Unlike earlier electronic circuits, today's microelectronic devices demand that solder serve structural as well as electrical ends, and do so at relatively high temperature for years. Fatigue and failure of the solder has therefore become an issue in the industry. Nine studies from a May 1993 sympos

Fatigue and Durability of Structural Materials explains how mechanical material behavior relates to the design of structural machine components. The major emphasis is on fatigue and failure behavior using engineering models that have been developed to predict, in advance of service, acceptable fatigue and other durability-related lifetimes. The book covers broad classes of materials used for high-performance structural applications such as aerospace components, automobiles, and power generation systems. Coverage focuses on metallic materials but also addresses unique capabilities of important nonmetals. The concepts are applied to behavior at room or ambient temperatures; a planned second volume will address behavior at higher-temperatures. The volume is a repository of the most significant contributions by the authors to the art and science of material and structural durability over the past half century. During their careers, including 40 years of direct collaboration, they have developed a host of durability models that are based on sound physical and engineering principles. Yet, the models and interpretation of behavior have a unique simplicity that is appreciated by the practicing engineer as well as the beginning student. In addition to their own pioneering work, the authors also present the work of numerous others who have provided useful results that have moved progress in these fields. This book will be of immense value to practicing mechanical and materials engineers and designers charged with producing structural components with adequate durability. The coverage is appropriate for a range of technical levels from undergraduate engineering students through material behavior researchers and model developers. It will be of interest to personnel in the automotive and off-highway vehicle manufacturing industry, the aeronautical industry, space propulsion and the power generation/conversion industry, the electric power industry, the machine tool industry, and any industry associated with the design and manufacturing of mechanical equipment subject to cyclic loads.

Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.

Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS® to perform solder joint reliability analysis. Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.

Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites

Written by a leading researcher in the field, this revised and updated second edition of a highly successful book provides an authoritative, comprehensive and unified treatment of the mechanics and micromechanisms of fatigue in metals, non-metals and composites. The author discusses the principles of cyclic deformation, crack initiation and crack growth by fatigue, covering both microscopic and continuum aspects. The book begins with discussions of cyclic deformation and fatigue crack initiation in monocrystalline and polycrystalline ductile alloys as well as in brittle and semi-/non-crystalline solids. Total life and damage-tolerant approaches are then introduced in metals, non-metals and composites followed by more advanced topics. The book includes an extensive bibliography and a problem set for each chapter, together with worked-out example problems and case studies. This will be an important reference for anyone studying fracture and fatigue in materials science and engineering, mechanical, civil, nuclear and aerospace engineering, and biomechanics.

This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.

Handbook of Materials Failure Analysis: With Case Studies from the Electronics Industries examines the reasons materials fail in certain situations, including material defects and mechanical failure as a result of various causes. The book begins with a general overview of materials failure analysis and its importance. It then proceeds to discussions on the types of failure analysis, specific tools and techniques, and an analysis of materials failure from various causes. As failure can occur for several reasons, including materials defects-related failure, materials design-related failure, or corrosion-related failures, the topics covered in this comprehensive source are an important tool for practitioners. - Provides the most up-to-date and balanced coverage of failure analysis, combining foundational knowledge and current research on the latest developments and innovations in the field - Offers an ideal accompaniment for those interested in materials forensic investigation, failure of materials, static failure analysis, dynamic failure analysis, and fatigue life prediction - Presents compelling new case studies from key industries to demonstrate concepts

A compilation of data collected and maintained for many years as the property of a large aluminum company, which decided in 1997 to make it available to other engineers and materials specialists. In tabular form, presents data on the tensile and creep properties of eight species of wrought alloys and five species of cast alloys in the various shapes used in applications. Then looks at the fatigue data for several alloys under a range of conditions and loads. The data represent the typical or average findings, and though some were developed years ago, the collection is the largest and most detailed available. There is no index.