The definitive resource for electroplating, now completely up to date With advances in information-age technologies, the field of electroplating has seen dramatic growth in the decade since the previous edition of Modern Electroplating was published. This expanded new edition addresses these developments, providing a comprehensive, one-stop reference to the latest methods and applications of electroplating of metals, alloys, semiconductors, and conductive polymers. With special emphasis on electroplating and electrochemical plating in nanotechnologies, data storage, and medical applications, the Fifth Edition boasts vast amounts of new and revised material, unmatched in breadth and depth by any other book on the subject. It includes: Easily accessible, self-contained contributions by over thirty experts Five completely new chapters and hundreds of additional pages A cutting-edge look at applications in nanoelectronics Coverage of the formation of nanoclusters and quantum dots using scanning tunneling microscopy (STM) An important discussion of the physical properties of metal thin films Chapters devoted to methods, tools, control, and environmental issues And much more A must-have for anyone in electroplating, including technicians, platers, plating researchers, and metal finishers, Modern Electroplating, Fifth Edition is also an excellent reference for electrical engineers and researchers in the automotive, data storage, and medical industries.

The definitive resource for electroplating, now completely up to date With advances in information-age technologies, the field of electroplating has seen dramatic growth in the decade since the previous edition of Modern Electroplating was published. This expanded new edition addresses these developments, providing a comprehensive, one-stop reference to the latest methods and applications of electroplating of metals, alloys, semiconductors, and conductive polymers. With special emphasis on electroplating and electrochemical plating in nanotechnologies, data storage, and medical applications, the Fifth Edition boasts vast amounts of new and revised material, unmatched in breadth and depth by any other book on the subject. It includes: Easily accessible, self-contained contributions by over thirty experts Five completely new chapters and hundreds of additional pages A cutting-edge look at applications in nanoelectronics Coverage of the formation of nanoclusters and quantum dots using scanning tunneling microscopy (STM) An important discussion of the physical properties of metal thin films Chapters devoted to methods, tools, control, and environmental issues And much more A must-have for anyone in electroplating, including technicians, platers, plating researchers, and metal finishers, Modern Electroplating, Fifth Edition is also an excellent reference for electrical engineers and researchers in the automotive, data storage, and medical industries.

Excellent teaching and resource material . . . it is concise, coherently structured, and easy to read . . . highly recommended for students, engineers, and researchers in all related fields." -Corrosion on the First Edition of Fundamentals of Electrochemical Deposition From computer hardware to automobiles, medical diagnostics to aerospace, electrochemical deposition plays a crucial role in an array of key industries. Fundamentals of Electrochemical Deposition, Second Edition is a comprehensive introduction to one of today's most exciting and rapidly evolving fields of practical knowledge. The most authoritative introduction to the field so far, the book presents detailed coverage of the full range of electrochemical deposition processes and technologies, including: * Metal-solution interphase * Charge transfer across an interphase * Formation of an equilibrium electrode potential * Nucleation and growth of thin films * Kinetics and mechanisms of electrodeposition * Electroless deposition * In situ characterization of deposition processes * Structure and properties of deposits * Multilayered and composite thin films * Interdiffusion in thin film * Applications in the semiconductor industry and the field of medicine This new edition updates the prior edition to address the new developments in the science and its applications, with new chapters on innovative applications of electrochemical deposition in semiconductor technology, magnetism and microelectronics, and medical instrumentation. Added coverage includes such topics as binding energy, nanoclusters, atomic force, and scanning tunneling microscopy.Example problems at the end of chapters and other features clarify and improve understanding of the material. Written by an author team with extensive experience in both industry and academe, this reference and text provides a well-rounded introduction to the field for students, as well as a means for professional chemists, engineers, and technicians to expand and sharpen their skills in using the technology.

As an instructor in various finishing courses, I have frequently made the statement over the years that "In the field of metal finishing there is very little black and white, just a great deal of grey. It is the purpose of the instructor to familiarize the student with the beacons that will guide him through this fog. " To a very considerable extent, a handbook such as this serves a similar purpose. It is also subject to similar limitations. Providing all the required information would result in a multi-volume encyclopedia rather than a usable handbook. In the pages that follow, you will therefore find frequent references to other sources where more detailed explanations or information can be found. The present goal is proper guidance and the provision ofthe most frequently required facts, not everything that is available. In the 13 years since the last edition, changes in the finishing industry have been profound but in one sense have resulted in simplifying matters rather than complicating them. Because technology has advanced to a level of complexity rendering "home brew" impracti cal in many cases, dependence on proprietary compounds has become common. Therefore, detailed solution compositions are often no longer significant or even practical. It is thus more important to provide instruction about the factors that affect the choice of the most suitable type of proprietary material.

Electrodeposition allows the "tailoring" of surface properties of a bulk material or, in the case of electroforming, the entire part. Deposits can be produced to meet a variety of designer demands. For this reason and for the possibilities that exist in terms of "new materials" for a variety of applications, a thorough understanding of the materials science of electrodeposition is of utmost importance. This book provides that understanding.

New Frontiers in Nanochemistry: Concepts, Theories, and Trends, Volume 2: Topological Nanochemistry is the second of the new three-volume set that explains and explores the important basic and advanced modern concepts in multidisciplinary chemistry. Under the broad expertise of the editor, this second volume explores the rich research areas of nanochemistry with a specific focus on the design and control of nanotechnology by structural and reactive topology. The objective of this particular volume is to emphasize the application of nanochemistry. With 46 entries from eminent international scientists and scholars, the content in this volume spans concepts from A-to-Z—from entries on the atom-bond connectivity index to the Zagreb indices, from connectivity to vapor phase epitaxy, and from fullerenes to topological reactivity—and much more. The definitions within the text are accompanied by brief but comprehensive explicative essays as well as figures, tables, etc., providing a holistic understanding of the concepts presented.

Electrodeposition of Alloys: Principles and Practice, Volume I covers the general and theoretical aspects of the electrodeposition of alloy containing silver and/or copper. This book is organized into three parts encompassing 21 chapters. The first part considers first the history of electrodeposition, the applications of electrodeposited alloys, and the practical considerations involved in electrodeposition. This part also deals with the effect of operating variables on composition of electrodeposited alloys, and the physico-chemical properties of the alloy. The second part focuses on the theoretical aspects of alloy electrodeposition. This part includes discussions on the role of cathode diffusion layer, the effects of complexing agents, and the concept of alloy plating. The third part discusses the practical aspects of the electrodeposition of alloys, focusing primarily on the electrodeposition of alloys from aqueous solutions. This part examines first brass and bronze plating, followed by the electrodeposition of copper-tin, silver, and iron containing alloys. This book is directed toward electrochemists and researchers.