Basic Electronics, meant for the core science and technology courses in engineering colleges and universities, has been designed with the key objective of enhancing the students' knowledge in the field of electronics. The book has an extensive coverage of

This book provides a comprehensive reference for everything that has to do with digital circuits. The author focuses equally on all levels of abstraction. He tells a bottom-up story from the physics level to the finished product level. The aim is to provide a full account of the experience of designing, fabricating, understanding, and testing a microchip. The content is structured to be very accessible and self-contained, allowing readers with diverse backgrounds to read as much or as little of the book as needed. Beyond a basic foundation of mathematics and physics, the book makes no assumptions about prior knowledge. This allows someone new to the field to read the book from the beginning. It also means that someone using the book as a reference will be able to answer their questions without referring to any external sources.

Deformation of the Earth’s crust happens at a multitude of scales, ranging from submicroscopic to planetary. Tectonics explores structures and processes from regional to global, differentiating itself from the material covered in most structural geology textbooks. Moores and Twiss emphasize basic principles and methodologies of tectonics, embracing the time-honored perspective of using present processes to understand the past. Comprehensive in scope and detail, coverage includes the effects of plate motions and reconstructions and the resultant structures associated with active rift, transform, and subduction boundaries as well as triple junctions and collision zones; deformations of both the ocean basins and the continents; and orogenic belts. Moores and Twiss present tectonics as an open-ended field of study in which assumptions can be challenged and interpretations changed. The authors emphasize the use of models as a means of understanding observations and putting them in context to maintain a distinction between what we know from observing the Earth and what we infer from interpretation.

Pressure Vessel Technology, Volume 3 reviews the practices and trends in pressure vessel technology. This book discusses the tremendous progress in the various fields of pressure vessel technology, including fabrication techniques, ferrous materials, and life expectancy to assure structural integrity. Organized into 11 chapters, this compilation of papers begins with an overview of the fabrication techniques in pressure vessel technology. This text then examines the requirements of the chemical industry for the prevention of catastrophic failure of pressure components. Other chapters consider the major development of pressure vessels for special purposes, high pressure vessels, materials for making pressure vessels, and pressure vessel codes. This book discusses as well the seismic design in the field of pressure vessels and pipings. The final chapter deals with buckling resistance under seismic motions for thin-walled cylindrical vessels, of which predominant mode of failure is shear buckling and bending under horizontal earthquake loadings. This book is a valuable resource for mechanical engineers, project managers, and scientists.