Provides the reader how to apply flexible glass applications that are not possible or practical to address with alternative substrate materials. Examples of technology areas include displays, touch sensors, lighting, backplanes, and photovoltaics. Built on more than 10 years of valuable discussions and collaborations focused on truly defining what flexible glass means in the context of the emerging electronic and opto-electronic applications, this book provides a broad overview as well as detailed descriptions that cover flexible glass properties, device fabrication methods, and emerging applications. It provides the basis for identifying new device designs, applications, and manufacturing processes for which flexible glass substrates are uniquely suited and encourages and enables the reader to identify and pursue advanced flexible glass applications that do not exist today and provides a launching point for exciting future directions. The chapters are grouped into three sections. The first focuses on flexible glass and flexible glass reliability and has three chapters with authors from Corning. The second section focuses on flexible glass device fabrication which includes chapters on roll-to-roll processing, vacuum deposition, and printed electronics. These chapters are authored by established experts in their respective fields that have extensive experience in processing flexible glass substrates in toolsets that range from research to pilot scale. The third section focuses on flexible glass device applications and includes chapters on photovoltaics, displays, integrated photonics, and microelectronics integration. These are authored by experts with direct experience in fabricating and characterizing flexible glass devices. The diverse list of authors and their depth of experience in working with a variety of material systems, processes, and device technologies significantly adds valuable context to the overall flexible glass discussion.

The field of flexible electronics has grown rapidly over the last two decades with diverse applications including wearable gadgets and medical equipment. This textbook comprehensively covers the fundamental aspects of flexible electronics along with materials and processing techniques. It discusses topics including flexural rigidity, flexible PCBs, organic semiconductors, nanostructured materials, material reliability, electronic reliability, crystalline and polymer materials, semiconductor processing, and flexible silicon in depth. The text covers advantages, disadvantages, and applications of processes such as sol-gel processing and ink-jet printing. Pedagogical features such as solved problems and unsolved exercises are interspersed throughout the text for better understanding. FEATURES Covers major areas such as materials, physics, processes, and applications of flexible electronics Contains homework problems for readers to understand concepts in an easy manner Discusses, in detail, various types of materials, such as flexible silicon, metal oxides, and organic semiconductors Explains the application of flexible electronics in displays, solar cells, and batteries Includes a section on stretchable electronics This textbook is primarily written for senior undergraduate and graduate students in electrical engineering, electronics, materials science, chemistry, and communication engineering for a course on flexible electronics. Teaching resources are available, including a solutions manual for instructors.

Flexible Electronic Packaging and Encapsulation Technology A systematic introduction to the future of electronic packaging Electronic packaging materials are among the most important components of the broader electronics industry, capable of facilitating heat dissipation, redistributing stress on electronic components, and providing environmental protections for electronic systems. Recent advances in integrated circuits, especially the development of flexible electronic technology, have placed increasingly stringent demands on the capabilities of electronic packaging. These technologies have the potential to reshape our world, and they demand a generation of engineers capable of harnessing that potential. Flexible Electronic Packaging and Encapsulation Technology meets this demand with an introduction to the cutting-edge technologies available to package electronic components, as well as the testing methods and applications that bring these technologies to bear on the industry. These packaging technologies promise to bring lightness, flexibility, and environmental friendliness to the next generation of electronic systems. Flexible Electronic Packaging and Encapsulation Technology readers will also find: Survey of commercial electronic packaging materials and patents for reference purposes Guidelines for designing high-performance packaging materials with novel structures An authorial team of leading researchers in the field Flexible Electronic Packaging and Encapsulation Technology is ideal for materials scientists, electronics engineers, solid state physicists, professionals in the semiconductor industry, and any other researchers or professionals working with electronic systems.

