The United States, Taiwan, and China are bound within a "silicon triangle." Semiconductors link our geopolitics, our ongoing economic prosperity, and our technological competitiveness. This book draws on the deliberations of a multidisciplinary Hoover Institution–Asia Society working group of technologists, economists, military strategists, industry players, and regional policy experts to contemplate the dynamic global supply chain in semiconductors—one in which US industry faces growing vulnerabilities, China aggressively promotes home-grown semiconductor mastery, and Taiwan finds itself with a crucial monopoly on high-end logic chips sought by buyers globally. Silicon Triangle seeks to present a balanced view of how policies of the United States and its partners around semiconductors can increase the resilience of shared supply chains—and contribute to deterring conflict in the Taiwan Strait.

Taiwan's Protection Against Chinese Attack

The Silicon Dragon is a systematic study of the growth of high-tech giants in the Greater China Region, depicting the success story of the microelectronics industry in Taiwan. Literature and studies on Taiwan s success are surprisingly limited, and this book aims to fill this gap, addressing questions such as: How has Taiwan achieved such an outstanding performance in the information industry? How did Taiwan obtain and maintain its competitive advantage? What was the secret of success? What role did the government and manufacturers play during the development process? What insights can newcomers gain from these achievements? The book examines the government policies that acted as catalysts to the growth of high-tech industries in Taiwan, along with the roles of high-tech incubators and government-administered science parks. The authors provide case studies of high profile companies including Acer, Philips Semiconductors and Macronix International, and interviews with key decision makers to highlight the corporate strategies adopted in response to government policies and global commercial demand. Finally, insightful narratives on the birth and growth of a government-fostered strategic industry are provided, as is a synopsis of the Asian contribution to the evolution of the global microelectronics development. This book will strongly appeal to academics, researchers and students with an interest in engineering, technology and business management. Business managers and government officials will also find much to interest them in this book.

Over the years, the fundamentals of VLSI technology have evolved to include a wide range of topics and a broad range of practices. To encompass such a vast amount of knowledge, The VLSI Handbook focuses on the key concepts, models, and equations that enable the electrical engineer to analyze, design, and predict the behavior of very large-scale integrated circuits. It provides the most up-to-date information on IC technology you can find. Using frequent examples, the Handbook stresses the fundamental theory behind professional applications. Focusing not only on the traditional design methods, it contains all relevant sources of information and tools to assist you in performing your job. This includes software, databases, standards, seminars, conferences and more. The VLSI Handbook answers all your needs in one comprehensive volume at a level that will enlighten and refresh the knowledge of experienced engineers and educate the novice. This one-source reference keeps you current on new techniques and procedures and serves as a review for standard practice. It will be your first choice when looking for a solution.

A comprehensive guide to MEMS materials, technologies and manufacturing, examining the state of the art with a particular emphasis on current and future applications. Key topics covered include: - Silicon as MEMS material - Material properties and measurement techniques - Analytical methods used in materials characterization - Modeling in MEMS - Measuring MEMS - Micromachining technologies in MEMS - Encapsulation of MEMS components - Emerging process technologies, including ALD and porous silicon Written by 73 world class MEMS contributors from around the globe, this volume covers materials selection as well as the most important process steps in bulk micromachining, fulfilling the needs of device design engineers and process or development engineers working in manufacturing processes. It also provides a comprehensive reference for the industrial R&D and academic communities. - Veikko Lindroos is Professor of Physical Metallurgy and Materials Science at Helsinki University of Technology, Finland. - Markku Tilli is Senior Vice President of Research at Okmetic, Vantaa, Finland. - Ari Lehto is Professor of Silicon Technology at Helsinki University of Technology, Finland. - Teruaki Motooka is Professor at the Department of Materials Science and Engineering, Kyushu University, Japan. - Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques - Shows how to protect devices from the environment and decrease package size for dramatic reduction of packaging costs - Discusses properties, preparation, and growth of silicon crystals and wafers - Explains the many properties (mechanical, electrostatic, optical, etc), manufacturing, processing, measuring (incl. focused beam techniques), and multiscale modeling methods of MEMS structures

Radio-Frequency Integrated-Circuit Engineering addresses the theory, analysis and design of passive and active RFIC's using Si-based CMOS and Bi-CMOS technologies, and other non-silicon based technologies. The materials covered are self-contained and presented in such detail that allows readers with only undergraduate electrical engineering knowledge in EM, RF, and circuits to understand and design RFICs. Organized into sixteen chapters, blending analog and microwave engineering, Radio-Frequency Integrated-Circuit Engineering emphasizes the microwave engineering approach for RFICs. * Provides essential knowledge in EM and microwave engineering, passive and active RFICs, RFIC analysis and design techniques, and RF systems vital for RFIC students and engineers * Blends analog and microwave engineering approaches for RFIC design at high frequencies * Includes problems at the end of each chapter

Proceedings of the 1991 Cryogenic Engineering Conference held in Huntsville, Alabama, June 11-14, 1991.