During the past years, wireless communication systems have been rapidly advancing to meet the high data-rate requirements of various emerging applications. However, the existing transceivers have typically been demonstrated using CMOS-compatible technologies that deliver a relatively low equivalent isotropic radiated power in a small unit cell. Moreover, the particular device characteristics are limiting the linear region for operation. Therefore, the main focus of this dissertation is to present and discuss new design methods for transceivers to solve these issues. To reduce the complexity of the transceiver module for further phased-array scaling, a low-noise power amplifier design approach is designed using a 0.15-μm GaN-on-SiC high-electron mobility transistor technology (HEMT). Utilizing a traded off interstage matching topology between loss and bandwidth, the conversion loss induced by the matching network could be effectively reduced. A stacked-FET configuration was adopted to enhance the power handling of the RF switch. Further improvement on the isolation bandwidth was investigated using theoretical analysis on the intrinsic effect of the passive HEMTs. With the successful implementation of the RF front-end circuits, transceiver modules were integrated on Rogers RO3010 substrate. The planar dual exponentially tapered slot antenna phased-array system showed a compact size with simple biasing network compared to the conventional transceiver approach. The presented T/R module was characterized with an over-the-air test at a distance of 1 m, overcoming the free space path loss of 64 dB. It also shows a high flexibility for further integration with a larger number of array systems, which is very promising for future 5G communication systems.

The aim of this book is to present the modern design and analysis principles of millimeter-wave communication system for wireless devices and to give postgraduates and system professionals the design insights and challenges when integrating millimeter wave personal communication system. Millimeter wave communication system are going to play key roles in modern gigabit wireless communication area as millimeter-wave industrial standards from IEEE, European Computer Manufacturing Association (ECMA) and Wireless High Definition (Wireless HD) Group, are on their way to the market. The book will review up-to-date research results and utilize numerous design and analysis for the whole system covering from Millimeter wave frontend to digital signal processing in order to address major topics in a high speed wireless system. This book emphasizes the importance and the requirements of high-gain antennas, low power transceiver, adaptive equalizer/modulation, channeling coding and adaptive multi-user detection for gigabit wireless communications. In addition, the book will include the updated research literature and patents in the topics of transceivers, antennas, MIMO, channel capacity, coding, equalizer, Modem and multi-user detection. Finally the application of these antennas will be discussed in light of different forthcoming wireless standards at V-band and E-band.

A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.

During the past years, wireless communication systems have been rapidly advancing to meet the high data-rate requirements of various emerging applications. However, the existing transceivers have typically been demonstrated using CMOS-compatible technologies that deliver a relatively low equivalent isotropic radiated power in a small unit cell. Moreover, the particular device characteristics are limiting the linear region for operation. Therefore, the main focus of this dissertation is to present and discuss new design methods for transceivers to solve these issues. To reduce the complexity of the transceiver module for further phased-array scaling, a low-noise power amplifier design approach is designed using a 0.15-μm GaN-on-SiC high-electron mobility transistor technology (HEMT). Utilizing a traded off interstage matching topology between loss and bandwidth, the conversion loss induced by the matching network could be effectively reduced. A stacked-FET configuration was adopted to enhance the power handling of the RF switch. Further improvement on the isolation bandwidth was investigated using theoretical analysis on the intrinsic effect of the passive HEMTs. With the successful implementation of the RF front-end circuits, transceiver modules were integrated on Rogers RO3010 substrate. The planar dual exponentially tapered slot antenna phased-array system showed a compact size with simple biasing network compared to the conventional transceiver approach. The presented T/R module was characterized with an over-the-air test at a distance of 1 m, overcoming the free space path loss of 64 dB. It also shows a high flexibility for further integration with a larger number of array systems, which is very promising for future 5G communication systems.

The Definitive, Comprehensive Guide to Cutting-Edge Millimeter Wave Wireless Design “This is a great book on mmWave systems that covers many aspects of the technology targeted for beginners all the way to the advanced users. The authors are some of the most credible scholars I know of who are well respected by the industry. I highly recommend studying this book in detail.” —Ali Sadri, Ph.D., Sr. Director, Intel Corporation, MCG mmWave Standards and Advanced Technologies Millimeter wave (mmWave) is today's breakthrough frontier for emerging wireless mobile cellular networks, wireless local area networks, personal area networks, and vehicular communications. In the near future, mmWave products, systems, theories, and devices will come together to deliver mobile data rates thousands of times faster than today's existing cellular and WiFi networks. In Millimeter Wave Wireless Communications, four of the field's pioneers draw on their immense experience as researchers, entrepreneurs, inventors, and consultants, empowering engineers at all levels to succeed with mmWave. They deliver exceptionally clear and useful guidance for newcomers, as well as the first complete desk reference for design experts. The authors explain mmWave signal propagation, mmWave circuit design, antenna designs, communication theory, and current standards (including IEEE 802.15.3c, Wireless HD, and ECMA/WiMedia). They cover comprehensive mmWave wireless design issues, for 60 GHz and other mmWave bands, from channel to antenna to receiver, introducing emerging design techniques that will be invaluable for research engineers in both industry and academia. Topics include Fundamentals: communication theory, channel propagation, circuits, antennas, architectures, capabilities, and applications Digital communication: baseband signal/channel models, modulation, equalization, error control coding, multiple input multiple output (MIMO) principles, and hardware architectures Radio wave propagation characteristics: indoor and outdoor applications Antennas/antenna arrays, including on-chip and in-package antennas, fabrication, and packaging Analog circuit design: mmWave transistors, fabrication, and transceiver design approaches Baseband circuit design: multi–gigabit-per-second, high-fidelity DAC and ADC converters Physical layer: algorithmic choices, design considerations, and impairment solutions; and how to overcome clipping, quantization, and nonlinearity Higher-layer design: beam adaptation protocols, relaying, multimedia transmission, and multiband considerations 60 GHz standardization: IEEE 802.15.3c for WPAN, Wireless HD, ECMA-387, IEEE 802.11ad, Wireless Gigabit Alliance (WiGig)

