Mechanical characterization of micro-volume systems, as thin films or micro-sized phases embedded in multiphase materials, has attracted special interest in the last decades since different micromechanical techniques have been developed to characterize microdevices and materials at the micro and nano scale and it has become apparent that mechanical properties may depend on the analysis scale. An example is the way a crack grows in a bulk material that is likely to be different from crack propagation in a micro-volume where crack and microstructural dimensions are comparable. Consequently, there is a need of a detailed knowledge of material properties at micro and nano scale to design materials with advanced mechanical properties. In this way, micro and nanoscale science and technology enables to improve new materials and applications at macroscopic scale through a sound micromechanical design. The accuracy of test methodologies will depend on the size scale in which specific mechanical properties are studied. Micro scale is usually defined as the length scale in the range of 1-1000 microns, whereas nanoscale is usually defined as smaller than a one tenth of a micrometer in at least one dimension, although this term is sometimes also used for materials of larger dimension but smaller than one micrometer. Efforts to characterize the mechanical response of small volumes have led to the development of a variety of test methodologies, as uniaxial micro testing machines, micro beam cantilever deflection or nanoindentation devices. Challenges of testing at the micro scale include micro specimen preparation and handling, the application of small forces, and stress and strain measurement. Nanoindentation appears as the easiest way to study local behaviour on thin films or micro-sized phases, since no special sample preparation is required and tests can be performed quickly and inexpensively. Nanoindentation tests consist in the application of a controlled load on the specimen surface through the direct contact with a sharp diamond indenter and recording the evolution of the load versus the penetration depth of the indenter. The use in engineering of thin films, advanced coatings and materials with small tailored microstructures has led to the analysis of mechanical properties of very small volumes in which size effects might be important. Efforts to design and model the reliability of small-scale devices are directly dependent on the availability of accurate and reliable measurements of relevant mechanical properties at small scales. In designing structural or machine components an important step is the identification of the main micromechanical damage mechanisms. It is particularly interesting to determine the first fracture step, i.e., the crack nucleation in order to optimize the material resistance to crack nucleation. Stable brittle fracture takes place easily by the contact of a hard indenter on a brittle surface; this methodology is known as indentation fracture. Indentation fracture yields valuable information on the fundamental processes of brittle fracture in covalent-ionic solids, and detail on subsidiary deformation processes in the contact region; it provides ‘controlled flaws' for systematically evaluating fracture properties, and it serves as a simple microprobe for determining material fracture parameters, toughness, crack-growth exponent, etc. For materials that exhibit R-curves behaviour, it affords a much needed bridge between the short-crack domain of microstructural flaws and the long-crack domain of traditional toughness testing; mainly in the study of the first regimes of crack propagation. The great appeal of the indentation methodology is its versatility, control and simplicity, requiring only access to routine hardness testing apparatus. In order to study the mechanical behaviour of small-volumes and micro-sized phases, nanoindentation has become a suitable technique for the mechanical characterization of small-volumes and micrometer – sized phases, in terms of hardness (H), elastic modulus (E) and fracture toughness (Kc). While H and E can be routinely measured by nanoindentation from the load – displacement curves, the evaluation of Kc of hard micro-sized phases can in principle be measured from the length of the cracks at the corners of the indentation. This method of evaluation of Kc is known as Indentation Microfracture (IM) and it was proposed in the 1970s for Vickers indentation cracks in bulk materials. However, the design of new materials leads to ever smaller microstructures, hence lower loads and sharper indenters has to be used in order to concentrate the deformation and fracture only in the very small volume of phases of interest. Mechanical characterization of small volumes, has recently received much attention, and many works have focused on the determination of Kc by nanoindentation following the IM method. Nanoindentation allows using low loads needed for accurate micromechanical characterization with high spatial resolution. However, the use of a different kind of tip geometry and load range in nanoindentation technique raises some questions about the applicability of the existent fracture toughness equations which were developed in the past mainly for Vickers tips and for loads typically more than two orders of magnitude higher. Therefore, for a better knowledge of the micromechanical behaviour of brittle materials, this work is directed to the study of indentation microfracture applied to small volumes, focussing on the understanding of the fracture behaviour of brittle materials in terms of indenter tip geometry, applied load and crack morphology generated. On the other hand, since it is of a scientific and technological interest to understand the mechanical response of micro-volume systems, the feasibility of extending the IM developed for brittle bulk materials to engineering systems formed by micro-sized hard phases in multiphase materials or thin films will be also studied.