This handbook provides comprehensive treatment of the current state of glass science from the leading experts in the field. Opening with an enlightening contribution on the history of glass, the volume is then divided into eight parts. The first part covers fundamental properties, from the current understanding of the thermodynamics of the amorphous state, kinetics, and linear and nonlinear optical properties through colors, photosensitivity, and chemical durability. The second part provides dedicated chapters on each individual glass type, covering traditional systems like silicates and other oxide systems, as well as novel hybrid amorphous materials and spin glasses. The third part features detailed descriptions of modern characterization techniques for understanding this complex state of matter. The fourth part covers modeling, from first-principles calculations through molecular dynamics simulations, and statistical modeling. The fifth part presents a range of laboratory and industrial glass processing methods. The remaining parts cover a wide and representative range of applications areas from optics and photonics through environment, energy, architecture, and sensing. Written by the leading international experts in the field, the Springer Handbook of Glass represents an invaluable resource for graduate students through academic and industry researchers working in photonics, optoelectronics, materials science, energy, architecture, and more.

Remarkable progress has been achieved within recent years in developing flexible, wearable, and stretchable (FWS) electronics. These electronics will play an increasingly significant role in the future of electronics and will open new product paradigms that conventional semiconductors are not capable of. This is because flexible electronics will allow us to build flexible circuits and devices on a substrate that can be bent, stretched, or folded without losing functionality. This revolutionary change will impact how we interact with the world around us. Future electronic devices will use flexible electronics as part of ambient intelligence and ubiquitous computing for many different applications such as consumer electronics, medical, healthcare, and security devices. Thus, these devices have the potential to create a huge market all over the world. Flexible, Wearable, and Stretchable Electronics, provide a comprehensive technological review of the state-of-the-art developments in FWS electronics. This book offers the reader a taste of what is possible with FWS electronics and describes how these electronics can provide unique solutions for a wide variety of applications. Furthermore, the book introduces and explains new applications of flexible technology that has opened up the future of FWS electronics.

This book details flexible glass properties that enable use in emerging electronic and opto-electronic applications. Discussion includes flexible glass advantages compared to alternative substrate materials. Examples describe flexible glass in processes such as vacuum deposition, monolithic integration, printing, and roll-to-roll. Flexible glass demonstrations in emerging applications such as photovoltaics, flexible displays, and optical interconnects are also detailed. The reader will find in this unique book: -Discussion of flexible glass processing and mechanical reliability.-Demonstration of flexible glass in roll-to-roll (R2R) fabrication processes.-Flexible glass substrate examples in displays, sensors, and photovoltaics.-Flexible glass ecosystem description for identification of new applications.

Flexible Flat Panel Displays A complete treatment of the entire lifecycle of flexible flat panel displays, from raw material selection to commercialization In the newly revised Second Edition of Flexible Flat Panel Displays, a distinguished team of researchers delivers a completely restructured and comprehensive treatment of the field of flexible flat panel displays. With material covering the end-to-end process that includes commercial and technical aspects of the technology, the editors have included contributions that introduce the business, marketing, entrepreneurship, and intellectual property content relevant to flexible flat panel displays. This edited volume contains a brand-new section on case studies using the Harvard Business School format that discusses current and emerging markets in flexible displays, such as an examination of the use of electronic ink and QD Vision in commercial devices. From raw material selection to device prototyping, manufacturing, and commercialization, each stage of the flexible display business is discussed in this insightful new edition. The book also includes: Thorough introductions to engineered films for display technology and liquid crystal optical coatings for flexible displays Comprehensive explorations of organic TFT foils, metallic nanowires, adhesives, and self-healing polymer substrates Practical discussions of flexible glass, AMOLEDs, cholesteric displays, and electronic paper In-depth examinations of the encapsulation of flexible displays, flexible batteries, flexible flat panel photodetectors, and flexible touch screens Perfect for professionals working in the field of display technology with backgrounds in science and engineering, Flexible Flat Panel Displays is also an indispensable resource for professionals with marketing, sales, and technology backgrounds, as well as senior undergraduates and graduate students in engineering and materials science.

