Papers in this volume are from the 199th ECS Meeting, held in Washington, DC, Spring 2001. Morphology evolution encompasses electrochemical processing in ULSI fabrication, shape evolution, growth habit, and microstructure of electrodeposits. The most prominent example at present is the electrochemical deposition of copper for ULSI interconnects. Many other electrochemical processes at various stages of emergence and development hold promise for the electronics industry and beyond.

Nowadays, nanomaterials are attracting huge attentions not only from a basic research point of view but also for their potential applications. Since finding the structure-property-processing relationships can open new windows in the application of materials, the material characterizations play a crucial role in the research and development of materials science. The increasing demand for energy with the necessity to find alternative renewable and sustainable energy sources leads to the rapid growth in attention to energy materials. In this book, the results of some outstanding researches on synchrotron-based characterization of nanostructured materials related to energy applications are presented.

This book is about thin films; what they are, how they are prepared, how they are characterized, and what they are used for. The contents of this book not only showcase the diversity of thin films, but also reveals the commonality among the work performed in a variety of areas. The chapters in this volume are based on invited papers presented by prominent researchers in the field at a Symposium on "Thin Films: Preparation, Characterization, Applications" at the 221st National Meeting of the American Chemical Society held in San Diego, California. The coverage of the symposium was extensive; topics ranged from highly-ordered metal adlayers on well-defined electrode surfaces to bio-organic films on non-metallic nanoparticles. An objective of this book is for the readers to be able to draw from the experience and results of others in order to improve and expand the understanding of the science and technology of their own thin films systems.

This book describes the newest achievements in the area of electrochemically and chemically deposited metals and alloys. In particular, the book is devoted to the surface morphology of deposited metals and alloys. It contains an in-depth analysis of the influence of the parameters of electrodeposition or chemical deposition of metals and alloys, which will likely lead to technological advances in industrial settings world-wide. Professionals in electrometallurgical and electroplating plants will find the book indispensable. This book will also be useful in the automotive, aerospace, electronics, energy device and biomedical industries. In academia, researchers in electrodeposition at both undergraduate and graduate levels will find this book a very valuable resource for their courses and projects.