A practical, comprehensive survey of SOI CMOS devices and circuitsfor microelectronics engineers The microelectronics industry is becoming increasingly dependent onSOI CMOS VLSI devices and circuits. This book is the first toaddress this important topic with a practical focus on devices andcircuits. It provides an up-to-date survey of the current knowledgeregarding SOI device behaviors and describes state-of-the-artlow-voltage CMOS VLSI analog and digital circuit techniques. Low-Voltage SOI CMOS VLSI Devices and Circuits covers the entirefield, from basic concepts to the most advanced ideas. Topicsinclude: * SOI device behavior: fundamental and floating body effects, hotcarrier effects, sensitivity, reliability, self-heating, breakdown,ESD, dual-gate devices, accumulation-mode devices, short channeleffects, and narrow channel effects * Low-voltage SOI digital circuits: floating body effects, DRAM,SRAM, static logic, dynamic logic, gate array, CPU, frequencydivider, and DSP * Low-voltage SOI analog circuits: op amps, filters, ADC/DAC,sigma-delta modulators, RF circuits, VCO, mixers, low-noiseamplifiers, and high-temperature circuits With over 300 references to the state of the art and over 300important figures on low-voltage SOI CMOS devices and circuits,this volume serves as an authoritative, reliable resource forengineers designing these circuits in high-tech industries.

5. 2 RF Building Blocks. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 214 5. 2. 1 Piezoelectric Oscillators. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 215 5. 2. 2 Voltage Reference Generator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220 5. 2. 3 Transmit/Receive Switches. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 224 5. 2. 4 Low-Noise Amplifiers (LNAs). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 226 5. 2. 5 Power Amplifiers (PAs). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 228 5. 2. 6 Mixers and Image-Rejection Receiver . . . . . . . . . . . . . . . . . . . . . . . . 230 5. 2. 7 Voltage-Controlled Oscillator (VCO). . . . . . . . . . . . . . . . . . . . . . . . . . 242 5. 2. 8 Limiting Amplifiers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 248 5. 2. 9 gm-C Filters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 250 5. 3 A/D and D/A Converters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 254 5. 3. 1 Cyclic A/D Converter. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 255 5. 3. 2 Sigma-Delta A/D Converter. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 264 5. 3. 3 Current-Steering D/A Converter. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 270 5. 4 DC-DC Converter. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 276 5. 4. 1 Design of DC-DC Converter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 276 5. 4. 2 Switched-Capacitor (SC)-Type Converter. . . . . . . . . . . . . . . . . . . 276 5. 4. 3 Buck Converter. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 279 5. 4. 4 Applicable Zones for SC-Type and Buck Converters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 283 5. 4. 5 On-chip Distributed Power Supplies for Ultralow-Power LSIs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 285 5. 5 I/O and ESD-Protection Circuitry for Ultralow-Power LSIs . . 291 5. 5. 1 Standard Interface Trends. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 291 5. 5. 2 Problems with I/O Circuits for 0. 5-V/3. 3-V Conversion. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 292 5. 5. 3 Guidelines for Design of Interface Circuits. . . . . . . . . . . . . . . . . 293 5. 5. 4 Performance of I/O Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 297 5. 5. 5 ESD Protection with FD-SOI Devices . . . . . . . . . . . . . . . . . . . . . . . . 298 5. 5. 6 Design and Layout Requirements for ESD Protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300 5. 6 Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 303 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 304 viii 6. SPICE Model for SOI MOSFETs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 307 6. 1 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 307 6. 2 SPICE Model for SOI MOSFETs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 307 6. 3 Parameter Extraction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 309 6. 4 Example of SOI MOSFET Simulation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

This new volume offers a broad view of the challenges of electronic devices and circuits for IoT applications. The book presents the basic concepts and fundamentals behind new low power, high-speed efficient devices, circuits, and systems in addition to CMOS. It provides an understanding of new materials to improve device performance with smaller dimensions and lower costs. It also looks at the new methodologies to enhance system performance and provides key parameters for exploring the devices and circuit performance based on smart applications. The chapters delve into myriad aspects of circuit design, including MOSFET structures depending on their low power applications for IoT-enabled systems, advanced sensor design and fabrication using MEMS, indirect bootstrap techniques, efficient CMOS comparators, various encryption-decryption algorithms, IoT video forensics applications, microstrip patch antennas in embedded IoT applications, real-time object detection using sound, IOT and nanotechnologies based wireless sensors, and much more.

Geared to the needs of engineers and designers in the field, this unique volume presents a remarkably detailed analysis of one of the hottest and most compelling research topics in microelectronics today - namely, low-voltage CMOS VLSI circuit techniques for VLSI systems. It features complete guidelines to diversified low-voltage and low-power circuit techniques, emphasizing the role of submicron and CMOS processing technology and device modeling in the circuit designs of low-voltage CMOS VLSI.

