Physical processes taking place in micro/nanoscale strongly depend on the material types and can be very complicated. Known approaches include kinetic theory and quantum mechanics, non-equilibrium and irreversible thermodynamics, molecular dynamics, and/or fractal theory and fraction model. Due to innately different physical bases employed, different approaches may involve different physical properties in describing micro/nanoscale heat transport. In addition, the parameters involved in different approaches, may not be mutually inclusive. Macro- to Microscale Heat Transfer: The Lagging Behavior, Second Edition continues the well-received concept of thermal lagging through the revolutionary approach that focuses on the finite times required to complete the various physical processes in micro/nanoscale. Different physical processes in heat/mass transport imply different delay times, which are common regardless of the material type. The delay times, termed phase lags, are characteristics of materials. Therefore the dual-phase-lag model developed is able to describe eleven heat transfer models from macro to nanoscale in the same framework of thermal lagging. Recent extensions included are the lagging behavior in mass transport, as well as the nonlocal behavior in space, bearing the same merit of thermal lagging in time, in shrinking the ultrafast response down to the nanoscale. Key features: Takes a unified approach describing heat and mass transport from macro, micro to nanoscale Compares experimental results for model validation Includes easy to follow mathematical formulation Accompanied by a website hosting supporting material Macro- to Microscale Heat Transfer: The Lagging Behavior, Second Edition is a comprehensive reference for researchers and practitioners, and graduate students in mechanical, aerospace, biological and chemical engineering.

Set III of this encyclopedia is a new addition to the previous Sets I and II. It contains 26 invited chapters from international specialists on the topics of numerical modeling of two-phase flows and evaporation, fundamentals of evaporation and condensation in microchannels and macrochannels, development and testing of micro two-phase cooling systems for electronics, and various special topics (surface wetting effects, microfin tubes, two-phase flow vibration across tube bundles). The chapters are written both by renowned university researchers and by well-known engineers from leading corporate research laboratories. Numerous 'must read' chapters cover the fundamentals of research and engineering practice on boiling, condensation and two-phase flows, two-phase heat transfer equipment, electronics cooling systems, case studies and so forth. Set III constitutes a 'must have' reference together with Sets I and II for thermal engineering researchers and practitioners.

This volume contains an archival record of the NATO Advanced Institute on Microscale Heat Transfer – Fundamental and Applications in Biological and Microelectromechanical Systems held in Çesme – Izmir, Turkey, July 18–30, 2004. The ASIs are intended to be high-level teaching activity in scientific and technical areas of current concern. In this volume, the reader may find interesting chapters and various Microscale Heat Transfer Fundamental and Applications. The growing use of electronics, in both military and civilian applications has led to the widespread recognition for need of thermal packaging and management. The use of higher densities and frequencies in microelectronic circuits for computers are increasing day by day. They require effective cooling due to heat generated that is to be dissipated from a relatively low surface area. Hence, the development of efficient cooling techniques for integrated circuit chips is one of the important contemporary applications of Microscale Heat Transfer which has received much attention for cooling of high power electronics and applications in biomechanical and aerospace industries. Microelectromechanical systems are subject of increasing active research in a widening field of discipline. These topics and others are the main themeof this Institute.

This substantially updated and augmented second edition adds over 200 pages of text covering and an array of newer developments in nanoscale thermal transport. In Nano/Microscale Heat Transfer, 2nd edition, Dr. Zhang expands his classroom-proven text to incorporate thermal conductivity spectroscopy, time-domain and frequency-domain thermoreflectance techniques, quantum size effect on specific heat, coherent phonon, minimum thermal conductivity, interface thermal conductance, thermal interface materials, 2D sheet materials and their unique thermal properties, soft materials, first-principles simulation, hyperbolic metamaterials, magnetic polaritons, and new near-field radiation experiments and numerical simulations. Informed by over 12 years use, the author’s research experience, and feedback from teaching faculty, the book has been reorganized in many sections and enriched with more examples and homework problems. Solutions for selected problems are also available to qualified faculty via a password-protected website.• Substantially updates and augments the widely adopted original edition, adding over 200 pages and many new illustrations;• Incorporates student and faculty feedback from a decade of classroom use;• Elucidates concepts explained with many examples and illustrations;• Supports student application of theory with 300 homework problems;• Maximizes reader understanding of micro/nanoscale thermophysical properties and processes and how to apply them to thermal science and engineering;• Features MATLAB codes for working with size and temperature effects on thermal conductivity, specific heat of nanostructures, thin-film optics, RCWA, and near-field radiation.

