The increasing demand for miniaturized electronic devices has heightened the need for tiny oscillators suitable to provide an accurate reference signal to electronics. In this sense, MEMS (microelectromechanical systems) resonator and oscillator have drawn a great deal of attention because they can be integrated onto silicon chips in a small form factor. This work describes the design, theory, and demonstration of MEMS resonator and oscillator with improved mid-term and short-term stability, especially when a resonator has nonlinearities. In the temperature stability study, electrostatic tuning was applied to Si-SiO2 composite resonators, which were made of single- crystal silicon with a silicon dioxide coating. The hybrid of these two temperature compensation methods achieved less than ± 2.5 parts per million frequency variation over a 90°C-wide temperature range, which is comparable with commercial quartz oscillators. In addition, the effect of nonlinearities of resonators on temperature sta- bility was analyzed: the temperature-dependent nonlinear effect model was theorized and verified with single-crystal silicon and Si-SiO2 composite resonator-based oscil- lators; a new feedback circuit architecture that improves temperature stability was then developed based on the model. In the phase-noise performance study, oscillator stability far above the critical vibration amplitude in the nonlinear regime was first demonstrated by using a novel variable-phase closed-loop setup. After that, more than twentyfold improvement in the power-handling and far-from-carrier phase-noise performances were achieved by operating an oscillator in the nonlinear regime. In addition, the nonlinear phase-noise model was verified by using the same closed-loop setup. In conjunction with the recently developed nonlinear motional impedance model, this phase-noise model enables further improvement in the phase-noise per- formance of MEMS resonator-based oscillators.

In today's economy, timing references are everywhere from smart-phones to cars. Timing references or clocks provide a stable signal that serves as a reference for communication between digital systems from processors within a smart-phone to cellphones on a wireless network. In the past decades, quartz clocks have dominated the field of portable timing references, and their size and power consumption have limited the design specifications of electronics and other devices. Recently, encapsulated MEMS-based clocks have entered this market, due to their small size, low cost and low power consumption. The main challenge of MEMS-based clocks is that they are fabricated with silicon, which has elastic properties with a strong linear temperature dependence that contributes to lower frequency stability over temperature. Previous research aimed to solve this problem with temperature compensation techniques including passive methods such as changes in the wafer doping and resonator orientation, and active methods such as ovenization. These methods aimed to reduce the linear relationship between the frequency and temperature characteristic of silicon resonators. These efforts are expanded in this work to demonstrate novel dual-mode MEMS-based clocks with in-chip device layer micro-oven that controls the temperature of the resonators with 10x reduced power consumption and provides more than 30x improved frequency stability when compared to recent results with a micro-oven embedded in the encapsulation layer. This device layer micro-oven enables the correction of ambient temperature fluctuations and achieves long-term frequency stability over temperature of +/- 1.5ppb, which is better than the stability of TCXOs and competes with state-of-the-art quartz OCXOs and miniature atomic clocks, while requiring much less power. This work also explored techniques to improve the yield of devices with micro-ovens embedded in the device layer and the thermal effects of ovenized devices on other sensors located in the same chip.

This book presents collaborative research presented by experts in the field of nonlinear science provides the reader with contemporary, cutting-edge, research works that bridge the gap between theory and device realizations of nonlinear phenomena. The conference provides a unique forum for applications of nonlinear systems while solving practical problems in science and engineering. Topics include: chaos gates, social networks, communication, sensors, lasers, molecular motors, biomedical anomalies, and stochastic resonance. This book provides a comprehensive report of the various research projects presented at the International Conference on Applications in Nonlinear Dynamics (ICAND 2018) held in Maui, Hawaii, 2018. It can be a valuable tool for scientists and engineering interested in connecting ideas and methods in nonlinear dynamics with actual design, fabrication and implementation of engineering applications or devices.

The power consumption of microprocessors is one of the most important challenges of high-performance chips and portable devices. In chapters drawn from Piguet's recently published Low-Power Electronics Design, this volume addresses the design of low-power microprocessors in deep submicron technologies. It provides a focused reference for specialists involved in systems-on-chips, from low-power microprocessors to DSP cores, reconfigurable processors, memories, ad-hoc networks, and embedded software. Low-Power Processors and Systems on Chips is organized into three broad sections for convenient access. The first section examines the design of digital signal processors for embedded applications and techniques for reducing dynamic and static power at the electrical and system levels. The second part describes several aspects of low-power systems on chips, including hardware and embedded software aspects, efficient data storage, networks-on-chips, and applications such as routing strategies in wireless RF sensing and actuating devices. The final section discusses embedded software issues, including details on compilers, retargetable compilers, and coverification tools. Providing detailed examinations contributed by leading experts, Low-Power Processors and Systems on Chips supplies authoritative information on how to maintain high performance while lowering power consumption in modern processors and SoCs. It is a must-read for anyone designing modern computers or embedded systems.

Handbook of Silicon Based MEMS Materials and Technologies, Third Edition is a comprehensive guide to MEMS materials, technologies, and manufacturing with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, modeling, manufacturing, processing, system integration, measurement, and materials characterization techniques of MEMS structures. The third edition of this book provides an important up-to-date overview of the current and emerging technologies in MEMS making it a key reference for MEMS professionals, engineers, and researchers alike, and at the same time an essential education material for undergraduate and graduate students. - Provides comprehensive overview of leading-edge MEMS manufacturing technologies through the supply chain from silicon ingot growth to device fabrication and integration with sensor/actuator controlling circuits - Explains the properties, manufacturing, processing, measuring and modeling methods of MEMS structures - Reviews the current and future options for hermetic encapsulation and introduces how to utilize wafer level packaging and 3D integration technologies for package cost reduction and performance improvements - Geared towards practical applications presenting several modern MEMS devices including inertial sensors, microphones, pressure sensors and micromirrors

Most MEMS accelerometers on the market today are capacitive accelerometers that are based on the displacement sensing mechanism. This book is intended to cover recent developments of MEMS silicon oscillating accelerometers (SOA), also referred to as MEMS resonant accelerometer. As contrast to the capacitive accelerometer, the MEMS SOA is based on the force sensing mechanism, where the input acceleration is converted to a frequency output. MEMS Silicon Oscillating Accelerometers and Readout Circuits consists of six chapters and covers both MEMS sensor and readout circuit, and provides an in-depth coverage on the design and modelling of the MEMS SOA with several recently reported prototypes. The book is not only useful to researchers and engineers who are familiar with the topic, but also appeals to those who have general interests in MEMS inertial sensors. The book includes extensive references that provide further information on this topic.

This book consists of review articles by experts on recent developments in mechanical engineering sciences. The book has been composed to commemorate the Silver Jubilee of the Mechanical Engineering Department, Indian Institute of Technology Guwahati. It includes articles on modern mechanical sciences subjects of advanced simulation techniques and molecular dynamics, microfluidics and microfluidic devices, energy systems, intelligent fabrication, microscale manufacturing, smart materials, computational techniques, robotics and their allied fields. It presents the upcoming and emerging areas in mechanical sciences which will help in formulation of new courses and updating existing curricula. This book will help the academicians and policy makers in the field of engineering education to chart out the desired path for the development of technical education.

This book is based on the 18 tutorials presented during the 30th workshop on Advances in Analog Circuit Design. Expert designers present readers with information about a variety of topics at the frontier of analog circuit design, with specific contributions focusing on analog circuits for machine learning, current/voltage/temperature sensors, and high-speed communication via wireless, wireline, or optical links. This book serves as a valuable reference to the state-of-the-art, for anyone involved in analog circuit research and development.