The papers in this volume present basic concepts and new developments in failure and damage analysis with focus on advanced materials such as composites, laminates, sandwiches and foams, and also new metallic materials. Starting from some mathematical foundations (limit surfaces, symmetry considerations, invariants) new experimental results and their analysis are shown. Finally, new concepts for failure prediction and analysis will be introduced and discussed as well as new methods of failure and damage prediction for advanced metallic and non-metallic materials. Based on experimental results the traditional methods will be revised.

Numerical Modelling of Failure in Advanced Composite Materials comprehensively examines the most recent analysis techniques for advanced composite materials. Advanced composite materials are becoming increasingly important for lightweight design in aerospace, wind energy, and mechanical and civil engineering. Essential for exploiting their potential is the ability to reliably predict their mechanical behaviour, particularly the onset and propagation of failure. Part One investigates numerical modeling approaches to interlaminar failure in advanced composite materials. Part Two considers numerical modelling approaches to intralaminar failure. Part Three presents new and emerging advanced numerical algorithms for modeling and simulation of failure. Part Four closes by examining the various engineering and scientific applications of numerical modeling for analysis of failure in advanced composite materials, such as prediction of impact damage, failure in textile composites, and fracture behavior in through-thickness reinforced laminates. - Examines the most recent analysis models for advanced composite materials in a coherent and comprehensive manner - Investigates numerical modelling approaches to interlaminar failure and intralaminar failure in advanced composite materials - Reviews advanced numerical algorithms for modeling and simulation of failure - Examines various engineering and scientific applications of numerical modelling for analysis of failure in advanced composite materials

Failure of Materials in Mechanical Design: Analysis, Prediction, Prevention, 2nd Edition, covers the basic principles of failure of metallic and non-metallic materials in mechanical design applications. Updated to include new developments on fracture mechanics, including both linear-elastic and elastic-plastic mechanics. Contains new material on strain and crack development and behavior. Emphasizes the potential for mechanical failure brought about by the stresses, strains and energy transfers in machine parts that result from the forces, deflections and energy inputs applied.

The First African InterQuadrennial ICF Conference “AIQ-ICF2008” on Damage and Fracture Mechanics – Failure Analysis of Engineering Materials and Structures”, Algiers, Algeria, June 1–5, 2008 is the first in the series of InterQuadrennial Conferences on Fracture to be held in the continent of Africa. During the conference, African researchers have shown that they merit a strong reputation in international circles and continue to make substantial contributions to the field of fracture mechanics. As in most countries, the research effort in Africa is und- taken at the industrial, academic, private sector and governmental levels, and covers the whole spectrum of fracture and fatigue. The AIQ-ICF2008 has brought together researchers and engineers to review and discuss advances in the development of methods and approaches on Damage and Fracture Mechanics. By bringing together the leading international experts in the field, AIQ-ICF promotes technology transfer and provides a forum for industry and researchers of the host nation to present their accomplishments and to develop new ideas at the highest level. International Conferences have an important role to play in the technology transfer process, especially in terms of the relationships to be established between the participants and the informal exchange of ideas that this ICF offers.

Bringing together materials mechanics and modelling, this book provides a complete guide to damage mechanics of composite materials for engineers.

This book, Failure Analysis, covers a broadest sense failure to a narrowest sense one. One purpose of this book is to provide the reader with an overall picture of various failures and how to deal with them. Another purpose is to present the latest scientific advancements in this field. For instance, an innovative concept of true stresses is introduced and is shown to be necessary in dealing with a composite failure micromechanically.

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This book presents selected peer-reviewed contributions from the 2017 International Conference on “Physics and Mechanics of New Materials and Their Applications”, PHENMA 2017 (Jabalpur, India, 14–16 October, 2017), which is devoted to processing techniques, physics, mechanics, and applications of advanced materials. The book focuses on a wide spectrum of nanostructures, ferroelectric crystals, materials and composites as well as promising materials with special properties. It presents nanotechnology approaches, modern environmentally friendly piezoelectric and ferromagnetic techniques and physical and mechanical studies of the structural and physical–mechanical properties of materials. Various original mathematical and numerical methods are applied to the solution of different technological, mechanical and physical problems that are interesting from theoretical, modeling and experimental points of view. Further, the book highlights novel devices with high accuracy, longevity and extended capabilities to operate under wide temperature and pressure ranges and aggressive media, which show improved characteristics, thanks to the developed materials and composites, opening new possibilities for different physico-mechanical processes and phenomena.

Structural Integrity and Durability of Advanced Composites: Innovative Modelling Methods and Intelligent Design presents scientific and technological research from leading composite materials scientists and engineers that showcase the fundamental issues and practical problems that affect the development and exploitation of large composite structures. As predicting precisely where cracks may develop in materials under stress is an age old mystery in the design and building of large-scale engineering structures, the burden of testing to provide "fracture safe design" is imperative. Readers will learn to transfer key ideas from research and development to both the design engineer and end-user of composite materials. This comprehensive text provides the information users need to understand deformation and fracture phenomena resulting from impact, fatigue, creep, and stress corrosion cracking and how these phenomena can affect reliability, life expectancy, and the durability of structures. - Presents scientific and technological research from leading composite materials scientists and engineers that showcase fundamental issues and practical problems - Provides the information users need to understand deformation and fracture phenomena resulting from impact, fatigue, creep, and stress corrosion cracking - Enables readers to transfer key ideas from research and development to both the design engineer and end-user of composite materials

Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites