"The central goal of this book is to present the fundamentals of semiconductor device operation with relevance to modern integrated microelectronics (as opposed to, say, photonics, energy conversion devices, or power electronics). This means that no optical devices nor power devices of any kind are described. In contrast, emphasis is devoted to frequency response, layout, geometrical effects, parasitic issues and modeling in integrated microelectronics devices (transistors and diodes). In spite of this focus, the concepts learned here are highly applicable in other device contexts. This book should be a great resource for a broad range of students with a diverse set of interests."--

Combining solid state devices with electronic circuits for an introductory-level microelectronics course, this textbook offers an integrated approach so that students can truly understand how a circuit works. A concise writing style is employed, with the right level of detail and physics to help students understand how a device works. Other features include an emphasis on modelling of electronic devices, and analysis of non-linear circuits. Spice problems, worked examples and end-of-chapter problems are included.

This is the first book to comprehensively record the authors’ authoritative knowledge and practical experience of IC manufacturing, including the tremendous developments of recent years. With its strong application orientation, this is a must-have book for professionals in semiconductor industries.

Uncover the Defects that Compromise Performance and ReliabilityAs microelectronics features and devices become smaller and more complex, it is critical that engineers and technologists completely understand how components can be damaged during the increasingly complicated fabrication processes required to produce them.A comprehensive survey of defe

Nanophotonics is a field of science and technology based on the manipulation of light with equally miniscule structures, in the same way that computer chips are used to route and switch electrical signals. By enabling new high bandwidth, high speed optoelectronic components, nanophotonics has the potential to revolutionize the fields of telecommunications, computation and sensing. In this book, Zalevsky and Abdulhalim explore one of the key technologies emerging within nanophotonics, that of nano-integrated photonic modulation devices and sensors. The attempt to integrate photonic dynamic devices with microelectronic circuits is becoming a major scientific as well as industrial trend due to the fact that currently processing is mainly achieved using microelectronic chips but transmission, especially for long distances, takes place via optical links. - Unlocks the technologies that will turn the rapidly growing research area of nanophotonics into a major area of commercial development, with applications in telecommunications, computing, security and sensing - Nano-integrated photonic modulation devices and sensors are the components that will see nanophotonics moving out of the lab into a new generation of products and services - By covering the scientific fundamentals alongside technological applications, the authors open up this important multidisciplinary subject to readers from a range of scientific backgrounds

Explains the circuit design of silicon optoelectronic integrated circuits (OEICs), which are central to advances in wireless and wired telecommunications. The essential features of optical absorption are summarized, as is the device physics of photodetectors and their integration in modern bipolar, CMOS, and BiCMOS technologies. This information provides the basis for understanding the underlying mechanisms of the OEICs described in the main part of the book. In order to cover the topic comprehensively, Silicon Optoelectronic Integrated Circuits presents detailed descriptions of many OEICs for a wide variety of applications from various optical sensors, smart sensors, 3D-cameras, and optical storage systems (DVD) to fiber receivers in deep-sub-μm CMOS. Numerous detailed illustrations help to elucidate the material.

The second edition of this introductory book sets out clearly and concisely the principles of operation of the semiconductor devices that lie at the heart of the microelectronic revolution. The book aims to teach the reader how semiconductor devices are modelled. It begins by providing a firm background in the relevant semiconductor physics. These ideas are then used to construct both circuit models and mathematical models for diodes, bipolar transistors and MOSFETs. It also describes the processes involved in fabricating silicon chips containing these devices. The first edition has already proved a highly useful textbook to first and second year degree students in electrical and electronic engineering, and related disciplines. It is also useful to HND students in similar subject areas, and as supplementary reading for anyone involved in integrated circuit design and fabrication.

Modern Semiconductor Devices for Integrated Circuits, First Edition introduces readers to the world of modern semiconductor devices with an emphasis on integrated circuit applications. KEY TOPICS Electrons and Holes in Semiconductors; Motion and Recombination of Electrons and Holes; Device Fabrication Technology; PN and Metal Semiconductor Junctions; MOS Capacitor; MOS Transistor; MOSFETs in ICs Scaling, Leakage, and Other Topics; Bipolar Transistor. MARKET Written by an experienced teacher, researcher, and expert in industry practices, this succinct and forward-looking text is appropriate for anyone interested in semiconductor devices for integrated curcuits, and serves as a suitable reference text for practicing engineers. "

Packaging of microelectronics has been developing since the invention of the transistor in 1947. With the increasing complexity and decreasing size of the die, packaging requirements have continued to change. A step change in package requirements came with the introduction of the Micro-Electro-Mechanical System (MEMS) whereby interactions with the external environment are, in some cases, required. This resource is a rapid, definitive reference on hermetic packaging for the MEMS and microelectronics industry, giving practical guidance on traditional and newly developed test methods. This book includes up-to-date and applicable test methods for today’s package types. The authors cover the history and development of packaging, along with a view to understanding initial hermeticity testing requirements and the subsequent limitations of these methods when applied to new package types.