The silicon age that led the computer revolution has significantly changed the world. The next 30 years will see the incorporation of new types of functionality onto the chip-structures that will enable the chip to reason, to sense, to act and to communicate. Micromachining technologies offer a wide range of possibilities for active and passive devices. Recent developments have produced sensors, actuators and optical systems. Many of these technologies are based on surface micromachining, which has evolved from silicon integrated circuit technology. This book is written by experts in the field. It contains useful details in design and processing and can be utilized as a reference book or as a textbook.

Written in a concise, easy-to-read style, this text for senior undergraduate and graduate courses covers all key topics thoroughly. It is also a useful self-study guide for practising engineers who need a complete, up-to-date review of the subject. Key features: • Rigorous theoretical treatment combined with practical detail • A theoretical framework built up systematically from the Schrödinger Wave Equation and the Boltzmann Transport Equation • Covers MOSFETS, HBTs and HJFETS • Uses the PSP model for MOSFETS • Rigorous treatment of device capacitance • Describes the operation of modern, high-performance transistors and diodes • Evaluates the suitability of various transistor types and diodes for specific modern applications • Covers solar cells and LEDs and their potential impact on energy generation and reduction • Includes a chapter on nanotransistors to prepare students and professionals for the future • Provides results of detailed numerical simulations to compare with analytical solutions • End-of-chapter exercises • Online lecture slides for undergraduate and graduate courses

This book was written by authors in the field of preparation of advanced functional materials and their wide-ranging applications. The topics in the book include: preparation of several advanced functional materials, and their applications in sensors, health, concrete, textile, glasses, and pharmacy. In this book, the authors focused on recent studies, applications, and new technological developments in fundamental properties of advanced functional materials.

The promise of MEMS for aerospace applications has been germinating for years, and current advances bring the field to the very cusp of fruition. Reliability is chief among the challenges limiting the deployment of MEMS technologies in space, as the requirement of zero failure during the mission is quite stringent for this burgeoning field. MEMS and Microstructures in Aerospace Applications provides all the necessary tools to overcome these obstacles and take MEMS from the lab bench to beyond the exosphere. The book begins with an overview of MEMS development and provides several demonstrations of past and current examples of MEMS in space. From this platform, the discussion builds to fabrication technologies; the effect of space environmental factors on MEMS devices; and micro technologies for space systems, instrumentation, communications, thermal control, guidance navigation and control, and propulsion. Subsequent chapters explore factors common to all of the described systems, such as MEMS packaging, handling and contamination control, material selection for specific applications, reliability practices for design and application, and assurance practices. Edited and contributed by an outstanding team of leading experts from industry, academia, and national laboratories, MEMS and Microstructures in Aerospace Applications illuminates the path toward qualifying and integrating MEMS devices and instruments into future space missions and developing innovative satellite systems.

This book presents the design of different switching and resonant devices using the present state-of-the-art radio frequency (RF) micromachining (MEMS) technology. Different topologies of MEMS switches have been discussed considering optimum performances over microwave to millimeter wave frequency range. Wide varieties of micromachined switching networks starting from single-pole-double-throw (SPDT) to single-pole-fourteen-throw (SP14T) are discussed utilizing vertical and lateral actuation movements of the switch. Different transduction mechanisms of micromachined resonators are highlighted that includes capacitive, piezoelectric, and piezoresistive types. The book provides major design guidelines for the development of MEMS-based digital phase shifters, tunable filters, and antennas with extensive measurement data. Apart from the radio frequency (RF) requirements, an extensive guideline is given for the improvement of the reliability of micromachined switches and digital phase shifters where multiple switches are operating simultaneously. It takes multiple iterations and extensive characterizations to conclude with a reliable MEMS digital phase shifter, and these aspects are given one of the prime attentions in this book. Detailed performance analysis of metamaterial inspired MEMS switches is then discussed for application in millimeter wave frequency bands up to about 170 GHz. The book concludes with future research activities of RF MEMS technology and its potential in space, defense, sensors, and biomedical applications.

Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.

This book discusses advances in functional thin films for sensors and novel concepts for future breakthroughs. The focus is on guidelines and design rules for sensor systems, interaction between functional thin films and other sensor subsystems, fundamentals behind the intrinsic functionality in sensing thin films and nanostructures, state-of-the-art technologies used to develop sensors today and concrete examples of sensor designs.

An introduction to micro and nano replication processes and applications Micro/Nano Replication: Processes and Applications provides an overview of the fundamentals, processes, and applications involved in micro and nano replication in the manufacturing of product parts. A major field of nanotechnology, the study of micro/nano replication is sure to become one of increasing importance as the construction of completely new devices based on innovative concepts and crafted at the molecular level increases. Designed to help the reader understand and learn to work with the growing number of tools for molding plastic components, the book covers the key topics related to replication, including patterning technology, the modification of mold surface properties, and much more. In addition, it addresses the strengths and weaknesses of different molding processes. With a strong focus not only on how micro/nano replication works, but also the broader implications for the industry, the book is packed with examples of real world applications. These are drawn from a variety of fields, including information storage devices, optoelectronic elements, optical communication, and biosensors, in order to provide a complete view of the importance of micro and nano processes. A valuable introduction to a new but fast-growing field, Micro/Nano Replication is an essential resource for anyone looking to get a head start on understanding this emerging discipline.

This issue of ECS Transactions on Semiconductor Wafer Bonding will cover the state-of-the-art R&D results of the last 2 years in the field of semiconductor wafer bonding technology. Wafer Bonding is an Enabling Technology that can be used to create novel composite materials systems and devices that would otherwise be unattainable. Wafer Bonding today is rapidly expanding into new applications in such diverse fields as photonics, sensors, MEMS. X-ray optics, non-electronic microstructures, high performance CMOS platforms for high end servers, Si-Ge, strained SOI, Germanium-on-Insulator (GeOI) and Nanotechnologies.