This book comprehensively reviews the state of the art in millimeter-wave antennas, traces important recent developments and provides information on a wide range of antenna configurations and applications. While fundamental theoretical aspects are discussed whenever necessary, the book primarily focuses on design principles and concepts, manufacture, measurement techniques, and practical results. Each of the various antenna types scalable to millimeter-wave dimensions is considered individually, with coverage of leaky-wave and surface-wave antennas, printed antennas, integrated antennas, and reflector and lens systems. The final two chapters address the subject from a systems perspective, providing an overview of supporting circuitry and examining in detail diverse millimeter-wave applications, including high-speed wireless communications, radio astronomy, and radar. The vast amount of information now available on millimeter-wave systems can be daunting for researchers and designers entering the field. This book offers readers essential guidance, helping them to gain a thorough understanding based on the most recent research findings and serving as a sound basis for informed decision-making.

This book discusses antenna designs for handheld devices as well as base stations. The book serves as a reference and a handy guide for graduate students and PhD students involved in the field of millimeter wave antenna design. It also gives insights to designers and practicing engineers who are actively engaged in design of antennas for future 5G devices. It offers an in-depth study, performance analysis and extensive characterization of novel antennas for 5G applications. The reader will learn about basic design methodology and techniques to develop antennas for 5G applications including concepts of path loss compensation, co-design of commercial 4G antennas with millimeter wave 5G antennas and antennas used in phase array and pattern diversity modules. Practical examples included in the book will help readers to build high performance antennas for 5G subsystems/systems using low cost technology. Key Features Provides simple design methodology of different antennas for handheld devices as well as base stations for 5G applications. Concept of path loss compensation introduced. Co-design of commercial 4G antennas with millimetre wave 5G antennas presented. Comparison of phased array versus pattern diversity modules discussed in detail. Fabrication and Measurement challenges at mmWaves and Research Avenues in antenna designs for 5G and beyond presented. Shiban Kishen Koul is an emeritus professor at the Centre for Applied Research in Electronics at the Indian Institute of Technology Delhi. He served as the chairman of Astra Microwave Products Limited, Hyderabad from 2009-2018. He is a Life Fellow of the Institution of Electrical and Electronics Engineering (IEEE), USA, a Fellow of the Indian National Academy of Engineering (INAE), and a Fellow of the Institution of Electronics and Telecommunication Engineers (IETE). Karthikeya G S worked as an assistant professor in Visvesvaraya technological university from 2013 to 2016 and completed his PhD from the Centre for Applied Research in Electronics at the Indian Institute of Technology Delhi in Dec.2019. He is a member of IEEE-Antenna Propagation Society and Antenna Test and Measurement society.

Examine the challenges of 4G in the light of impending and crucial future communication needs, and review the lessons learned from an implementation and system operation perspective with an eye towards the next generation – 5G. You'll investigate key changes and additions to 5G in terms of use cases. You'll also learn about the applications for and explorations of the technology. Among all of the technological disruptions, two stand out in particular – mmWave and spectrum sharing technologies. Rolling Out 5G features detailed coverage of these two critical topics, and for the first time among 5G learning resources presents a holistic perspective on key ingredients for mobile communication in a 5G world. The authors represent highly experienced experts with valuable know-how in the field of wireless communications related research projects defining future technological trends. This unique group of talents will be able to consider the 5G technology evolution from all angles mentioned: long-term research, standardization and regulation, product design and marketization. This approach allows this much-needed book to capture the views of all key decision making stake-holders involved in the 5G definition process, and to serve readers in their roles connected with wireless communication's next generation of products and services. What You'll Learn See how 5G is expected to overcome 4G insufficiencies and challenges Examine expected 5G features, including usage of millimeter wave communication and licensed shared access Review key milestones of the next generation wireless communication technology including key standardization and regulation bodies Study new technologies and upcoming changes in feature sets and client expectations. Who This Book Is For Engineers of mobile device and infrastructure manufacturing industries, development engineers of semiconductor manufacturing industries, and engineers with a general interest in the field. Mobile network operators, along with students and business professionals in the telecommunications domain will also find the topic of interest.