Characterization enables a microscopic understanding of the fundamental properties of materials (Science) to predict their macroscopic behaviour (Engineering). With this focus, Principles of Materials Characterization and Metrology presents a comprehensive discussion of the principles of materials characterization and metrology. Characterization techniques are introduced through elementary concepts of bonding, electronic structure of molecules and solids, and the arrangement of atoms in crystals. Then, the range of electrons, photons, ions, neutrons and scanning probes, used in characterization, including their generation and related beam-solid interactions that determine or limit their use, is presented. This is followed by ion-scattering methods, optics, optical diffraction, microscopy, and ellipsometry. Generalization of Fraunhofer diffraction to scattering by a three-dimensional arrangement of atoms in crystals leads to X-ray, electron, and neutron diffraction methods, both from surfaces and the bulk. Discussion of transmission and analytical electron microscopy, including recent developments, is followed by chapters on scanning electron microscopy and scanning probe microscopies. The book concludes with elaborate tables to provide a convenient and easily accessible way of summarizing the key points, features, and inter-relatedness of the different spectroscopy, diffraction, and imaging techniques presented throughout. Principles of Materials Characterization and Metrology uniquely combines a discussion of the physical principles and practical application of these characterization techniques to explain and illustrate the fundamental properties of a wide range of materials in a tool-based approach. Based on forty years of teaching and research, this book incorporates worked examples, to test the reader's knowledge with extensive questions and exercises.

Characterization enables a microscopic understanding of the fundamental properties of materials (Science) to predict their macroscopic behaviour (Engineering). With this focus, Principles of Materials Characterization and Metrology presents a comprehensive discussion of the principles of materials characterization and metrology. Characterization techniques are introduced through elementary concepts of bonding, electronic structure of molecules and solids, and the arrangement of atoms in crystals. Then, the range of electrons, photons, ions, neutrons and scanning probes, used in characterization, including their generation and related beam-solid interactions that determine or limit their use, is presented. This is followed by ion-scattering methods, optics, optical diffraction, microscopy, and ellipsometry. Generalization of Fraunhofer diffraction to scattering by a three-dimensional arrangement of atoms in crystals leads to X-ray, electron, and neutron diffraction methods, both from surfaces and the bulk. Discussion of transmission and analytical electron microscopy, including recent developments, is followed by chapters on scanning electron microscopy and scanning probe microscopies. The book concludes with elaborate tables to provide a convenient and easily accessible way of summarizing the key points, features, and inter-relatedness of the different spectroscopy, diffraction, and imaging techniques presented throughout. Principles of Materials Characterization and Metrology uniquely combines a discussion of the physical principles and practical application of these characterization techniques to explain and illustrate the fundamental properties of a wide range of materials in a tool-based approach. Based on forty years of teaching and research, this book incorporates worked examples, to test the reader's knowledge with extensive questions and exercises.

Materials Characterization Using Nondestructive Evaluation (NDE) Methods discusses NDT methods and how they are highly desirable for both long-term monitoring and short-term assessment of materials, providing crucial early warning that the fatigue life of a material has elapsed, thus helping to prevent service failures. Materials Characterization Using Nondestructive Evaluation (NDE) Methods gives an overview of established and new NDT techniques for the characterization of materials, with a focus on materials used in the automotive, aerospace, power plants, and infrastructure construction industries. Each chapter focuses on a different NDT technique and indicates the potential of the method by selected examples of applications. Methods covered include scanning and transmission electron microscopy, X-ray microtomography and diffraction, ultrasonic, electromagnetic, microwave, and hybrid techniques. The authors review both the determination of microstructure properties, including phase content and grain size, and the determination of mechanical properties, such as hardness, toughness, yield strength, texture, and residual stress. - Gives an overview of established and new NDT techniques, including scanning and transmission electron microscopy, X-ray microtomography and diffraction, ultrasonic, electromagnetic, microwave, and hybrid techniques - Reviews the determination of microstructural and mechanical properties - Focuses on materials used in the automotive, aerospace, power plants, and infrastructure construction industries - Serves as a highly desirable resource for both long-term monitoring and short-term assessment of materials

This Springer Handbook of Metrology and Testing presents the principles of Metrology – the science of measurement – and the methods and techniques of Testing – determining the characteristics of a given product – as they apply to chemical and microstructural analysis, and to the measurement and testing of materials properties and performance, including modelling and simulation. The principal motivation for this Handbook stems from the increasing demands of technology for measurement results that can be used globally. Measurements within a local laboratory or manufacturing facility must be able to be reproduced accurately anywhere in the world. The book integrates knowledge from basic sciences and engineering disciplines, compiled by experts from internationally known metrology and testing institutions, and academe, as well as from industry, and conformity-assessment and accreditation bodies. The Commission of the European Union has expressed this as there is no science without measurements, no quality without testing, and no global markets without standards.

