This book provides a comprehensive reference for everything that has to do with digital circuits. The author focuses equally on all levels of abstraction. He tells a bottom-up story from the physics level to the finished product level. The aim is to provide a full account of the experience of designing, fabricating, understanding, and testing a microchip. The content is structured to be very accessible and self-contained, allowing readers with diverse backgrounds to read as much or as little of the book as needed. Beyond a basic foundation of mathematics and physics, the book makes no assumptions about prior knowledge. This allows someone new to the field to read the book from the beginning. It also means that someone using the book as a reference will be able to answer their questions without referring to any external sources.

Pressure Vessel Technology, Volume 3 reviews the practices and trends in pressure vessel technology. This book discusses the tremendous progress in the various fields of pressure vessel technology, including fabrication techniques, ferrous materials, and life expectancy to assure structural integrity. Organized into 11 chapters, this compilation of papers begins with an overview of the fabrication techniques in pressure vessel technology. This text then examines the requirements of the chemical industry for the prevention of catastrophic failure of pressure components. Other chapters consider the major development of pressure vessels for special purposes, high pressure vessels, materials for making pressure vessels, and pressure vessel codes. This book discusses as well the seismic design in the field of pressure vessels and pipings. The final chapter deals with buckling resistance under seismic motions for thin-walled cylindrical vessels, of which predominant mode of failure is shear buckling and bending under horizontal earthquake loadings. This book is a valuable resource for mechanical engineers, project managers, and scientists.