This book, based on the analogy between contact mechanics and fracture mechanics proposed by the author twenty years ago, starts with a treatment of the surface energy and tension of solids and surface thermodynamics. The essential concepts of fracture mechanics are presented with emphasis on the thermodynamic aspects. Readers will find complete analytical results and detailed calculations for cracks submitted to pressure distributions and the Dugdale model. Contact mechanics and the contact and adherence of rough solids are also covered.

Precision Manufacturing provides an introduction to precision engineering for manufacturing. With an emphasis on design and performance of precision machinery for manufacturing – machine tool elements and structure, sources of error, precision machining processes and process models sensors for process monitoring and control, metrology, actuators, and machine design. This book will be of interest to design engineers, quality engineers and manufacturing engineers, academics and those who may or may not have previous experience with precision manufacturing, but want to learn more.

This book, entitled Thin Films on Glass, is one of a series reporting on research and development activities on products and processes conducted by the Schott Group. The scientifically founded development of new products and technical pro cesses has traditionally been of vital importance to Schott and has always been performed on a scale determined by the prospects for application of our special glasses. Since the reconstruction of the Schott Glaswerke in Mainz, the scale has increased enormously. The range of expert knowledge required could never have been supplied by Schott alone. It is also a tradition in our company to cultivate collaboration with customers, universities, and research institutes. Publications in numerous technical journals, which since 1969 we have edited to a regular schedule as Forschungsberichte - 'research reports' - describe the results of these cooperations. They contain up-to-date infor mation on various topics for the expert but are not suited as survey material for those whose standpoint is more remote. This is the point where we would like to place our series, to stimulate the exchange of thoughts, so that we can consider from different points of view the possibilities offered by those incredibly versatile materials, glass and glass ceramics. We would like to share the knowledge won through our research and development at Schott in cooperation with the users of our materials with scientists and engineers, interested customers and friends, and with the employees of our firm.

In this valuable work, all aspects of the reactive magnetron sputtering process, from the discharge up to the resulting thin film growth, are described in detail, allowing the reader to understand the complete process. Hence, this book gives necessary information for those who want to start with reactive magnetron sputtering, understand and investigate the technique, control their sputtering process and tune their existing process, obtaining the desired thin films.

This volume provides the first comprehensive look at a pivotal new technology in integrated circuit fabrication. For some time researchers have sought alternate processes for interconnecting the millions of transistors on each chip because conventional physical vapor deposition can no longer meet the specifications of today's complex integrated circuits. Out of this research, ionized physical vapor deposition has emerged as a premier technology for the deposition of thin metal films that form the dense interconnect wiring on state-of-the-art microprocessors and memory chips.For the first time, the most recent developments in thin film deposition using ionized physical vapor deposition (I-PVD) are presented in a single coherent source. Readers will find detailed descriptions of relevant plasma source technology, specific deposition systems, and process recipes. The tools and processes covered include DC hollow cathode magnetrons, RF inductively coupled plasmas, and microwave plasmas that are used for depositing technologically important materials such as copper, tantalum, titanium, TiN, and aluminum. In addition, this volume describes the important physical processes that occur in I-PVD in a simple and concise way. The physical descriptions are followed by experimentally-verified numerical models that provide in-depth insight into the design and operation I-PVD tools.Practicing process engineers, research and development scientists, and students will find that this book's integration of tool design, process development, and fundamental physical models make it an indispensable reference.Key Features:The first comprehensive volume on ionized physical vapor depositionCombines tool design, process development, and fundamental physical understanding to form a complete picture of I-PVDEmphasizes practical applications in the area of IC fabrication and interconnect technologyServes as a guide to select the most appropriate technology for any deposition application*This single source saves time and effort by including comprehensive information at one's finger tips*The integration of tool design, process development, and fundamental physics allows the reader to quickly understand all of the issues important to I-PVD*The numerous practical applications assist the working engineer to select and refine thin film processes