Computer-aided-design (CAD) of semiconductor microtransducers is relatively new in contrast to their counterparts in the integrated circuit world. Integrated silicon microtransducers are realized using microfabrication techniques similar to those for standard integrated circuits (ICs). Unlike IC devices, however, microtransducers must interact with their environment, so their numerical simulation is considerably more complex. While the design of ICs aims at suppressing "parasitic” effects, microtransducers thrive on optimizing the one or the other such effect. The challenging quest for physical models and simulation tools enabling microtransducer CAD is the topic of this book. The book is intended as a text for graduate students in Electrical Engineering and Physics and as a reference for CAD engineers in the microsystems industry.

From the reviews: "This is a well written book offering a clear and detailed insight into physical processes and numerical procedures essential to the single-electron dynamics in electro-conducting media." Zentralblatt für Mathematik und ihre Grenzgebiete

The topic of this monograph is the physical modeling of heterostructure devices. A detailed discussion of physical models and parameters for compound semiconductors is presented including the relevant aspects of modern submicron heterostructure devices. More than 25 simulation examples for different types of Si(Ge)-based, GaAs-based, InP-based, and GaN-based heterostructure bipolar transistors (HBTs) and high electron mobility transistors (HEMTs) are given in comparison with experimental data from state-of-the-art devices.

This monograph is the first on physics-based simulations of novel strained Si and SiGe devices. It provides an in-depth description of the full-band monte-carlo method for SiGe and discusses the common theoretical background of the drift-diffusion, hydrodynamic and Monte-Carlo models and their synergy.

This volume contains the Proceedings of the International Conference on Simulation of Semiconductor Devices and Processes, SISPAD 01, held on September 5–7, 2001, in Athens. The conference provided an open forum for the presentation of the latest results and trends in process and device simulation. The trend towards shrinking device dimensions and increasing complexity in process technology demands the continuous development of advanced models describing basic physical phenomena involved. New simulation tools are developed to complete the hierarchy in the Technology Computer Aided Design simulation chain between microscopic and macroscopic approaches. The conference program featured 8 invited papers, 60 papers for oral presentation and 34 papers for poster presentation, selected from a total of 165 abstracts from 30 countries around the world. These papers disclose new and interesting concepts for simulating processes and devices.

This volume contains the proceedings of the 1998 International Conference on Simulation of Semiconductor Processes and Devices and provides an open forum for the presentation of the latest results and trends in modeling and simulation of semiconductor equipment, processes and devices. Topics include: • semiconductor equipment simulation • process modeling and simulation • device modeling and simulation of complex structures • interconnect modeling • integrated systems for process, device, circuit simulation and optimisation • numerical methods and algorithms • compact modeling and parameter extraction • modeling for RF applications • simulation and modeling of new devices (heterojunction based, SET’s, quantum effect devices, laser based ...)

From the reviews: "... this is a well produced book, written in a easy to read style, and will also be a very useful primer for someone starting out the field [...], and a useful source of reference for experienced users ..." Microelectronics Journal

The silicon age that led the computer revolution has significantly changed the world. The next 30 years will see the incorporation of new types of functionality onto the chip-structures that will enable the chip to reason, to sense, to act and to communicate. Micromachining technologies offer a wide range of possibilities for active and passive devices. Recent developments have produced sensors, actuators and optical systems. Many of these technologies are based on surface micromachining, which has evolved from silicon integrated circuit technology. This book is written by experts in the field. It contains useful details in design and processing and can be utilized as a reference book or as a textbook.

This edition of 'CMOS-MEMS' was originally published in the successful series 'Advanced Micro & Nanosystems'. Here, the combination of the globally established, billion dollar chip mass fabrication technology CMOS with the fascinating and commercially promising new world of MEMS is covered from all angles. The book introduces readers to this fi eld and takes them from fabrication technologies and material charaterization aspects to the actual applications of CMOS-MEMS - a wide range of miniaturized physical, chemical and biological sensors and RF systems. Vital knowledge on circuit and system integration issues concludes this in-depth treatise, illustrating the advantages of combining CMOS and MEMS in the first place, rather than having a hybrid solution.

Sensors are used for civil infrastructure performance assessment and health monitoring, and have evolved significantly through developments in materials and methodologies. Sensor Technologies for Civil Infrastructure Volume I provides an overview of sensor hardware and its use in data collection. The first chapters provide an introduction to sensing for structural performance assessment and health monitoring, and an overview of commonly used sensors and their data acquisition systems. Further chapters address different types of sensor including piezoelectric transducers, fiber optic sensors, acoustic emission sensors, and electromagnetic sensors, and the use of these sensors for assessing and monitoring civil infrastructures. Developments in technologies applied to civil infrastructure performance assessment are also discussed, including radar technology, micro-electro-mechanical systems (MEMS) and nanotechnology. Sensor Technologies for Civil Infrastructure provides a standard reference for structural and civil engineers, electronics engineers, and academics with an interest in the field. - Describes sensing hardware and data collection, covering a variety of sensors - Examines fiber optic systems, acoustic emission, piezoelectric sensors, electromagnetic sensors, ultrasonic methods, and radar and millimeter wave technology - Covers strain gauges, micro-electro-mechanical systems (MEMS), multifunctional materials and nanotechnology for sensing, and vision-based sensing and lasers