Continuing the annual review work started in 1954 at the University of Minnesota's Heat Transfer Laboratory, this prestigous volume collates the reviews from the International Journal of Heat and Mass Transfer from 1976 through 1986. Together with a comprehensive author and subject index, it provides the tools for continuous improvements in the efficiency of engineering devices, including the recent awareness of the necessity to conserve energy and to find new energy sources. As an invaluable guide for locating existing literature on important topics, this work helps engineers and students keep abreast of recent developments in specialized research areas.

Advances in Heat Transfer

About 90 percent of this excessive heat is due to buildings and pavements that absorb and store solar heat (According to the Green Buildings Council). The only reference that focuses specifically on pavements, Pavement Materials for Heat Island Mitigation: Design and Management Strategies explores different advanced paving materials, their properties, and their associated advantages and disadvantages. Relevant properties of pavement materials (e.g. albedo, permeability, thermal conductivity, heat capacity and evaporation rate) are measured in many cases using newly developed methods. - Includes experimental methods for testing different types of pavements materials - Identifies different cool pavement strategies with their advantages and associated disadvantages - Design and construct local microclimate models to evaluate and validate different cool pavement materials in different climate regions

This volume contains an archival record of the NATO Advanced Institute on Microscale Heat Transfer – Fundamental and Applications in Biological and Microelectromechanical Systems held in Çesme – Izmir, Turkey, July 18–30, 2004. The ASIs are intended to be high-level teaching activity in scientific and technical areas of current concern. In this volume, the reader may find interesting chapters and various Microscale Heat Transfer Fundamental and Applications. The growing use of electronics, in both military and civilian applications has led to the widespread recognition for need of thermal packaging and management. The use of higher densities and frequencies in microelectronic circuits for computers are increasing day by day. They require effective cooling due to heat generated that is to be dissipated from a relatively low surface area. Hence, the development of efficient cooling techniques for integrated circuit chips is one of the important contemporary applications of Microscale Heat Transfer which has received much attention for cooling of high power electronics and applications in biomechanical and aerospace industries. Microelectromechanical systems are subject of increasing active research in a widening field of discipline. These topics and others are the main themeof this Institute.

For more than 50 years, the Springer VDI Heat Atlas has been an indispensable working means for engineers dealing with questions of heat transfer. Featuring 50% more content, this new edition covers most fields of heat transfer in industrial and engineering applications. It presents the interrelationships between basic scientific methods, experimental techniques, model-based analysis and their transfer to technical applications.

This volume of papers has been produced in memory of Professor R.R. Gilpin, who was a pioneer in the field of freezing phenomena in ice-water systems. The subject has applications in ice formation in industrial plants, technologies for manufacturing crystals in space for semiconductors and computer chips and atmospheric physics and geophysics.