronics, their use in LED lighting systems encounter additional constraints which must be accounted for in the design of the cooling system. These are typically driven by the size, shape, and building codes involved with the lighting industry, and thus influence the design of drop-in replacement LED fixtures. Employing LED systems for customary down-lighting applications may require shrouded radial fin heat sinks to increase the heat transfer while reducing the space requirement for active cooling. Most lighting is already in some form of housing, and the ability to concurrently optimize these housings for thermal and optical performance could accelerate the widespread implementation of cost-efficient, environmentally-friendly solid-state lighting. In response, this research investigated the use of conical, cylindrical, square, and pyramidal shrouds with pin/radial fin heat sink designs for the thermal management of high power LED sources. Numerical simulations using FLUENT were executed in order to account for details of the air flow, pressure drop, and pumping power, as well as the heat transfer and temperature distributions throughout the system. The LEDs were modeled as a distributed heat source of 25 - 75 W on a central portion of the various heat sinks. Combinations of device junction temperature and pumping power were used to assess the performance of shrouded heat sink designs for their use in air-cooled, down-lighting LED fixtures.

Compared to traditional electrical filaments, arc lamps, and fluorescent lamps, solid-state lighting offers higher efficiency, reliability, and environmentally friendly technology. LED / solid-state lighting is poised to take over conventional lighting due to cost savings—there is pretty much no debate about this. In response to the recent activity in this field, Fundamentals of Solid-State Lighting: LEDs, OLEDs, and Their Applications in Illumination and Displays covers a range of solid-state devices, technologies, and materials used for lighting and displays. It also examines auxiliary but critical requirements of efficient applications, such as modeling, thermal management, reliability, and smart lighting. The book discusses performance metrics of LEDs such as efficiency, efficacy, current–voltage characteristics, optical parameters like spectral distribution, color temperature, and beam angle before moving on to luminescence theory, injection luminescence, radiative and non-radiative recombination mechanisms, recombination rates, carrier lifetimes, and related topics. This lays down the groundwork for understanding LED operation. The book then discusses energy gaps, light emission, semiconductor material, special equipment, and laboratory facilities. It also covers production and applications of high-brightness LEDs (HBLEDs) and organic LEDs (OLEDs). LEDs represent the landmark development in lighting since the invention of electric lighting, allowing us to create unique, low-energy lighting solutions, not to talk about their minor maintenance expenses. The rapid strides of LED lighting technology over the last few years have changed the dynamics of the global lighting market, and LEDs are expected to be the mainstream light source in the near future. In a nutshell, the book traces the advances in LEDs, OLEDs, and their applications, and presents an up-to-date and analytical perspective of the scenario for audiences of different backgrounds and interests.

Since the first light-emitting diode (LED) was invented by Holonyak and Bevacqua in 1962, LEDs have made remarkable progress in the past few decades with the rapid development of epitaxy growth, chip design and manufacture, packaging structure, processes, and packaging materials. LEDs have superior characteristics such as high efficiency, small size, long life, low power consumption, and high reliability. The market for white LED is growing rapidly in various applications. It has been widely accepted that white LEDs will be the fourth illumination source to substitute the incandescent, fluorescent, and high-pressure sodium lamps. With the development of LED chip and packaging technologies, the efficiency of high power white LED will broaden the application markets of LEDs while changing the lighting concepts of our lives. In LED Packaging for Lighting Applications, Professors Liu and Luo cover the full spectrum of design, manufacturing, and testing. Many concepts are proposed for the first time, and readers will benefit from the concurrent engineering and co-design approaches to advanced engineering design of LED products. One of the only books to cover LEDs from package design to manufacturing to testing Focuses on the design of LED packaging and its applications such as road lights Includes design methods and experiences necessary for LED engineers, especially optical and thermal design Introduces novel LED packaging structures and manufacturing processes, such as ASLP Covers reliability considerations, the most challenging problem for the LED industry Provides measurement and testing standards, which are critical for LED development, for both LED and LED fixtures Codes and demonstrations available from the book’s Companion Website This book is ideal for practicing engineers working in design or packaging at LED companies and graduate students preparing for work in industry. This book also provides a helpful introduction for advanced undergraduates, graduates, researchers, lighting designers, and product managers interested in the fundamentals of LED design and production. Color version of selected figures can be found at www.wiley.com/go/liu/led