Envelope tracking technology is seen as the most promising efficiency enhancement technology for RF power amplifiers for 4G and beyond wireless communications. More and more organizations are investing and researching on this topic with huge potential in academic and commercial areas. This is the first book on the market to offer complete introduction, theory, and design considerations on envelope tracking for wireless communications. This resource presents you with a full introduction to the subject and covers underlying theory and practical design considerations.

This cutting-edge resource presents a complete and systematic overview of the practical design considerations of radio frequency (RF) high efficiency load modulation power amplifiers (PA) for modern wireless communications for 4G and beyond. It provides comprehensive insight into all aspects of load modulation PA design and optimization not only covering design approaches specifically for passive and active load modulation operation but also hybrid with dynamic supply modulation and digital signal processing algorithms required for performance enhancement. Passive load impedance tuner design, dynamic load modulation PA, active load modulation PA and Doherty PA design for efficiently enhancement are explained. Readers find practical guidance into load modulation PA design for bandwidth extension, including video bandwidth enhancement techniques, broadband dynamic load amplifiers, topology selection, design procedures, and network output. This book presents the evolution and integration of classical load modulation PA topologies in order to meet new challenges in the field.

This extensively revised edition offers a comprehensive, practical, up-to-date understanding of how to tackle a power amplifier design with confidence and quickly determine the cause of malfunctioning hardware.

Four leaders in the field of microwave circuit design share their newest insights into the latest aspects of the technology The third edition of Microwave Circuit Design Using Linear and Nonlinear Techniques delivers an insightful and complete analysis of microwave circuit design, from their intrinsic and circuit properties to circuit design techniques for maximizing performance in communication and radar systems. This new edition retains what remains relevant from previous editions of this celebrated book and adds brand-new content on CMOS technology, GaN, SiC, frequency range, and feedback power amplifiers in the millimeter range region. The third edition contains over 200 pages of new material. The distinguished engineers, academics, and authors emphasize the commercial applications in telecommunications and cover all aspects of transistor technology. Software tools for design and microwave circuits are included as an accompaniment to the book. In addition to information about small and large-signal amplifier design and power amplifier design, readers will benefit from the book's treatment of a wide variety of topics, like: An in-depth discussion of the foundations of RF and microwave systems, including Maxwell's equations, applications of the technology, analog and digital requirements, and elementary definitions A treatment of lumped and distributed elements, including a discussion of the parasitic effects on lumped elements Descriptions of active devices, including diodes, microwave transistors, heterojunction bipolar transistors, and microwave FET Two-port networks, including S-Parameters from SPICE analysis and the derivation of transducer power gain Perfect for microwave integrated circuit designers, the third edition of Microwave Circuit Design Using Linear and Nonlinear Techniques also has a place on the bookshelves of electrical engineering researchers and graduate students. It's comprehensive take on all aspects of transistors by world-renowned experts in the field places this book at the vanguard of microwave circuit design research.

This book presents a synthesis of the research carried out in the Laboratory of Signal Processing and Communications (LaPSyC), CONICET, Universidad Nacional del Sur, Argentina, since 2003. It presents models and techniques widely used by the signal processing community, focusing on low-complexity methodologies that are scalable to different applications. It also highlights measures of the performance and impact of each compensation technique. The book is divided into three parts: 1) basic models 2) compensation techniques and 3) applications in advanced technologies. The first part addresses basic architectures of transceivers, their component blocks and modulation techniques. It also describes the performance to be taken into account, regardless of the distortions that need to be compensated. In the second part, several schemes of compensation and/or reduction of imperfections are explored, including linearization of power amplifiers, compensation of the characteristics of analog-to- digital converters and CFO compensation for OFDM modulation. The third and last part demonstrates the use of some of these techniques in modern wireless-communication systems, such as full-duplex transmission, massive MIMO schemes and Internet of Things applications.

"Power is dissipated (lost) when this current flows through any resistance, which includes the amplifier's transistor. This dissipated power is the product of the current in the load times the voltage difference between the supply voltage to the amplifier and the output signal voltage. When the voltage supplied to the amplifier is a constant value, and by far the most common design practice, the situation in Fig. 1-2a results. Power dissipation in the amplifier is maximum when the output signal voltage is 1/2 of the supply voltage. When the output signal voltage is higher, even though the current value is larger the voltage drop is less and the power dissipation is lower. Similarly, when the output signal voltage is small, even though the voltage drop is now large the current in the load is smaller and again the power dissipation is lower"--

Summarizes cutting-edge physical layer technologies for multi-mode wireless RF transceivers. Includes original contributions from distinguished researchers and professionals. Covers cutting-edge physical layer technologies for multi-mode wireless RF transceivers. Contributors are all leading researchers and professionals in this field.

This book introduces power amplifier design in 22nm FDSOI CMOS dedicated towards 5G applications at 28 GHz and presents 4 state-of-the-art power amplifier designs. The authors discuss power amplifier performance metrics, design trade-offs, and presents different power amplifier classes utilizing efficiency enhancement techniques at 28 GHz. The book presents the design process from theory, simulation, layout, and finally measurement results.

This book will provide a comprehensive technical guide covering fundamentals, recent advances and open issues in wireless communications and networks to the readers. The objective of the book is to serve as a valuable reference for students, educators, scientists, faculty members, researchers, engineers and research strategists in these rapidly evolving fields and to encourage them to actively explore these broad, exciting and rapidly evolving research areas.

To design and develop fast and effective microwave wireless systems today involves addressing the three different 'levels': Device, circuit, and system. This book presents the links and interactions between the three different levels rather than providing just a comprehensive coverage of one specific level. With the aim of overcoming the sectional knowledge of microwave engineers, this will be the first book focused on explaining how the three different levels interact by taking the reader on a journey through the different levels going from the theoretical background to the practical applications. - Explains the links and interactions between the three different design levels of wireless communication transmitters: device, circuit, and system - Presents state-of-the-art, challenges, and future trends in the field of wireless communication systems - Covers all aspects of both mature and cutting-edge technologies for semiconductor devices for wireless communication applications - Many circuit designs outlining the limitations derived from the available transistor technologies and system requirements - Explains how new microwave measurement techniques can represent an essential tool for microwave modellers and designers