This book includes original, peer-reviewed research papers from the 2023 4th International Symposium on Insulation and Discharge Computation for Power Equipment (IDCOMPU2023), held in Wuhan, China. The topics covered include but are not limited to: insulation, discharge computations, electric power equipment, and electrical materials. The papers share the latest findings in the field of insulation and discharge computations of electric power equipment, making the book a valuable asset for researchers, engineers, university students, etc.

This book includes high quality research papers presented at the International Conference on Communication, Computing and Electronics Systems 2021, held at the PPG Institute of Technology, Coimbatore, India, on 28-29 October 2021. The volume focuses mainly on the research trends in cloud computing, mobile computing, artificial intelligence and advanced electronics systems. The topics covered are automation, VLSI, embedded systems, optical communication, RF communication, microwave engineering, artificial intelligence, deep learning, pattern recognition, communication networks, Internet of Things, cyber-physical systems, and healthcare informatics.

The 2018 IEEE International Conference on High Voltage Engineering (ICHVE 2018) was held on 10–13 September 2018 in Athens, Greece, organized by the National Technical University of Athens, Greece, and endorsed by the IEEE Dielectrics and Electrical Insulation Society. This conference has attracted a great deal of attention from international researchers in the field of high voltage engineering. This conference provided not only an excellent platform to share knowledge and experiences on high voltage engineering, but also the opportunity to present the latest achievements and different emerging challenges in power engineering, including topics related to ultra-high voltage, smart grids, and new insulation materials and their dielectric properties.

This book illustrates interfacial properties, preparation, characterization, devices, and applications from the standpoint of nano-interfacial tailoring. Since the primary focus of the book is on the use of nanocomposite dielectrics in electrical applications, chapters are devoted to directly relevant topics, such as surface and bulk breakdown processes. However, the mechanisms that underpin such behavior are not unique. Therefore, the book also addresses related topics that range from the chemistry of polymer and nanocomposite degradation to the simulation of charge transport dynamics in disordered materials, thereby presenting a multi- and interdisciplinary approach to the area. It will serve as a practical handbook or graduate textbook and is supplemented by ample number of illustrations, case studies, practical examples, and historical perspectives.

Studies on new solutions in the field of high-voltage insulating materials are presented in this book. Most of these works concern liquid insulation, especially biodegradable ester fluids; however, in a few cases, gaseous and solid insulation are also considered. Both fundamental research as well as research related to industrial applications are described. In addition, experimental techniques aimed at possibly finding new ways of analysing the experimental data are proposed to test dielectrics.

Resumen: The 2nd edition contains new chapters on contamination and contamination control that describe the basics and the issues. Another new chapter on meteorology explains the growth of sophisticated, automatic tools capable of measuring thickness and spacing of sub-micron dimensions. The book also covers PVD, laser and e-beam assisted deposition, MBE, and ion beam methods to bring together physical vapor deposition techniques. Two entirely new areas are focused on: chemical mechanical polishing, which helps attain the flatness that is required by modern lithography methods, and new materials used for interconnect dielectric materials, specifically organic polyimide materials.

In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.

The book gives the reader an overview on electrical properties and applications such as converter transformer, transistor, and energy storage. Besides, this book also presents some recent researches on typical polymer material such as silicon rubber and LDPE, which may provide some clues of advanced polymer properties for both engineers and researches. The author has been a professor at the Department of Electrical Engineering, School of Electrical Engineering and Automation, Tianjin University, China, since 2002. He has been active in polymer insulation research since the 1990s. He is a member of IEEJ, senior member of CSEE, member at several WG in CIGRE, and associate editor of the IEEE Transactions on Dielectrics and Electrical Insulation.