This title introduces state-of-the-art design principles for SOI circuit design, and is primarily concerned with circuit-related issues. It considers SOI material in terms of implementation that is promising or has been used elsewhere in circuit development, with historical perspective where appropriate.

This book first introduces SOI device physics and its fundamental idiosyncrasies. It then walks the reader through realizations of these mechanisms, which are observed in common high-speed microprocessor designs. The book also offers rules of thumb and comparisons to conventional bulk CMOS to guide implementation and describes a number of unique circuit topologies that SOI supports.

The scaling of semiconductor devices from sub-micron to nanometer dimensions is driving the need for understanding the design of electrostatic discharge (ESD) circuits, and the response of these integrated circuits (IC) to ESD phenomena. ESD Circuits and Devices provides a clear insight into the layout and design of circuitry for protection against electrical overstress (EOS) and ESD. With an emphasis on examples, this text: explains ESD buffering, ballasting, current distribution, design segmentation, feedback, coupling, and de-coupling ESD design methods; outlines the fundamental analytical models and experimental results for the ESD design of MOSFETs and diode semiconductor device elements, with a focus on CMOS, silicon on insulator (SOI), and Silicon Germanium (SiGe) technology; focuses on the ESD design, optimization, integration and synthesis of these elements and concepts into ESD networks, as well as applying within the off-chip driver networks, and on-chip receivers; and highlights state-of-the-art ESD input circuits, as well as ESD power clamps networks. Continuing the author’s series of books on ESD, this book will be an invaluable reference for the professional semiconductor chip and system ESD engineer. Semiconductor device and process development, quality, reliability and failure analysis engineers will also find it an essential tool. In addition, both senior undergraduate and graduate students in microelectronics and IC design will find its numerous examples useful.

A practical and comprehensive reference that explores Electrostatic Discharge (ESD) in semiconductor components and electronic systems The ESD Handbook offers a comprehensive reference that explores topics relevant to ESD design in semiconductor components and explores ESD in various systems. Electrostatic discharge is a common problem in the semiconductor environment and this reference fills a gap in the literature by discussing ESD protection. Written by a noted expert on the topic, the text offers a topic-by-topic reference that includes illustrative figures, discussions, and drawings. The handbook covers a wide-range of topics including ESD in manufacturing (garments, wrist straps, and shoes); ESD Testing; ESD device physics; ESD semiconductor process effects; ESD failure mechanisms; ESD circuits in different technologies (CMOS, Bipolar, etc.); ESD circuit types (Pin, Power, Pin-to-Pin, etc.); and much more. In addition, the text includes a glossary, index, tables, illustrations, and a variety of case studies. Contains a well-organized reference that provides a quick review on a range of ESD topics Fills the gap in the current literature by providing information from purely scientific and physical aspects to practical applications Offers information in clear and accessible terms Written by the accomplished author of the popular ESD book series Written for technicians, operators, engineers, circuit designers, and failure analysis engineers, The ESD Handbook contains an accessible reference to ESD design and ESD systems.

This book first introduces SOI device physics and its fundamental idiosyncrasies. It then walks the reader through realizations of these mechanisms, which are observed in common high-speed microprocessor designs. The book also offers rules of thumb and comparisons to conventional bulk CMOS to guide implementation and describes a number of unique circuit topologies that SOI supports.

The 11 th IFIP International Conference on Very Large Scale Integration, in Montpellier, France, December 3-5,2001, was a great success. The main focus was about IP Cores, Circuits and System Designs & Applications as well as SOC Design Methods and CAD. This book contains the best papers (39 among 70) that have been presented during the conference. Those papers deal with all aspects of importance for the design of the current and future integrated systems. System on Chip (SOC) design is today a big challenge for designers, as a SOC may contain very different blocks, such as microcontrollers, DSPs, memories including embedded DRAM, analog, FPGA, RF front-ends for wireless communications and integrated sensors. The complete design of such chips, in very deep submicron technologies down to 0.13 mm, with several hundreds of millions of transistors, supplied at less than 1 Volt, is a very challenging task if design, verification, debug and industrial test are considered. The microelectronic revolution is fascinating; 55 years ago, in late 1947, the transistor was invented, and everybody knows that it was by William Shockley, John Bardeen and Walter H. Brattein, Bell Telephone Laboratories, which received the Nobel Prize in Physics in 1956. Probably, everybody thinks that it was recognized immediately as a major invention.

Circuits for Emerging Technologies Beyond CMOS New exciting opportunities are abounding in the field of body area networks, wireless communications, data networking, and optical imaging. In response to these developments, top-notch international experts in industry and academia present Circuits at the Nanoscale: Communications, Imaging, and Sensing. This volume, unique in both its scope and its focus, addresses the state-of-the-art in integrated circuit design in the context of emerging systems. A must for anyone serious about circuit design for future technologies, this book discusses emerging materials that can take system performance beyond standard CMOS. These include Silicon on Insulator (SOI), Silicon Germanium (SiGe), and Indium Phosphide (InP). Three-dimensional CMOS integration and co-integration with Microelectromechanical (MEMS) technology and radiation sensors are described as well. Topics in the book are divided into comprehensive sections on emerging design techniques, mixed-signal CMOS circuits, circuits for communications, and circuits for imaging and sensing. Dr. Krzysztof Iniewski is a director at CMOS Emerging Technologies, Inc., a consulting company in Vancouver, British Columbia. His current research interests are in VLSI ciruits for medical applications. He has published over 100 research papers in international journals and conferences, and he holds 18 international patents granted in the United States, Canada, France, Germany, and Japan. In this volume, he has assembled the contributions of over 60 world-reknown experts who are at the top of their field in the world of circuit design, advancing the bank of knowledge for all who work in this exciting and burgeoning area.

