In Interconnect-centric Design for Advanced SoC and NoC, we have tried to create a comprehensive understanding about on-chip interconnect characteristics, design methodologies, layered views on different abstraction levels and finally about applying the interconnect-centric design in system-on-chip design. Traditionally, on-chip communication design has been done using rather ad-hoc and informal approaches that fail to meet some of the challenges posed by next-generation SOC designs, such as performance and throughput, power and energy, reliability, predictability, synchronization, and management of concurrency. To address these challenges, it is critical to take a global view of the communication problem, and decompose it along lines that make it more tractable. We believe that a layered approach similar to that defined by the communication networks community should also be used for on-chip communication design. The design issues are handled on physical and circuit layer, logic and architecture layer, and from system design methodology and tools point of view. Formal communication modeling and refinement is used to bridge the communication layers, and network-centric modeling of multiprocessor on-chip networks and socket-based design will serve the development of platforms for SoC and NoC integration. Interconnect-centric Design for Advanced SoC and NoC is concluded by two application examples: interconnect and memory organization in SoCs for advanced set-top boxes and TV, and a case study in NoC platform design for more generic applications.

This book constitutes the refereed proceedings of the 5th International Workshop on Systems, Architectures, Modeling, and Simulation, SAMOS 2005, held in Samos, Greece in July 2005. The 49 revised full papers presented were thoroughly reviewed and selected from 114 submissions. The papers are organized in topical sections on reconfigurable system design and implementations, processor architectures, design and simulation, architectures and implementations, system level design, and modeling and simulation.

The book provides a comprehensive description and implementation methodology for the Philips/NXP Aethereal/aelite Network-on-Chip (NoC). The presentation offers a systems perspective, starting from the system requirements and deriving and describing the resulting hardware architectures, embedded software, and accompanying design flow. Readers get an in depth view of the interconnect requirements, not centered only on performance and scalability, but also the multi-faceted, application-driven requirements, in particular composability and predictability. The book shows how these qualitative requirements are implemented in a state-of-the-art on-chip interconnect, and presents the realistic, quantitative costs.

Chip Design and Implementation from a Practical Viewpoint Focusing on chip implementation, Low-Power NoC for High-Performance SoC Design provides practical knowledge and real examples of how to use network on chip (NoC) in the design of system on chip (SoC). It discusses many architectural and theoretical studies on NoCs, including design methodology, topology exploration, quality-of-service guarantee, low-power design, and implementation trials. The Steps to Implement NoC The book covers the full spectrum of the subject, from theory to actual chip design using NoC. Employing the Unified Modeling Language (UML) throughout, it presents complicated concepts, such as models of computation and communication–computation partitioning, in a manner accessible to laypeople. The authors provide guidelines on how to simplify complex networking theory to design a working chip. In addition, they explore the novel NoC techniques and implementations of the Basic On-Chip Network (BONE) project. Examples of real-time decisions, circuit-level design, systems, and chips give the material a real-world context. Low-Power NoC and Its Application to SoC Design Emphasizing the application of NoC to SoC design, this book shows how to build the complicated interconnections on SoC while keeping a low power consumption.

This volume features the refereed proceedings of the 17th International Workshop on Power and Timing Modeling, Optimization and Simulation. Papers cover high level design, low power design techniques, low power analog circuits, statistical static timing analysis, power modeling and optimization, low power routing optimization, security and asynchronous design, low power applications, modeling and optimization, and more.

Details a real-world product that applies a cutting-edge multi-core architecture Increasingly demanding modern applications—such as those used in telecommunications networking and real-time processing of audio, video, and multimedia streams—require multiple processors to achieve computational performance at the rate of a few giga-operations per second. This necessity for speed and manageable power consumption makes it likely that the next generation of embedded processing systems will include hundreds of cores, while being increasingly programmable, blending processors and configurable hardware in a power-efficient manner. Multi-Core Embedded Systems presents a variety of perspectives that elucidate the technical challenges associated with such increased integration of homogeneous (processors) and heterogeneous multiple cores. It offers an analysis that industry engineers and professionals will need to understand the physical details of both software and hardware in embedded architectures, as well as their limitations and potential for future growth. Discusses the available programming models spread across different abstraction levels The book begins with an overview of the evolution of multiprocessor architectures for embedded applications and discusses techniques for autonomous power management of system-level parameters. It addresses the use of existing open-source (and free) tools originating from several application domains—such as traffic modeling, graph theory, parallel computing and network simulation. In addition, the authors cover other important topics associated with multi-core embedded systems, such as: Architectures and interconnects Embedded design methodologies Mapping of applications

Here is an extremely useful book that provides insight into a number of different flavors of processor architectures and their design, software tool generation, implementation, and verification. After a brief introduction to processor architectures and how processor designers have sometimes failed to deliver what was expected, the authors introduce a generic flow for embedded on-chip processor design and start to explore the vast design space of on-chip processing. The authors cover a number of different types of processor core.

Aggressive scaling of device and interconnect dimensions has resulted in many low dimensional issues in the nanometer regime. This book deals with various new generation interconnect materials and interconnect modeling and highlights the significance of novel nano interconnect materials for 3D integrated circuit design. It provides information about advanced nanomaterials like carbon nanotube (CNT) and graphene nanoribbon (GNR) for the realization of interconnects, interconnect models, and crosstalk noise analysis. Features: Focusses on materials and nanomaterials utilization in next generation interconnects based on Carbon nanotubes (CNT) and Graphene nanoribbons (GNR). Helps readers realize interconnects, interconnect models, and crosstalk noise analysis. Describes Hybrid CNT and GNR based interconnects. Presents the details of power supply voltage drop analysis in CNT and GNR interconnects. Overviews pertinent RF performance and stability analysis. This book is aimed at graduate students and researchers in electrical and materials engineering, nano/microelectronics.

As demand for on-chip functionalities and requirements for low power operation continue to increase as a result of the emergence in mobile, wearable and internet-of-things (IoT) products, 3D/2.5D have been identified as an inevitable path moving forward. As circuits become more and more complex, especially three-dimensional ones, new insights have to be developed in many domains, including electrical, thermal, noise, interconnects, and parasites. It is the entanglement of such domains that begins the very key challenge as we enter in 3D nano-electronics. This book aims to develop this new paradigm, going to a synthesis beginning between many technical aspects.

The design of today's semiconductor chips for various applications, such as telecommunications, poses various challenges due to the complexity of these systems. These highly complex systems-on-chips demand new approaches to connect and manage the communication between on-chip processing and storage components and networks on chips (NoCs) provide a powerful solution. This book is the first to provide a unified overview of NoC technology. It includes in-depth analysis of all the on-chip communication challenges, from physical wiring implementation up to software architecture, and a complete classification of their various Network-on-Chip approaches and solutions.* Leading-edge research from world-renowned experts in academia and industry with state-of-the-art technology implementations/trends* An integrated presentation not currently available in any other book* A thorough introduction to current design methodologies and chips designed with NoCs