Includes bibliographical references and index.

This is the first book on lock-in thermography, an analytical method applied to the diagnosis of microelectronic devices. This useful introduction and guide reviews various experimental approaches to lock-in thermography, with special emphasis on the lock-in IR thermography developed by the authors themselves.

The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. This book is geared to practicing engineers and for studies in the major area of power plant engineering. For non-metallurgists, a chapter has been devoted to the basics of material science, metallurgy of steels, heat treatment, and structure-property correlation. A chapter on materials for boiler tubes covers composition and application of different grades of steels and high temperature alloys currently in use as boiler tubes and future materials to be used in supercritical, ultra-supercritical and advanced ultra-supercritical thermal power plants. A comprehensive discussion on different mechanisms of boiler tube failure is the heart of the book. Additional chapters detailing the role of advanced material characterization techniques in failure investigation and the role of water chemistry in tube failures are key contributions to the book.

The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.

This book aims to provide a broad overview of various topics of Internet of Things (IoT), ranging from research, innovation and development priorities to enabling technologies, nanoelectronics, cyber-physical systems, architecture, interoperability and industrial applications. All this is happening in a global context, building towards intelligent, interconnected decision making as an essential driver for new growth and co-competition across a wider set of markets. It is intended to be a standalone book in a series that covers the Internet of Things activities of the IERC – Internet of Things European Research Cluster from research to technological innovation, validation and deployment.The book builds on the ideas put forward by the European Research Cluster on the Internet of Things Strategic Research and Innovation Agenda, and presents global views and state of the art results on the challenges facing the research, innovation, development and deployment of IoT in future years. The concept of IoT could disrupt consumer and industrial product markets generating new revenues and serving as a growth driver for semiconductor, networking equipment, and service provider end-markets globally. This will create new application and product end-markets, change the value chain of companies that creates the IoT technology and deploy it in various end sectors, while impacting the business models of semiconductor, software, device, communication and service provider stakeholders. The proliferation of intelligent devices at the edge of the network with the introduction of embedded software and app-driven hardware into manufactured devices, and the ability, through embedded software/hardware developments, to monetize those device functions and features by offering novel solutions, could generate completely new types of revenue streams. Intelligent and IoT devices leverage software, software licensing, entitlement management, and Internet connectivity in ways that address many of the societal challenges that we will face in the next decade.

Printbegrænsninger: Der kan printes 10 sider ad gangen og max. 40 sider pr. session