Complete and comprehensive manual for eliciting, defining, and managing needs and requirements, integration, verification, and validation across the lifecycle The INCOSE Needs and Requirements Manual presents product development and systems engineering practices, activities, and artifacts from the perspective of needs, requirements, verification, and validation across the system lifecycle. Composed of 16 chapters, this book provides practical guidance to help organizations understand the importance of lifecycle concepts, needs, requirements, verification, and validation activities, enabling them to successfully and effectively implement these activities during product development, systems engineering, and project management. The parent handbook published by Wiley, INCOSE Systems Engineering Handbook, divides the system lifecycle into a series of processes, with each process described in terms of a series of activities. This Manual provides more detail needed by practitioners to successfully implement these activities, with guidance and lessons learned from hundreds of years of collective experience of the authors, contributors, and reviewers. For example, while the Handbook mentions the need to define the problem statement, mission, goals, and objectives for a system, the Manual provides detailed guidance on doing so. Sample topics covered in the INCOSE Needs and Requirements Manual include: Defining the problem, opportunity, or threat and defining a mission statement, goals, objectives, and measures. Identifying external and internal stakeholders, eliciting stakeholder needs and requirements, defining drivers and constraints, and assessing risk. Performing lifecycle concept analysis and maturation and defining an integrated set of needs that represents the scope of the project. Transforming the integrated set of needs into well-formed design input requirements. Using attributes to manage needs and requirements across the lifecycle. Continuous integration, verification, and validation across the lifecycle. Moving between levels of the architecture, flow down and allocation of requirements, and budgeting performance, resource, and quality requirements. Defining the system verification and system validation success criteria, method, strategy, and responsible organizations. Planning and executing successful system verification and validation programs. Managing needs, requirements, verification, and validation across the lifecycle. Understanding the importance of an integrated, collaborative project team and effective communication between team members The INCOSE Needs and Requirements Manual is an essential accompanying reference to the INCOSE Systems Engineering Handbook for novice and seasoned system engineers, software engineers, project managers, product developers, tool vendors, course developers, educators, trainers, customers, suppliers, non-SE stakeholders , as well as researchers and students studying systems engineering and systems design.

Silicon-on-Insulator Technology: Materials to VLSI, Third Edition, retraces the evolution of SOI materials, devices and circuits over a period of roughly twenty years. Twenty years of progress, research and development during which SOI material fabrication techniques have been born and abandoned, devices have been invented and forgotten, but, most importantly, twenty years during which SOI Technology has little by little proven it could outperform bulk silicon in every possible way. The turn of the century turned out to be a milestone for the semiconductor industry, as high-quality SOI wafers suddenly became available in large quantities. From then on, it took only a few years to witness the use of SOI technology in a wealth of applications ranging from audio amplifiers and wristwatches to 64-bit microprocessors. This book presents a complete and state-of-the-art review of SOI materials, devices and circuits. SOI fabrication and characterization techniques, SOI CMOS processing, and the physics of the SOI MOSFET receive an in-depth analysis. Silicon-on-Insulator Technology: Materials to VLSI, Third Edition, also describes the properties of other SOI devices, such as multiple gate MOSFETs, dynamic threshold devices and power MOSFETs. The advantages and performance of SOI circuits used in both niche and mainstream applications are discussed in detail. The SOI specialist will find this book invaluable as a source of compiled references covering the different aspects of SOI technology. For the non-specialist, the book serves an excellent introduction to the topic with detailed, yet simple and clear explanations. Silicon-on-Insulator Technology: Materials to VLSI, Third Edition is recommended for use as a textbook for classes on semiconductor device processing and physics at the graduate level.

Praise for the first edition: “This excellent text will be useful to everysystem engineer (SE) regardless of the domain. It covers ALLrelevant SE material and does so in a very clear, methodicalfashion. The breadth and depth of the author's presentation ofSE principles and practices is outstanding.” –Philip Allen This textbook presents a comprehensive, step-by-step guide toSystem Engineering analysis, design, and development via anintegrated set of concepts, principles, practices, andmethodologies. The methods presented in this text apply to any typeof human system -- small, medium, and large organizational systemsand system development projects delivering engineered systems orservices across multiple business sectors such as medical,transportation, financial, educational, governmental, aerospace anddefense, utilities, political, and charity, among others. Provides a common focal point for “bridgingthe gap” between and unifying System Users, System Acquirers,multi-discipline System Engineering, and Project, Functional, andExecutive Management education, knowledge, and decision-making fordeveloping systems, products, or services Each chapter provides definitions of key terms,guiding principles, examples, author’s notes, real-worldexamples, and exercises, which highlight and reinforce key SE&Dconcepts and practices Addresses concepts employed in Model-BasedSystems Engineering (MBSE), Model-Driven Design (MDD), UnifiedModeling Language (UMLTM) / Systems Modeling Language(SysMLTM), and Agile/Spiral/V-Model Development such asuser needs, stories, and use cases analysis; specificationdevelopment; system architecture development; User-Centric SystemDesign (UCSD); interface definition & control; systemintegration & test; and Verification & Validation(V&V) Highlights/introduces a new 21st Century SystemsEngineering & Development (SE&D) paradigm that is easy tounderstand and implement. Provides practices that are critical stagingpoints for technical decision making such as Technical StrategyDevelopment; Life Cycle requirements; Phases, Modes, & States;SE Process; Requirements Derivation; System ArchitectureDevelopment, User-Centric System Design (UCSD); EngineeringStandards, Coordinate Systems, and Conventions; et al. Thoroughly illustrated, with end-of-chapter exercises andnumerous case studies and examples, Systems EngineeringAnalysis, Design, and Development, Second Edition is a primarytextbook for multi-discipline, engineering, system analysis, andproject management undergraduate/graduate level students and avaluable reference for professionals.