Modern electronics depend on nanoscaled technologies that present new challenges in terms of testing and diagnostics. Memories are particularly prone to defects since they exploit the technology limits to get the highest density. This book is an invaluable guide to the testing and diagnostics of the latest generation of SRAM, one of the most widely applied types of memory. Classical methods for testing memory are designed to handle the so-called "static faults," but these test solutions are not sufficient for faults that are emerging in the latest Very Deep Sub-Micron (VDSM) technologies. These new fault models, referred to as "dynamic faults", are not covered by classical test solutions and require the dedicated test sequences presented in this book.

The theme for the November 2017 conference was Striving for 100% Success Rate. Papers focus on the tools and techniques needed for maximizing the success rate in every aspect of the electronic device failure analysis process.

Today's integrated silicon circuits and systems for wireless communications are of a huge complexity.This unique compendium covers all the steps (from the system-level to the transistor-level) necessary to design, model, verify, implement, and test a silicon system. It bridges the gap between the system-world and the transistor-world (between communication, system, circuit, device, and test engineers).It is extremely important nowadays (and will be more important in the future) for communication, system, and circuit engineers to understand the physical implications of system and circuit solutions based on hardware/software co-design as well as for device and test engineers to cope with the system and circuit requirements in terms of power, speed, and data throughput.Related Link(s)

This book comprises the select proceedings of the International Conference on Power Engineering Computing and Control (PECCON) 2019. This volume focuses on the different renewable energy sources which are integrated in a smart grid and their operation both in the grid connected mode and islanded mode. The contents highlight the role of power converters in the smart grid environment, battery management, electric vehicular technology and electric charging station as a load for the power network. This book can be useful for beginners, researchers as well as professionals interested in the area of smart grid technology.

The field of industrial engineering (IE) has a very wide scope, from production processes and automation to supply chain management, but the scope of IE techniques has expanded beyond the traditional domains of application, and is now relevant to areas that matter most to society at large. This book presents the proceedings of ICIEA 2023, the 10th International Conference on Industrial Engineering and Applications, held in Phuket, Thailand, from 4 to 6 April 2023. The conference was conducted in hybrid mode, with close to 100 delegates attending in person and about 50 participants attending online. A total of 272 submissions were received for the conference, of which 120 were accepted for presentation with 83 of those published here as full papers. These papers cover a wide range of topics within the scope of industrial and systems engineering, including but not limited to: supply chain and logistics; quality and reliability; advanced manufacturing; and production scheduling to ergonomics and man-machine systems interfaces. In particular, a significant number of papers are devoted to machine learning techniques and applications beyond the traditional manufacturing sector, to include healthcare, sustainability assessment, and other social issues. Offering an overview of recent research and novel applications, the book will be of interest to all those whose work involves the application of industrial engineering techniques.

Rad-hard Semiconductor Memories is intended for researchers and professionals interested in understanding how to design and make a preliminary evaluation of rad-hard semiconductor memories, making leverage on standard CMOS manufacturing processes available from different silicon foundries and using different technology nodes.In the first part of the book, a preliminary overview of the effects of radiation in space, with a specific focus on memories, will be conducted to enable the reader to understand why specific design solutions are adopted to mitigate hard and soft errors. The second part will be devoted to RHBD (Radiation Hardening by Design) techniques for semiconductor components with a specific focus on memories. The approach will follow a top-down scheme starting from RHBD at architectural level (how to build a rad-hard floor-plan), at circuit level (how to mitigate radiation effects by handling transistors in the proper way) and at layout level (how to shape a layout to mitigate radiation effects).After the description of the mitigation techniques, the book enters in the core of the topic covering SRAMs (synchronous, asynchronous, single port and dual port) and PROMs (based on AntiFuse OTP technologies), describing how to design a rad-hard flash memory and fostering RHBD toward emerging memories like ReRAM. The last part will be a leap into emerging memories at a very early stage, not yet ready for industrial use in silicon but candidates to become an option for the next wave of rad-hard components. Technical topics discussed in the book include:  Radiation effects on semiconductor components (TID, SEE) Radiation Hardening by Design (RHBD) Techniques Rad-hard SRAMs Rad-hard PROMs Rad-hard Flash NVMs Rad-hard ReRAMs Rad-hard emerging technologies

​This two-volume set (CCIS 1075 and CCIS 1076) constitutes the refereed proceedings of the Third International Conference on Advanced Informatics for Computing Research, ICAICR 2019, held in Shimla, India, in June 2019. The 78 revised full papers presented were carefully reviewed and selected from 382 submissions. The papers are organized in topical sections on computing methodologies; hardware; information systems; networks; software and its engineering.

"This book covers aspects of system design and efficient modelling, and also introduces various fault models and fault mechanisms associated with digital circuits integrated into System on Chip (SoC), Multi-Processor System-on Chip (MPSoC) or Network on Chip (NoC)"--

This book contains extended and revised versions of the best papers presented at the 25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, held in Abu Dhabi, United Arab Emirates, in August 2017. The 11 papers included in this book were carefully reviewed and selected from the 33 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the latest scientific and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) Design. On the occasion of the silver jubilee of the VLSI-SoC conference series the book also includes a special chapter that presents the history of the VLSI-SoC series of conferences and its relation with VLSI-SoC evolution since the early 80s up to the present.

This book describes efficient techniques for production testing as well as for periodic maintenance testing (specifically in terms of multi-cell faults) in modern semiconductor memory. The author discusses background selection and address reordering algorithms in multi-run transparent march testing processes. Formal methods for multi-run test generation and many solutions to increase their efficiency are described in detail. All methods presented ideas are verified by both analytical investigations and numerical simulations. Provides the first book related exclusively to the problem of multi-cell fault detection by multi-run tests in memory testing process; Presents practical algorithms for design and implementation of efficient multi-run tests; Demonstrates methods verified by analytical and experimental investigations.