The success of future innovative technology relies upon a community with a shared vision. Here, we present an overview of the latest technological progress in the field of printed electronics for use in harsh or extreme environments. Each chapter unlocksscientific and engineering discoveries that will undoubtedly lead to progression from proof of concept to device creation. The main topics covered in this book include some of the most promising materials, methods, and the ability to integrate printed materials with commercial components to provide the basis for the next generation of electronics that are dubbed “survivable” in environments with high g‐orces, corrosion, vibration, and large temperature fluctuations. A wide variety of materials are discussed that contribute to robust hybrid electronics, including printable conductive composite inks, ceramics and ceramic matrix composites, polymer‐erived ceramics, thin metal films, elastomers, solders and epoxies, to name a few. Collectively, these materials and associated components are used to construct conductive traces, interconnects, antennas, pressure sensors, temperature sensors, power inducting devices, strain sensors and gauges, soft actuators, supercapacitors, piezo ionic elements, resistors, waveguides, filters, electrodes, batteries, various detectors, monitoring devices, transducers, and RF systems and graded dielectric, or graded index (GRIN) structures. New designs that incorporate the electronics as embedded materials into channels, slots and other methods to protect the electronics from the extreme elements of the operational environment are also envisioned to increase their survivability while remaining cognizant of the required frequency of replacement, reapplication and integration of power sources. Lastly, the ability of printer manufacturers, software providers and users to work together to build multi‐axis, multi‐material and commercial‐off‐the‐shelf (COTS) integration into user‐friendly systems will be a great advancement for the field of printed electronics. Therefore, the blueprint for manufacturing resilient hybrid electronics consists of novel designs that exploit the benefits of advances in additive manufacturing that are then efficiently paired with commercially available components to produce devices that exceed known constraints. As a primary example, metals can be deposited onto polymers in a variety of ways, including aerosol jetting, microdispensing, electroplating, sintering, vacuum deposition, supersonic beam cluster deposition, and plasma‐based techniques, to name a few. Taking these scientific discoveries and creatively combining them into robotic, multi‐material factories of the future could be one shared aim of the printed electronics community toward survivable device creation.

Resilient and Survivable Hybrid Electronics

This book provides readers with expert knowledge on the design of fast charging infrastructures and their planning in smart cities and communities to support autonomous transportation. The recent development of fast charging infrastructures using hybrid energy systems is examined, along with aspects of connected and autonomous vehicles (CAV) and their integration within transportation networks and city infrastructures. The book looks at challenges and opportunities for autonomous transportation, including connected and autonomous vehicles, shuttles, and their technology development and deployment within smart communities. Intelligent control strategies, architectures, and systems are also covered, along with intelligent data centers that ensure effective transportation networks during normal and emergency situations. Planning strategies are presented to demonstrate the resilient transportation infrastructures, and optimized performance is discussed in view of performance indicators and requirements specifications, as well as regulations and standards.

Rugged Embedded Systems: Computing in Harsh Environments describes how to design reliable embedded systems for harsh environments, including architectural approaches, cross-stack hardware/software techniques, and emerging challenges and opportunities. A "harsh environment" presents inherent characteristics, such as extreme temperature and radiation levels, very low power and energy budgets, strict fault tolerance and security constraints, etc. that challenge the computer system in its design and operation. To guarantee proper execution (correct, safe, and low-power) in such scenarios, this contributed work discusses multiple layers that involve firmware, operating systems, and applications, as well as power management units and communication interfaces. This book also incorporates use cases in the domains of unmanned vehicles (advanced cars and micro aerial robots) and space exploration as examples of computing designs for harsh environments. - Provides a deep understanding of embedded systems for harsh environments by experts involved in state-of-the-art autonomous vehicle-related projects - Covers the most important challenges (fault tolerance, power efficiency, and cost effectiveness) faced when developing rugged embedded systems - Includes case studies exploring embedded computing for autonomous vehicle systems (advanced cars and micro aerial robots) and space exploration

Applications of Composite Materials in Engineering provides an up-to-date review of recent application advancements in different engineering fields. The book concentrates on the availability and utilization of various fibers and reinforcements in composites and analyzes the suitability of them in different engineering and commercial applications. The latest research as well as possible application avenues for the future are discussed in detail. - Covers a diverse range of applications in structural, electronic, thermal, electrochemical, environmental, and biomedical engineering - Includes recent developments in metal- matrix, ceramic- matrix and polymer-matrix composites - Provides a clear understanding of the present state-of-the-art and the growing utility of hybrid polymer composite materials

Research on radiation-tolerant electronics has increased rapidly over the past few years, resulting in many interesting approaches to modeling radiation effects and designing radiation-hardened integrated circuits and embedded systems. This research is strongly driven by the growing need for radiation-hardened electronics for space applications, high-energy physics experiments such as those on the Large Hadron Collider at CERN, and many terrestrial nuclear applications including nuclear energy and nuclear safety. With the progressive scaling of integrated circuit technologies and the growing complexity of electronic systems, their susceptibility to ionizing radiation has raised many exciting challenges, which are expected to drive research in the coming decade. In this book we highlight recent breakthroughs in the study of radiation effects in advanced semiconductor devices, as well as in high-performance analog, mixed signal, RF, and digital integrated circuits. We also focus on advances in embedded radiation hardening in both FPGA and microcontroller systems and apply radiation-hardened embedded systems for cryptography and image processing, targeting space applications.