This thesis deals with the development of semi-analytical models for the electrical behavior of vias and traces in chip packages and printed circuit boards. A framework for automated simulation of multilayer structures is also proposed. The validation and evaluation of the models are thoroughly addressed with several test structures and application studies. It is shown that the models can provide good results up to 40 GHz, whereas the numerical efficiency is at least two orders of magnitude higher in comparison to general-purpose numerical methods.

Offers an overview of state of the art passive macromodeling techniques with an emphasis on black-box approaches This book offers coverage of developments in linear macromodeling, with a focus on effective, proven methods. After starting with a definition of the fundamental properties that must characterize models of physical systems, the authors discuss several prominent passive macromodeling algorithms for lumped and distributed systems and compare them under accuracy, efficiency, and robustness standpoints. The book includes chapters with standard background material (such as linear time-invariant circuits and systems, basic discretization of field equations, state-space systems), as well as appendices collecting basic facts from linear algebra, optimization templates, and signals and transforms. The text also covers more technical and advanced topics, intended for the specialist, which may be skipped at first reading. Provides coverage of black-box passive macromodeling, an approach developed by the authors Elaborates on main concepts and results in a mathematically precise way using easy-to-understand language Illustrates macromodeling concepts through dedicated examples Includes a comprehensive set of end-of-chapter problems and exercises Passive Macromodeling: Theory and Applications serves as a reference for senior or graduate level courses in electrical engineering programs, and to engineers in the fields of numerical modeling, simulation, design, and optimization of electrical/electronic systems. Stefano Grivet-Talocia, PhD, is an Associate Professor of Circuit Theory at the Politecnico di Torino in Turin, Italy, and President of IdemWorks. Dr. Grivet-Talocia is author of over 150 technical papers published in international journals and conference proceedings. He invented several algorithms in the area of passive macromodeling, making them available through IdemWorks. Bjørn Gustavsen, PhD, is a Chief Research Scientist in Energy Systems at SINTEF Energy Research in Trondheim, Norway. More than ten years ago, Dr. Gustavsen developed the original version of the vector fitting method with Prof. Semlyen at the University of Toronto. The vector fitting method is one of the most widespread approaches for model extraction. Dr. Gustavsen is also an IEEE fellow.

In the past decade, substrate noise has had a constant and significant impact on the design of analog and mixed-signal integrated circuits. Only recently, with advances in chip miniaturization and innovative circuit design, has substrate noise begun to plague fully digital circuits as well. To combat the effects of substrate noise, heavily over-designed structures are generally adopted, thus seriously limiting the advantages of innovative technologies. Substrate Noise: Analysis and Optimization for IC Design addresses the main problems posed by substrate noise from both an IC and a CAD designer perspective. The effects of substrate noise on performance in digital, analog, and mixed-signal circuits are presented, along with the mechanisms underlying noise generation, injection, and transport. Popular solutions to the substrate noise problem and the trade-offs often debated by designers are extensively discussed. Non-traditional approaches as well as semi-automated techniques to combat substrate noise are also addressed. Substrate Noise: Analysis and Optimization for IC Design will be of interest to researchers and professionals interested in signal integrity, as well as to mixed signal and RF designers.

The tools and techniques to fully leverage coplanar technology Coplanar Microwave Integrated Circuits sets forth the theoretical underpinnings of coplanar waveguides and thoroughly examines the various coplanar components such as discontinuities, lumped elements, resonators, couplers, and filters, which are essential for microwave integrated circuit design. Based on the results of his own research findings, the author effectively demonstrates the many advantages of coplanar waveguide technology for modern circuit design. Following a brief introductory chapter, the text thoroughly covers the material needed for successful design and realization of coplanar microwave circuits, including: * Fundamental transmission properties of coplanar waveguides using a full wave analysis * Detailed analysis of most discontinuities used in coplanar waveguide design * Lumped elements in coplanar technology that are needed in circuit design * Development of software for coplanar circuit design, including a CD-ROM containing a test version of the software for modeling coplanar circuit components and circuits * Application of derived results to build more complex components such as lumped element filters, waveguide filters, millimeter wave filters, end-coupled waveguide structures, waveguide couplers, and Wilkinson couplers for different frequency ranges in coplanar technology The final chapter focuses on special coplanar microwave integrated circuits that have been developed using the software presented in the text. The book concludes with a thought-provoking discussion of the advantages and disadvantages of the coplanar technique. Extensive use of figures and tables helps readers easily digest and visualize complex concepts. A bibliography is included at the end of each chapter for further study and research. Coplanar Microwave Integrated Circuits is recommended for graduate students and engineers in RF microwaves who want to reap all the advantages and possibilities of coplanar technology.