Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. The Latest Silicon-on-Sapphire CMOS Design and Fabrication Techniques Develop high-performance SOS-based microsystems. Filled with examples, schematics, and charts, Silicon-on-Sapphire Circuits and Systems covers the latest analog and mixed-signal IC design techniques. Learn how to assemble SOI/SOS circuits and systems, work with an insulated substrate and device models, create miniaturized amplifiers and switches, and build ADCs and DACs. You will also find information on constructing photosensitive circuits and memory chips, deploying integrated biosensors, overcoming noise and power issues, and maximizing efficiency. Discover how to: Extract active and passive device models and parameters Design single-stage amplifiers, op amps, references, and comparators Build digital processors, data converters, and mixed-mode circuits Deploy photodetectors in active pixel sensor and imaging arrays Optimize performance, quantum efficiency, and signal-to-noise ratio Develop current and voltage mode SOS-based biosensors Use CMOS, monolithic, and digital phase-shift isolation techniques Integrate the latest three-dimensional assemblies and die packages

Explains the circuit design of silicon optoelectronic integrated circuits (OEICs), which are central to advances in wireless and wired telecommunications. The essential features of optical absorption are summarized, as is the device physics of photodetectors and their integration in modern bipolar, CMOS, and BiCMOS technologies. This information provides the basis for understanding the underlying mechanisms of the OEICs described in the main part of the book. In order to cover the topic comprehensively, Silicon Optoelectronic Integrated Circuits presents detailed descriptions of many OEICs for a wide variety of applications from various optical sensors, smart sensors, 3D-cameras, and optical storage systems (DVD) to fiber receivers in deep-sub-μm CMOS. Numerous detailed illustrations help to elucidate the material.

Integrated circuit design for biomedical applications requires an interdisciplinary background, ranging from electrical engineering to material engineering to computer science. This book is written to help build the foundation for researchers, engineers, and students to further develop their interest and knowledge in this field. This book provides an overview of various biosensors by introducing fundamental building blocks for integrated biomedical systems. State-of-the-art projects for various applications and experience in developing these systems are explained in detail. Future design trends in this field is also discussed in this book.

Applied Solid State Science, Supplement 2: Silicon Integrated Circuits, Part A focuses on MOS device physics. This book is divided into three chapters—physics of the MOS transistor; nonvolatile memories; and properties of silicon-on-sapphire substrates devices, and integrated circuits. The topics covered include the short channel effects, MOSFET structures, floating gate devices, technology for nonvolatile semiconductor memories, sapphire substrates, and SOS integrated circuits and systems. The MOS capacitor, MIOS devices, and SOS process and device technology are also deliberated. This publication is a good source for students and individuals interested in MOS-based integrated circuits.

This book provides a comprehensive overview of the photonic sensing field by covering plasmonics, photonic crystal, and SOI techniques from theory to real sensing applications. A literature review of ultra-sensitive photonic sensors, including their design and application in industry, makes this a self-contained and comprehensive resource for different types of sensors, with high value to the biosensor sector in particular. The book is organized into four parts: Part I covers the basic theory of wave propagation, basic principles of sensing, surface plasmon resonance, and silicon photonics; Part II details the computational modeling techniques for the analysis and prediction of photonic sensors; Part III and Part IV cover the various mechanisms and light matter interaction scenarios behind the design of photonic sensors including photonic crystal fiber sensors and SOI sensors. This book is appropriate for academics and researchers specializing in photonic sensors; graduate students in the early and intermediate stages working in the areas of photonics, sensors, biophysics, and biomedical engineering; and to biomedical, environmental, and chemical engineers.

Circuits for Emerging Technologies Beyond CMOS New exciting opportunities are abounding in the field of body area networks, wireless communications, data networking, and optical imaging. In response to these developments, top-notch international experts in industry and academia present Circuits at the Nanoscale: Communications, Imaging, and Sensing. This volume, unique in both its scope and its focus, addresses the state-of-the-art in integrated circuit design in the context of emerging systems. A must for anyone serious about circuit design for future technologies, this book discusses emerging materials that can take system performance beyond standard CMOS. These include Silicon on Insulator (SOI), Silicon Germanium (SiGe), and Indium Phosphide (InP). Three-dimensional CMOS integration and co-integration with Microelectromechanical (MEMS) technology and radiation sensors are described as well. Topics in the book are divided into comprehensive sections on emerging design techniques, mixed-signal CMOS circuits, circuits for communications, and circuits for imaging and sensing. Dr. Krzysztof Iniewski is a director at CMOS Emerging Technologies, Inc., a consulting company in Vancouver, British Columbia. His current research interests are in VLSI ciruits for medical applications. He has published over 100 research papers in international journals and conferences, and he holds 18 international patents granted in the United States, Canada, France, Germany, and Japan. In this volume, he has assembled the contributions of over 60 world-reknown experts who are at the top of their field in the world of circuit design, advancing the bank of knowledge for all who work in this exciting and burgeoning area.

The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.