The field of integrated circuits is now on the cusp of a new level of integration that can enable an entirely new class of products - monolithic instruments. These are miniaturized systems which interact with their physical environment in ways traditional integrated circuits cannot, in particular, by combining conventional integrated circuits with novel solid-state components. These systems are enabled by utilizing the extremely precise manufacturing platform that is the integrated circuit wafer fabrication facility. The monolithic instrument concept is quite powerful in that it enables vast cost and size reductions. The papers presented in this book are a subset of what is possible in this field. Section I examines advanced image sensor concepts based on forming the photodetector above the standard CMOS interconnect. Section II focuses on optoelectronic element integration, including critical components for constructing miniaturized spectrometers. Section III features chemical and biological sensing systems. Section IV highlights functional oxides and other materials for monolithic integration.

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Smart/intelligent systems is a primary technology for present and future applications in areas ranging from everyday life to aerospace missions, from civil to military environments, from robots to information technology. Smart materials are the critical foundation for high-performance smart devices, and smart devices are fundamental components for smart systems. The three cannot be separated. This book bridges the fields of smart materials, sensing and actuating devices, and intelligent systems, and provides an opportunity for researchers from all three arenas to channel information into a coherent, interdisciplinary community. Topics include: piezoelectric actuators; novel devices and systems; shape memory alloys and magnetostrictive devices; nanometer-scale processing and properties; piezoelectric materials; sensor materials and devices; and electroactive polymer actuators.

An increasing number of technologies are being used to detect minute quantities of biomolecules and cells. However, it can be difficult to determine which technologies show the most promise for high-sensitivity and low-limit detection in different applications. Microfluidics and Nanotechnology: Biosensing to the Single Molecule Limit details proven approaches for the detection of single cells and even single molecules—approaches employed by the world’s foremost microfluidics and nanotechnology laboratories. While similar books concentrate only on microfluidics or nanotechnology, this book focuses on the combination of soft materials (elastomers and other polymers) with hard materials (semiconductors, metals, and glass) to form integrated detection systems for biological and chemical targets. It explores physical and chemical—as well as contact and noncontact—detection methods, using case studies to demonstrate system capabilities. Presenting a snapshot of the current state of the art, the text: Explains the theory behind different detection techniques, from mechanical resonators for detecting cell density to fiber-optic methods for detecting DNA hybridization, and beyond Examines microfluidic advances, including droplet microfluidics, digital microfluidics for manipulating droplets on the microscale, and more Highlights an array of technologies to allow for a comparison of the fundamental advantages and challenges of each, as well as an appreciation of the power of leveraging scalability and integration to achieve sensitivity at low cost Microfluidics and Nanotechnology: Biosensing to the Single Molecule Limit not only serves as a quick reference for the latest achievements in biochemical detection at the single-cell and single-molecule levels, but also provides researchers with inspiration for further innovation and expansion of the field.

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Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.

Providing complementary viewpoints from academia as well as technology companies, this book covers the three most important aspects of successful device design: materials, device physics, and manufacturing technologies. It also offers an insight into commercialization concerns, such as packaging technologies, system integration, reel-to-reel large scale manufacturing issues and production costs. With an introduction by Nobel Laureate Alan Heeger.