The scales involved in modern semiconductor manufacturing and microelectronics continue to plunge downward. Effective and accurate characterization of materials with thicknesses below a few nanometers can be achieved using x-rays. While many books are available on the theory behind x-ray metrology (XRM), X-Ray Metrology in Semiconductor Manufacturing is the first book to focus on the practical aspects of the technology and its application in device fabrication and solving new materials problems. Following a general overview of the field, the first section of the book is organized by application and outlines the techniques that are best suited to each. The next section delves into the techniques and theory behind the applications, such as specular x-ray reflectivity, diffraction imaging, and defect mapping. Finally, the third section provides technological details of each technique, answering questions commonly encountered in practice. The authors supply real examples from the semiconductor and magnetic recording industries as well as more than 150 clearly drawn figures to illustrate the discussion. They also summarize the principles and key information about each method with inset boxes found throughout the text. Written by world leaders in the field, X-Ray Metrology in Semiconductor Manufacturing provides real solutions with a focus on accuracy, repeatability, and throughput.

Experts must be able to analyze and distinguish all materials, or combinations of materials, in use today-whether they be metals, ceramics, polymers, semiconductors, or composites. To understand a material's structure, how that structure determines its properties, and how that material will subsequently work in technological applications, researche

This Third Edition updates a landmark text with the latest findings The Third Edition of the internationally lauded Semiconductor Material and Device Characterization brings the text fully up-to-date with the latest developments in the field and includes new pedagogical tools to assist readers. Not only does the Third Edition set forth all the latest measurement techniques, but it also examines new interpretations and new applications of existing techniques. Semiconductor Material and Device Characterization remains the sole text dedicated to characterization techniques for measuring semiconductor materials and devices. Coverage includes the full range of electrical and optical characterization methods, including the more specialized chemical and physical techniques. Readers familiar with the previous two editions will discover a thoroughly revised and updated Third Edition, including: Updated and revised figures and examples reflecting the most current data and information 260 new references offering access to the latest research and discussions in specialized topics New problems and review questions at the end of each chapter to test readers' understanding of the material In addition, readers will find fully updated and revised sections in each chapter. Plus, two new chapters have been added: Charge-Based and Probe Characterization introduces charge-based measurement and Kelvin probes. This chapter also examines probe-based measurements, including scanning capacitance, scanning Kelvin force, scanning spreading resistance, and ballistic electron emission microscopy. Reliability and Failure Analysis examines failure times and distribution functions, and discusses electromigration, hot carriers, gate oxide integrity, negative bias temperature instability, stress-induced leakage current, and electrostatic discharge. Written by an internationally recognized authority in the field, Semiconductor Material and Device Characterization remains essential reading for graduate students as well as for professionals working in the field of semiconductor devices and materials. An Instructor's Manual presenting detailed solutions to all the problems in the book is available from the Wiley editorial department.

​This handbook provides comprehensive and up-to-date information on the topic of scientific, industrial and legal metrology. It discusses the state-of-art review of various metrological aspects pertaining to redefinition of SI Units and their implications, applications of time and frequency metrology, certified reference materials, industrial metrology, industry 4.0, metrology in additive manufacturing, digital transformations in metrology, soft metrology and cyber security, optics in metrology, nano-metrology, metrology for advanced communication, environmental metrology, metrology in biomedical engineering, legal metrology and global trade, ionizing radiation metrology, advanced techniques in evaluation of measurement uncertainty, etc. The book has contributed chapters from world’s leading metrologists and experts on the diversified metrological theme. The internationally recognized team of editors adopt a consistent and systematic approach and writing style, including ample cross reference among topics, offering readers a user-friendly knowledgebase greater than the sum of its parts, perfect for frequent consultation. Moreover, the content of this volume is highly interdisciplinary in nature, with insights from not only metrology but also mechanical/material science, optics, physics, chemistry, biomedical and more. This handbook is ideal for academic and professional readers in the traditional and emerging areas of metrology and related fields.

This book offers a genuinely practical introduction to the most commonly encountered optical and non-optical systems used for the metrology and characterization of surfaces, including guidance on best practice, calibration, advantages and disadvantages, and interpretation of results. It enables the user to select the best approach in a given context. Most methods in surface metrology are based upon the interaction of light or electromagnetic radiation (UV, NIR, IR), and different optical effects are utilized to get a certain optical response from the surface; some of them record only the intensity reflected or scattered by the surface, others use interference of EM waves to obtain a characteristic response from the surface. The book covers techniques ranging from microscopy (including confocal, SNOM and digital holographic microscopy) through interferometry (including white light, multi-wavelength, grazing incidence and shearing) to spectral reflectometry and ellipsometry. The non-optical methods comprise tactile methods (stylus tip, AFM) as well as capacitive and inductive methods (capacitive sensors, eddy current sensors). The book provides: Overview of the working principles Description of advantages and disadvantages Currently achievable numbers for resolutions, repeatability, and reproducibility Examples of real-world applications A final chapter discusses examples where the combination of different surface metrology techniques in a multi-sensor system can reasonably contribute to a better understanding of surface properties as well as a faster characterization of surfaces in industrial applications. The book is aimed at scientists and engineers who use such methods for the measurement and characterization of surfaces across a wide range of fields and industries, including electronics, energy, automotive and medical engineering.

Engineering Metrology and Measurements is a textbook designed for students of mechanical, production and allied disciplines to facilitate learning of various shop-floor measurement techniques and also understand the basics of mechanical measurements.