Heat Transport in Micro- and Nanoscale Thin Films presents aspects and applications of the principle methods of heat transport in relation to nanoscale films. Small-scale parts and thin films are widely used in the electronics industry. However, the drastic change in the thermal conductivity with reducing device size and film thickness modifies the energy transport by heat-carrying phonons in the film. Energy transfer in small-sized devices and thin films deviate from the classical diffusion to radiative transport. This book deals with micro/nano scale heat transfer in small scale devices and the thin films, including interface properties of cross-plane transport. The book fills the gap between applications of the physical fundamentals and energy transport at the micro- and nano scale, which will be valuable for academics, researchers and students in the fields of materials science and energy transport. - Offers a specialist focus on nanoscale thin films, allowing the reader to create more efficient heat transfer systems - Includes in-depth coverage of the formulation of transient energy transport for short durations of heating, which is valuable those working in electronics - Focuses on applications and real-life case studies to clearly illustrate how the theories explained in the book can be used in industry

Advances in Heat Transfer, Volume 52, provides in-depth review articles from a broader scope than in traditional journals or texts, with this comprehensive release covering chapters on Thermal Convection Studies at the University of Minnesota, Convective heat transfer in porous passages that depends on the values of the Sparrow numbers, Automatic Code Differentiation for Thermal-Fluid Problems, Advances in Vapor Chambers and Phase Change Heat Spreaders, Pressure Drop and Heat Transfer in the Entrance Region of Microchannels, Predicting spectral thermal conductivity at the mesoscale with advanced deterministic phonon transport techniques, and Modulated-heating protocols applied to hyperthermia/thermal ablation. - Fills the information gap between regularly scheduled journals and university-level textbooks by providing in-depth review articles over a broader scope than in traditional journals or texts - Provides essential reading for all mechanical, chemical and industrial engineers working in the field of heat transfer - Presents a great resource for use in graduate school level courses

This volume discusses the advances in numerical heat transfer modeling by applying high-performance computing resources, striking a balance between generic fundamentals, specific fundamentals, generic applications, and specific applications.

This book presents generalized heat-conduction laws which, from a mesoscopic perspective, are relevant to new applications (especially in nanoscale heat transfer, nanoscale thermoelectric phenomena, and in diffusive-to-ballistic regime) and at the same time keep up with the pace of current microscopic research. The equations presented in the book are compatible with generalized formulations of nonequilibrium thermodynamics, going beyond the local-equilibrium. The book includes six main chapters, together with a preface and a final section devoted to the future perspectives, as well as an extensive bibliography.

This textbook presents the classical topics of conduction heat transfer and extends the coverage to include chapters on perturbation methods, heat transfer in living tissue, and microscale conduction. This makes the book unique among the many published textbook on conduction heat transfer. Other noteworthy features of the book are: The material is organized to provide students with the tools to model, analyze and solve a wide range of engineering applications involving conduction heat transfer. Mathematical techniques are presented in a clear and simplified fashion to be used as instruments in obtaining solutions. The simplicity of one-dimensional conduction is used to drill students in the role of boundary conditions and to explore a variety of physical conditions that are of practical interest. Examples are carefully selected to illustrate the application of principles and the construction of solutions. Students are trained to follow a systematic problem solving methodology with emphasis on thought process, logic, reasoning and verification. Solutions to all examples and end-of-chapter problems follow an orderly problems solving approach. Extensive training material is available on the web The author provides an extensive solution manual for verifiable course instructors on request. Please send your request to [email protected]

Chapters contributed by thirty world-renown experts. * Covers all aspects of heat transfer, including micro-scale and heat transfer in electronic equipment. * An associated Web site offers computer formulations on thermophysical properties that provide the most up-to-date values.