The Springer Handbook of Experimental Solid Mechanics documents both the traditional techniques as well as the new methods for experimental studies of materials, components, and structures. The emergence of new materials and new disciplines, together with the escalating use of on- and off-line computers for rapid data processing and the combined use of experimental and numerical techniques have greatly expanded the capabilities of experimental mechanics. New exciting topics are included on biological materials, MEMS and NEMS, nanoindentation, digital photomechanics, photoacoustic characterization, and atomic force microscopy in experimental solid mechanics. Presenting complete instructions to various areas of experimental solid mechanics, guidance to detailed expositions in important references, and a description of state-of-the-art applications in important technical areas, this thoroughly revised and updated edition is an excellent reference to a widespread academic, industrial, and professional engineering audience.

Image Correlation for Shape, Motion and Deformation Measurements provides a comprehensive overview of data extraction through image analysis. Readers will find and in-depth look into various single- and multi-camera models (2D-DIC and 3D-DIC), two- and three-dimensional computer vision, and volumetric digital image correlation (VDIC). Fundamentals of accurate image matching are described, along with presentations of both new methods for quantitative error estimates in correlation-based motion measurements, and the effect of out-of-plane motion on 2D measurements. Thorough appendices offer descriptions of continuum mechanics formulations, methods for local surface strain estimation and non-linear optimization, as well as terminology in statistics and probability. With equal treatment of computer vision fundamentals and techniques for practical applications, this volume is both a reference for academic and industry-based researchers and engineers, as well as a valuable companion text for appropriate vision-based educational offerings.

This book provides the basic concepts and fundamental principles of dynamic systems including experimental methods, calibration, signal conditioning, data acquisition and processing as well as the results presentation. How to select suitable sensors to measure is also introduced. It is an essential reference to students, lecturers, professionals and any interested lay readers in measurement technology.

We present an application of the digital image correlation (DIC) method to high-resolution transmission electron microscopy (HRTEM) images for nanoscale deformation analysis. The combination of DIC and HRTEM offers both the ultrahigh spatial resolution and high displacement detection sensitivity that are not possible with other microscope-based DIC techniques. We demonstrate the accuracy and utility of the HRTEM-DIC technique through displacement and strain analysis on amorphous silicon. Two types of error sources resulting from the transmission electron microscopy (TEM) image noise and electromagnetic-lens distortions are quantitatively investigated via rigid-body translation experiments. The local and global DIC approaches are applied for the analysis of diffusion- and reaction-induced deformation fields in electrochemically lithiated amorphous silicon. As a result, the DIC technique coupled with HRTEM provides a new avenue for the deformation analysis of materials at the nanometer length scales.

This book shows how nanofabrication techniques and nanomaterials can be used to customize packaging for nano devices with applications to electronics, photonics, biological and biomedical research and products. It covers topics such as bio sensing electronics, bio device packaging, MEMS for bio devices and much more, including: Offers a comprehensive overview of nano and bio packaging and their materials based on their chemical and physical sciences and mechanical, electrical and material engineering perspectives; Discusses nano materials as power energy sources, computational analyses of nano materials including molecular dynamic (MD) simulations and DFT calculations; Analyzes nanotubes, superhydrophobic self-clean Lotus surfaces; Covers nano chemistry for bio sensor/bio material device packaging. This second edition includes new chapters on soft materials-enabled packaging for stretchable and wearable electronics, state of the art miniaturization for active implantable medical devices, recent LED packaging and progress, nanomaterials for recent energy storage devices such as lithium ion batteries and supercapacitors and their packaging. Nano- Bio- Electronic, Photonic and MEMS Packaging is the ideal book for all biomedical engineers, industrial electronics packaging engineers, and those engaged in bio nanotechnology applications research.

Residual stresses are an important subject in materials science and engineering that has implications across disciplines, from quantum dots to human teeth, from aeroengines to automotive surface finishing. Although a number of monographs exist, no resource is available in the form of a book to serve as a good basis for teaching the fundamentals. A Teaching Essay on Residual Stresses and Eigenstrains introduces eigenstrain methods as a powerful unified approach to residual stress modeling, measurement, and management. Starting with simple residual stress states, the key relationships are elucidated between deformation processes, inelastic strains (eigenstrains) these may introduce, and the resulting residual stress states. This book is written not only for the materials scientist, mechanical engineer, and student seeking to appreciate the origins of residual stress, but also for the more mature researcher and industrial engineer looking to improve their understanding of the eigenstrain approach to describing residual stress. - Provides a unified basis for understanding the fundamentals of residual stress origins and consequences - Introduces a classification of the most important residual stress states and their efficient description, as well as discussing measurement approaches, their limitations, and uses - Approaches the nature and application of eigenstrain methods in a systematic way to describe residual stress fields

Written by the leading experts in computational materials science, this handy reference concisely reviews the most important aspects of plasticity modeling: constitutive laws, phase transformations, texture methods, continuum approaches and damage mechanisms. As a result, it provides the knowledge needed to avoid failures in critical systems udner mechanical load. With its various application examples to micro- and macrostructure mechanics, this is an invaluable resource for mechanical engineers as well as for researchers wanting to improve on this method and extend its outreach.