Collects 58 papers from the April/May 2001 symposium that explore new approaches in the testing of electronic circuits and systems. Key areas in testing are discussed, such as BIST, analog measurement, fault tolerance, diagnosis methods, scan chain design, memory test and diagnosis, and test data compression and compaction. Also on the program are sessions on emerging areas that are gaining prominence, including low power testing, testing high speed circuits on low cost testers, processor based self test techniques, and core- based system-on-chip testing. Some of the topics are robust and low cost BIST architectures for sequential fault testing in datapath multipliers, a method for measuring the cycle-to-cycle period jitter of high-frequency clock signals, fault equivalence identification using redundancy information and static and dynamic extraction, and test scheduling for minimal energy consumption under power constraints. No subject index. c. Book News Inc.

Proceedings of a spring 2000 symposium, highlighting novel ideas and approaches to current and future problems related to testing of electronic circuits and systems. Themes are microprocessor test/validation, low power BIST and scan, technology trends, scan- related approaches, defect-driven techniques, and system-on-chip test techniques. Other subjects are analog test techniques, temperature and process drift issues, test compaction and design validation, analog BIST, and functional test and verification issues. Also covered are STIL extension, IDDQ test, and on-line testing and fault tolerance. Lacks a subject index. Annotation copyrighted by Book News, Inc., Portland, OR.

The theme of the April 1999 symposium Scaling deeper to submicron: test technology challenges reflects the issues being created by the move toward nanometer technologies. Many creative and novel ideas and approaches to the current and future electronic circuit testing-related problems are explored

Test functions (fault detection, diagnosis, error correction, repair, etc.) that are applied concurrently while the system continues its intended function are defined as on-line testing. In its expanded scope, on-line testing includes the design of concurrent error checking subsystems that can be themselves self-checking, fail-safe systems that continue to function correctly even after an error occurs, reliability monitoring, and self-test and fault-tolerant designs. On-Line Testing for VLSI contains a selected set of articles that discuss many of the modern aspects of on-line testing as faced today. The contributions are largely derived from recent IEEE International On-Line Testing Workshops. Guest editors Michael Nicolaidis, Yervant Zorian and Dhiraj Pradhan organized the articles into six chapters. In the first chapter the editors introduce a large number of approaches with an expanded bibliography in which some references date back to the sixties. On-Line Testing for VLSI is an edited volume of original research comprising invited contributions by leading researchers.

Advances in design methods and process technologies have resulted in a continuous increase in the complexity of integrated circuits (ICs). However, the increased complexity and nanometer-size features of modern ICs make them susceptible to manufacturing defects, as well as performance and quality issues. Testing for Small-Delay Defects in Nanoscale CMOS Integrated Circuits covers common problems in areas such as process variations, power supply noise, crosstalk, resistive opens/bridges, and design-for-manufacturing (DfM)-related rule violations. The book also addresses testing for small-delay defects (SDDs), which can cause immediate timing failures on both critical and non-critical paths in the circuit. Overviews semiconductor industry test challenges and the need for SDD testing, including basic concepts and introductory material Describes algorithmic solutions incorporated in commercial tools from Mentor Graphics Reviews SDD testing based on "alternative methods" that explores new metrics, top-off ATPG, and circuit topology-based solutions Highlights the advantages and disadvantages of a diverse set of metrics, and identifies scope for improvement Written from the triple viewpoint of university researchers, EDA tool developers, and chip designers and tool users, this book is the first of its kind to address all aspects of SDD testing from such a diverse perspective. The book is designed as a one-stop reference for current industrial practices, research challenges in the domain of SDD testing, and recent developments in SDD solutions.

This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable.

System-on-a-Chip (SOC) integrated circuits composed of embedded cores are now commonplace. Nevertheless, there remain several roadblocks to rapid and efficient system integration. Test development is seen as a major bottleneck in SOC design and manufacturing capabilities. Testing SOCs is especially challenging in the absence of standardized test structures, test automation tools, and test protocols. In addition, long interconnects, high density, and high-speed designs lead to new types of faults involving crosstalk and signal integrity. SOC (System-on-a-Chip) Testing for Plug and Play Test Automation is an edited work containing thirteen contributions that address various aspects of SOC testing. SOC (System-on-a-Chip) Testing for Plug and Play Test Automation is a valuable reference for researchers and students interested in various aspects of SOC testing.

CMOS manufacturing environments are surrounded with symptoms that can indicate serious test, design, or reliability problems, which, in turn, can affect the financial as well as the engineering bottom line. This book educates readers, including non-engineers involved in CMOS manufacture, to identify and remedy these causes. This book instills the electronic knowledge that affects not just design but other important areas of manufacturing such as test, reliability, failure analysis, yield-quality issues, and problems. Designed specifically for the many non-electronic engineers employed in the semiconductor industry who need to reliably manufacture chips at a high rate in large quantities, this is a practical guide to how CMOS electronics work, how failures occur, and how to diagnose and avoid them. Key features: Builds a grasp of the basic electronics of CMOS integrated circuits and then leads the reader further to understand the mechanisms of failure. Unique descriptions of circuit failure mechanisms, some found previously only in research papers and others new to this publication. Targeted to the CMOS industry (or students headed there) and not a generic introduction to the broader field of electronics. Examples, exercises, and problems are provided to support the self-instruction of the reader.