" ... engineers and scientists at NASA research centers and contractors continuously screen the emerging technology for innovative ideas, concepts, working processes, methods, tools, etc. Many of these have applications in non-aerospace business and industry. This is one of a series of publications issued by NASA aimed at the goal of transferring space-derived technology to other spheres of activity. This report reviews major developments in the technology of encapsulation, potting, and embedment of electronic modules, and the materials used in these processes. Because the literature in this field is voluminous, the coverage of material already well summarized in previous reports and studies has been avoided. A list of major books, bibliographies, and reviews on the subject is provided. Emphasis is given to such subjects of current interest in the field as internal stresses in encapsulated modules, and' such recently applied processing techniques as transfer molding. The reader seeking general information on the subject, or a guide to specific sources of information relating to polymers and their use in embedment processes, should find this report useful."--Foreword.