This reference textbook discusses low power designs for emerging applications. This book focuses on the research challenges associated with theory, design, and applications towards emerging Microelectronics and VLSI device design and developments, about low power consumptions. The advancements in large-scale integration technologies are principally responsible for the growth of the electronics industry. This book is focused on senior undergraduates, graduate students, and professionals in the field of electrical and electronics engineering, nanotechnology. This book: Discusses various low power techniques and applications for designing efficient circuits Covers advance nanodevices such as FinFETs, TFETs, CNTFETs Covers various emerging areas like Quantum-Dot Cellular Automata Circuits and FPGAs and sensors Discusses applications like memory design for low power applications using nanodevices The number of options for ICs in control applications, telecommunications, high-performance computing, and consumer electronics continues to grow with the emergence of VLSI designs. Nanodevices have revolutionized the electronics market and human life; it has impacted individual life to make it more convenient. They are ruling every sector such as electronics, energy, biomedicine, food, environment, and communication. This book discusses various emerging low power applications using CMOS and other emerging nanodevices.

Silicon-on-Insulator Technology: Materials to VLSI, Third Edition, retraces the evolution of SOI materials, devices and circuits over a period of roughly twenty years. Twenty years of progress, research and development during which SOI material fabrication techniques have been born and abandoned, devices have been invented and forgotten, but, most importantly, twenty years during which SOI Technology has little by little proven it could outperform bulk silicon in every possible way. The turn of the century turned out to be a milestone for the semiconductor industry, as high-quality SOI wafers suddenly became available in large quantities. From then on, it took only a few years to witness the use of SOI technology in a wealth of applications ranging from audio amplifiers and wristwatches to 64-bit microprocessors. This book presents a complete and state-of-the-art review of SOI materials, devices and circuits. SOI fabrication and characterization techniques, SOI CMOS processing, and the physics of the SOI MOSFET receive an in-depth analysis. Silicon-on-Insulator Technology: Materials to VLSI, Third Edition, also describes the properties of other SOI devices, such as multiple gate MOSFETs, dynamic threshold devices and power MOSFETs. The advantages and performance of SOI circuits used in both niche and mainstream applications are discussed in detail. The SOI specialist will find this book invaluable as a source of compiled references covering the different aspects of SOI technology. For the non-specialist, the book serves an excellent introduction to the topic with detailed, yet simple and clear explanations. Silicon-on-Insulator Technology: Materials to VLSI, Third Edition is recommended for use as a textbook for classes on semiconductor device processing and physics at the graduate level.

Revised and expanded for this new edition, Smart CMOS Image Sensors and Applications, Second Edition is the only book available devoted to smart CMOS image sensors and applications. The book describes the fundamentals of CMOS image sensors and optoelectronic device physics, and introduces typical CMOS image sensor structures, such as the active pixel sensor (APS). Also included are the functions and materials of smart CMOS image sensors and present examples of smart imaging. Various applications of smart CMOS image sensors are also discussed. Several appendices supply a range of information on constants, illuminance, MOSFET characteristics, and optical resolution. Expansion of smart materials, smart imaging and applications, including biotechnology and optical wireless communication, are included. Features • Covers the fundamentals and applications including smart materials, smart imaging, and various applications • Includes comprehensive references • Discusses a wide variety of applications of smart CMOS image sensors including biotechnology and optical wireless communication • Revised and expanded to include the state of the art of smart image sensors

This book provides detailed and accurate information on the history, structure, operation, benefits and advanced structures of silicon MESFET, along with modeling and analysis of the device. The authors explain the detailed physics that are important in modeling of SOI-MESFETs, and present the derivations of compact model expressions so that users can recognize the physical meaning of the model equations and parameters. The discussion also includes advanced structures for SOI-MESFET for submicron applications.

This book offers combined views on silicon-on-insulator (SOI) nanoscaled electronics from experts in the fields of materials science, device physics, electrical characterization and computer simulation. Coverage analyzes prospects of SOI nanoelectronics beyond Moore’s law and explains fundamental limits for CMOS, SOICMOS and single electron technologies.

Silicon-On-Insulator (SOI) CMOS technology has been regarded as another major technology for VLSI in addition to bulk CMOS technology. Owing to the buried oxide structure, SOI technology offers superior CMOS devices with higher speed, high density, and reduced second order effects for deep-submicron low-voltage, low-power VLSI circuits applications. In addition to VLSI applications, and because of its outstanding properties, SOI technology has been used to realize communication circuits, microwave devices, BICMOS devices, and even fiber optics applications. CMOS VLSI Engineering: Silicon-On-Insulator addresses three key factors in engineering SOI CMOS VLSI - processing technology, device modelling, and circuit designs are all covered with their mutual interactions. Starting from the SOI CMOS processing technology and the SOI CMOS digital and analog circuits, behaviors of the SOI CMOS devices are presented, followed by a CAD program, ST-SPICE, which incorporates models for deep-submicron fully-depleted mesa-isolated SOI CMOS devices and special purpose SOI devices including polysilicon TFTs. CMOS VLSI Engineering: Silicon-On-Insulator is written for undergraduate senior students and first-year graduate students interested in CMOS VLSI. It will also be suitable for electrical engineering professionals interested in microelectronics.