This book describes the theory and design of high-accuracy CMOS smart temperature sensors. The major topic of the work is the realization of a smart temperature sensor that has an accuracy that is so high that it can be applied without any form of calibration. Integrated in a low-cost CMOS technology, this yields at the publication date of this book one of the most inexpensive intelligent general purpose temperature sensors in the world. The first thermometers could only be read by the human eye. The industrial revolution and the following computerization asked for more intelligent sensors, which could easily communicate to digital computers. This led to· the development of integrated temperature sensors that combine a bipolar temperature sensor and an A-to-D converter on the same chip. The implementation in CMOS technology reduces the processing costs to a minimum while having the best-suited technology to increase the (digital) intelligence. The accuracy of conventional CMOS smart temperature sensors is degraded by the offset of the read-out electronics. Calibration of these errors is quite expensive, however, dynamic offset-cancellation techniques can reduce the offset of amplifiers by a factor 100 to 1000 and do not need trimming. Chapter two gives an elaborate description of the different kinds of dynamic offset-cancellation techniques. Also a new technique is introduced called the nested chopper technique. An implementation of a CMOS nested-chopper instrumentation amplifier shows a residual offset of less than lOOn V, which is the best result reported to date.

This book describes the analysis and design of precision temperature sensors in CMOS IC technology, focusing on so-called smart temperature sensors, which provide a digital output signal that can be readily interpreted by a computer. The text shows how temperature characteristics can be used to obtain an accurate digital temperature reading. The book ends with a detailed description of three prototypes, one of which achieves the best performance reported to date.

This book describes the design and implementation of energy-efficient smart (digital output) temperature sensors in CMOS technology. To accomplish this, a new readout topology, namely the zoom-ADC, is presented. It combines a coarse SAR-ADC with a fine Sigma-Delta (SD) ADC. The digital result obtained from the coarse ADC is used to set the reference levels of the SD-ADC, thereby zooming its full-scale range into a small region around the input signal. This technique considerably reduces the SD-ADC’s full-scale range, and notably relaxes the number of clock cycles needed for a given resolution, as well as the DC-gain and swing of the loop-filter. Both conversion time and power-efficiency can be improved, which results in a substantial improvement in energy-efficiency. Two BJT-based sensor prototypes based on 1st-order and 2nd-order zoom-ADCs are presented. They both achieve inaccuracies of less than ±0.2°C over the military temperature range (-55°C to 125°C). A prototype capable of sensing temperatures up to 200°C is also presented. As an alternative to BJTs, sensors based on dynamic threshold MOSTs (DTMOSTs) are also presented. It is shown that DTMOSTs are capable of achieving low inaccuracy (±0.4°C over the military temperature range) as well as sub-1V operation, making them well suited for use in modern CMOS processes.

Thermal Sensors is intended as a comprehensive and accessible reference for designers and users of thermal sensors. Many different physical quantities can be converted easily and accurately into temperature differences using thermal techniques. These temperature differences can be detected with temperature and temperature-difference sensors. In a thermal sensor the thermal converter and the temperature sensor are combined in a single accurate device. This book gives an overview and deals with the design aspects of thermal and temperature sensors, with an emphasis on sensors based on silicon technology. The temperature sensors described are based on the use of various types of sensitive elements, such as platinum resistors, thermistors and special integrated circuits. The thermal sensors described include flow, conductivity, infrared, vacuum, humidity and calorimetric sensors, and ac-dc converters, thus providing a comprehensive overview of all thermal sensors, with practical examples of each type.

The volume presents high quality papers presented at the Second International Conference on Microelectronics, Computing & Communication Systems (MCCS 2017). The book discusses recent trends in technology and advancement in MEMS and nanoelectronics, wireless communications, optical communication, instrumentation, signal processing, image processing, bioengineering, green energy, hybrid vehicles, environmental science, weather forecasting, cloud computing, renewable energy, RFID, CMOS sensors, actuators, transducers, telemetry systems, embedded systems, and sensor network applications. It includes original papers based on original theoretical, practical, experimental, simulations, development, application, measurement, and testing. The applications and solutions discussed in the book will serve as a good reference material for future works.

Smart Sensor Interfaces brings together in one place important contributions and up-to-date research results in this fast moving area. Smart Sensor Interfaces serves as an excellent reference, providing insight into some of the most challenging research issues in the field.

The Conference is the premier international meeting for the presentation of original work addressing all aspects of the theory, design, fabrication, assembly, packaging, testing and application of solid-state sensors, actuators, MEMS, and microsystems.

A NATO Advanced Research Workshop (ARW) entitled “Advanced Materials and Technologies for Micro/Nano Devices, Sensors and Actuators” was held in St. Petersburg, Russia, from June 29 to July 2, 2009. The main goal of the Workshop was to examine (at a fundamental level) the very complex scientific issues that pertain to the use of micro- and nano-electromechanical systems (MEMS and NEMS), devices and technologies in next generation commercial and defen- related applications. Micro- and nano-electromechanical systems represent rather broad and diverse technological areas, such as optical systems (micromirrors, waveguides, optical sensors, integrated subsystems), life sciences and lab equipment (micropumps, membranes, lab-on-chip, membranes, microfluidics), sensors (bio-sensors, chemical sensors, gas-phase sensors, sensors integrated with electronics) and RF applications for signal transmission (variable capacitors, tunable filters and antennas, switches, resonators). From a scientific viewpoint, this is a very multi-disciplinary field, including micro- and nano-mechanics (such as stresses in structural materials), electronic effects (e. g. charge transfer), general electrostatics, materials science, surface chemistry, interface science, (nano)tribology, and optics. It is obvious that in order to overcome the problems surrounding next-generation MEMS/NEMS devices and applications it is necessary to tackle them from different angles: theoreticians need to speak with mechanical engineers, and device engineers and modelers to listen to surface physicists. It was therefore one of the main objectives of the workshop to bring together a multidisciplinary team of distinguished researchers.

The book presents high-quality research papers presented at the first international conference, ICICCD 2016, organised by the Department of Electronics, Instrumentation and Control Engineering of University of Petroleum and Energy Studies, Dehradun on 2nd and 3rd April, 2016. The book is broadly divided into three sections: Intelligent Communication, Intelligent Control and Intelligent Devices. The areas covered under these sections are wireless communication and radio technologies, optical communication, communication hardware evolution, machine-to-machine communication networks, routing techniques, network analytics, network applications and services, satellite and space communications, technologies for e-communication, wireless Ad-Hoc and sensor networks, communications and information security, signal processing for communications, communication software, microwave informatics, robotics and automation, optimization techniques and algorithms, intelligent transport, mechatronics system, guidance and navigation, algorithms, linear/non-linear control, home automation, sensors, smart cities, control systems, high performance computing, cognition control, adaptive control, distributed control, prediction models, hybrid control system, control applications, power system, manufacturing, agriculture cyber physical system, network control system, genetic control based, wearable devices, nano devices, MEMS, bio-inspired computing, embedded and real-time software, VLSI and embedded systems, FPGA, digital system and logic design, image and video processing, machine vision, medical imaging, and reconfigurable computing systems.