This book shows that with the use of metamaterials, one can have coherent THz signal generation, amplification, transmission, and detection for phase-arrayed CMOS transistors with significantly improved performance. Offering detailed coverage from device to system, the book describes the design and application of metamaterials in actual CMOS integrated circuits, includes real circuit examples and chip demonstrations with measurement results, and also evaluates system performance after CMOS-based system-on-chip integration. The book reflects the latest research progress and provides a state-of-the-art reference on CMOS-based metamaterial devices and mm-wave and THz systems.

A thorough examination of lab-on-a-chip circuit-level operations to improve system performance A rapidly aging population demands rapid, cost-effective, flexible, personalized diagnostics. Existing systems tend to fall short in one or more capacities, making the development of alternatives a priority. CMOS Integrated Lab-on-a-Chip System for Personalized Biomedical Diagnosis provides insight toward the solution, with a comprehensive, multidisciplinary reference to the next wave of personalized medicine technology. A standard complementary metal oxide semiconductor (CMOS) fabrication technology allows mass-production of large-array, miniaturized CMOS-integrated sensors from multi-modal domains with smart on-chip processing capability. This book provides an in-depth examination of the design and mechanics considerations that make this technology a promising platform for microfluidics, micro-electro-mechanical systems, electronics, and electromagnetics. From CMOS fundamentals to end-user applications, all aspects of CMOS sensors are covered, with frequent diagrams and illustrations that clarify complex structures and processes. Detailed yet concise, and designed to help students and engineers develop smaller, cheaper, smarter lab-on-a-chip systems, this invaluable reference: Provides clarity and insight on the design of lab-on-a-chip personalized biomedical sensors and systems Features concise analyses of the integration of microfluidics and micro-electro-mechanical systems Highlights the use of compressive sensing, super-resolution, and machine learning through the use of smart SoC processing Discusses recent advances in complementary metal oxide semiconductor-integrated lab-on-a-chip systems Includes guidance on DNA sequencing and cell counting applications using dual-mode chemical/optical and energy harvesting sensors The conventional reliance on the microscope, flow cytometry, and DNA sequencing leaves diagnosticians tied to bulky, expensive equipment with a central problem of scale. Lab-on-a-chip technology eliminates these constraints while improving accuracy and flexibility, ushering in a new era of medicine. This book is an essential reference for students, researchers, and engineers working in diagnostic circuitry and microsystems.

Presenting the cutting-edge results of new device developments and circuit implementations, High-Speed Devices and Circuits with THz Applications covers the recent advancements of nano devices for terahertz (THz) applications and the latest high-speed data rate connectivity technologies from system design to integrated circuit (IC) design, providing relevant standard activities and technical specifications. Featuring the contributions of leading experts from industry and academia, this pivotal work: Discusses THz sensing and imaging devices based on nano devices and materials Describes silicon on insulator (SOI) multigate nanowire field-effect transistors (FETs) Explains the theory underpinning nanoscale nanowire metal-oxide-semiconductor field-effect transistors (MOSFETs), simulation methods, and their results Explores the physics of the silicon-germanium (SiGe) heterojunction bipolar transistor (HBT), as well as commercially available SiGe HBT devices and their applications Details aspects of THz IC design using standard silicon (Si) complementary metal-oxide-semiconductor (CMOS) devices, including experimental setups for measurements, detection methods, and more An essential text for the future of high-frequency engineering, High-Speed Devices and Circuits with THz Applications offers valuable insight into emerging technologies and product possibilities that are attractive in terms of mass production and compatibility with current manufacturing facilities.

This book discusses terahertz (THz) wireless communication, particularly for 6G enabling technologies, including antenna design, and channel modeling with channel characteristics for the success of reliable 6G wireless communication. The authors describe THz microstrip antenna technologies with different substrates and introduce some useful substrates to reduce the conductor and substrate losses at the THz frequencies. The discussion also includes the design of the THz unit-cell microstrip antenna and the techniques to boost the microstrip antennas' gain, directivity, and impedance bandwidth (BW), which influence the wireless communication range which is highly affected by the path losses of atmospheric conditions, and transmit and receive data rates, respectively. Moreover, this book discusses the multi-beam and beamforming THz antenna technologies with the multi-user-multiple-input-multiple-output (MU-MIMO) features. Additionally, this book describes the reconfigurable capabilities, artificial intelligence, machine learning, and deep learning technologies that will influence the success of 6G wireless communication and the authors suggest a remedy for integrating multiple radios into the system-on-chip (SoC) design.

A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.

This book covers the theoretical background, experimental methods and implementation details to engineer for communication and imaging application, terahertz devices using metamaterials, in mainstream semiconductor foundry processes. This book will provide engineers and physicists an authoritative reference to construct such devices with minimal background. The authors describe the design and construction of electromagnetic (EM) devices for terahertz frequencies (108-1010 cycles/sec) using artificial materials that are a fraction of the wavelength of the incident EM wave, resulting in an effective electric and magnetic properties (permittivity and permeability) that are unavailable in natural materials.

This book covers terahertz antenna technology for imaging and sensing, along with its various applications. The authors discuss the use of terahertz frequency and photoconductive antenna technology for imaging applications, such as biological and bio-medical applications, non-destructive inspection of fabrics and plastics, analysis of hydration levels or detecting the presence of metallic components in samples, and detecting a variety of materials with unique spectral fingerprints in the terahertz frequency range, such as different types of explosives or several compounds used in the fabrication of medicines. Provides a comprehensive review of terahertz source and detector for imaging and sensing; Discusses photoconductive antenna technology for imaging and sensing; Presents modalities for improving the photoconductive dipole antenna performance for imaging and sensing; Explores applications in tomographic imaging, art conservation and the pharmaceutical and aerospace industries.

This book discusses antenna designs for handheld devices as well as base stations. The book serves as a reference and a handy guide for graduate students and PhD students involved in the field of millimeter wave antenna design. It also gives insights to designers and practicing engineers who are actively engaged in design of antennas for future 5G devices. It offers an in-depth study, performance analysis and extensive characterization of novel antennas for 5G applications. The reader will learn about basic design methodology and techniques to develop antennas for 5G applications including concepts of path loss compensation, co-design of commercial 4G antennas with millimeter wave 5G antennas and antennas used in phase array and pattern diversity modules. Practical examples included in the book will help readers to build high performance antennas for 5G subsystems/systems using low cost technology. Key Features Provides simple design methodology of different antennas for handheld devices as well as base stations for 5G applications. Concept of path loss compensation introduced. Co-design of commercial 4G antennas with millimetre wave 5G antennas presented. Comparison of phased array versus pattern diversity modules discussed in detail. Fabrication and Measurement challenges at mmWaves and Research Avenues in antenna designs for 5G and beyond presented. Shiban Kishen Koul is an emeritus professor at the Centre for Applied Research in Electronics at the Indian Institute of Technology Delhi. He served as the chairman of Astra Microwave Products Limited, Hyderabad from 2009-2018. He is a Life Fellow of the Institution of Electrical and Electronics Engineering (IEEE), USA, a Fellow of the Indian National Academy of Engineering (INAE), and a Fellow of the Institution of Electronics and Telecommunication Engineers (IETE). Karthikeya G S worked as an assistant professor in Visvesvaraya technological university from 2013 to 2016 and completed his PhD from the Centre for Applied Research in Electronics at the Indian Institute of Technology Delhi in Dec.2019. He is a member of IEEE-Antenna Propagation Society and Antenna Test and Measurement society.

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