Flexible displays are currently one of the most researched topics within the flat panel display community. They promise to change our display-centric world by replacing bulky rigid devices with those that are paper-thin and can be rolled away or folded up when not in use. The field of flexible flat panel displays is truly unique in the sense that it is interdisciplinary to the display community, combining basic principles from nearly all engineering and science disciplines. Organized to bring the reader from the component level, through display system and assembly, to the possible manufacturing routes Flexible Flat Panel Displays: * outlines the underlying scientific theory required to develop flexible display applications; * addresses the critical issues relating to the convergence of technologies including substrates, conducting layers, electro-optic materials and thin-film transistors; * provides guidance on flexible display manufacturing; and * presents market information and a chapter dedicated to future market trends of flexible flat panel displays. Flexible Flat Panel Displays is an essential tool for scientists, engineers, designers and business and marketing professionals working at all levels of the display industry. Graduate students entering the field of display technology will also find this book an excellent reference. The Society for Information Display (SID) is an international society, which has the aim of encouraging the development of all aspects of the field of information display. Complementary to the aims of the society, the Wiley-SID series is intended to explain the latest developments in information display technology at a professional level. The broad scope of the series addresses all facets of information displays from technical aspects through systems and prototypes to standards and ergonomics

This book offers a wealth of knowledge and information about the fundamental and practical aspects of flexible organic light-emitting diode (OLED) devices. The book provides an overview of these devices by considering their merits and business potential, the history of their research and development, the fundamental technology, and required properties for materials, devices, processes, and future trends of flexible OLED devices. The practical sections describe novel, cutting-edge expertise for flexible substrates, gas barriers, encapsulation, novel electrodes, and on-demand patterning for OLED devices. Applications of the technologies of ultra-thin glass, stainless steel foil, and barrier films are described as flexible substrates. The book also explains features such as dry-barrier layers, wet-barrier layers, multi-layer barrier structures, dam-fill encapsulation, thin film encapsulation (TFE), and laminating encapsulation. In addition, there are explanations of novel electrodes and on-demand ink-jet patterning, both of which are applicable to flexible OLED devices. As the novel electrodes, transparent conducting polymer, silver nanowire (AgNW), metal-mesh and roll-to-roll (R2R) process technologies are included. The know-how that is described here is applicable to flexible devices, not only for OLEDs, OPVs, OTFTs, and others but also for sensors, wearable devices, robots, and healthcare devices. The information contained in this valuable book is useful for all scientists, engineers, and managers who are interested in the field of flexible devices.

Vacuum Deposition onto Webs: Films and Foils, Third Edition, provides the latest information on vacuum deposition, the technology that applies an even coating to a flexible material that can be held on a roll, thereby offering a much faster and cheaper method of bulk coating than deposition onto single pieces or non-flexible surfaces such as glass. This technology has been used in industrial-scale applications for some time, including a wide range of metalized packaging. Its potential as a high-speed, scalable process has seen an increasing range of new products emerging that employ this cost-effective technology, including solar energy products that are moving from rigid panels onto cheaper and more versatile flexible substrates, flexible electronic circuit 'boards', and flexible displays. In this third edition, all chapters are thoroughly revised with a significant amount of new information added, including newly developed barrier measurement techniques, improved in-vacuum monitoring technologies, and the latest developments in Atomic Layer Deposition (ALD). - Provides the know-how to maximize productivity of vacuum coating systems - Thoroughly revised with a significant amount of new information added, including newly developed barrier measurement techniques, improved in-vacuum monitoring technologies, and the latest on Atomic Layer Deposition (ALD) - Presents the latest information on vacuum deposition, the technology that applies an even coating to a flexible material that can be held on a roll, thereby offering a much faster and cheaper method of bulk coating - Enables engineers to specify systems more effectively and enhances dialogue between non-specialists and suppliers/engineers - Empowers those in rapidly expanding fields such as solar energy, display panels, and flexible electronics to unlock the potential of vacuum coating to transform their processes and products