As the semiconductor industry attempts to increase the number of functions that will fit into the smallest space on a chip, it becomes increasingly important for new technologies to keep apace with these demands. Photomask technology is one of the key areas to achieving this goal. Although brief overviews of photomask technology exist in the literature, the Handbook of Photomask Manufacturing Technology is the first in-depth, comprehensive treatment of existing and emerging photomask technologies available. The Handbook of Photomask Manufacturing Technology features contributions from 40 internationally prominent authors from industry, academia, government, national labs, and consortia. These authors discuss conventional masks and their supporting technologies, as well as next-generation, non-optical technologies such as extreme ultraviolet, electron projection, ion projection, and x-ray lithography. The book begins with an overview of the history of photomask development. It then demonstrates the steps involved in designing, producing, testing, inspecting, and repairing photomasks, following the sequences observed in actual production. The text also includes sections on materials used as well as modeling and simulation. Continued refinements in the photomask-making process have ushered in the sub-wavelength era in nanolithography. This invaluable handbook synthesizes these refinements and provides the tools and possibilities necessary to reach the next generation of microfabrication technologies.

Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.

Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.

WORLD-CLASS SEMICONDUCTOR MANUFACTURING EXPERTISE AT YOUR FINGERTIPS This is a comprehensive reference to the semiconductor manufacturing process and ancillary facilities -- from raw material preparation to packaging and testing, applying basics to emerging technologies. Readers charged with optimizing the design and performance of manufacturing processes will find all the information necessary to produce the highest quality chips at the lowest price in the shortest time possible. The Semiconductor Manufacturing Handbook provides leading-edge information on semiconductor wafer processes, MEMS, nanotechnology, and FPD, plus the latest manufacturing and automation technologies, including: Yield Management Automated Material Handling System Fab and Cleanroom Design and Operation Gas Abatement and Waste Treatment Management And much more Written by 60 international experts, and peer reviewed by a seasoned advisory board, this handbook covers the fundamentals of relevant technology and its real-life application and operational considerations for planning, implementing, and controlling manufacturing processes. It includes hundreds of detailed illustrations and a list of relevant books, technical papers, and websites for further research. This inclusive, wide-ranging coverage makes the Semiconductor Manufacturing Handbook the most comprehensive single-volume reference ever published in the field. STATE-OF-THE-ART SEMICONDUCTOR TECHNOLOGIES AND MANUFACTURING PROCESSES: SEMICONDUCTOR FUNDAMENTALS How Chips Are Designed and Made * Substrates * Copper and Low-k Dielectrics * Silicide Formation * Plasma * Vacuum * Photomask WAFER PROCESSING TECHNOLOGIES Microlithography * Ion Implantation * Etch * PVD/ALD * CVD * ECD * Epitaxy * CMP * Wet Cleaning FINAL MANUFACTURING Packaging * Grinding, Stress Relief, Dicing * Inspection, Measurement, and Testing NANOTECHNOLOGY, MEMS, AND FPD GAS AND CHEMICALS Specialty Gas System and DCA * Gas Abatement Systems * Chemical and Slurries Delivery System * Ultra Pure Water FAB YIELD, OPERATIONS, AND FACILITIES Yield Management * Automated Materials Handling System * Metrology * Six Sigma * Advanced Process Control * EHS * Fab Design and Construction * Cleanroom * Vibration and Acoustic Control * ESD * Airborne Molecular Control * Particle Monitoring * Wastewater Neutralization Systems

The physical design flow of any project depends upon the size of the design, the technology, the number of designers, the clock frequency, and the time to do the design. As technology advances and design-styles change, physical design flows are constantly reinvented as traditional phases are removed and new ones are added to accommodate changes in

Presenting a comprehensive overview of the design automation algorithms, tools, and methodologies used to design integrated circuits, the Electronic Design Automation for Integrated Circuits Handbook is available in two volumes. The second volume, EDA for IC Implementation, Circuit Design, and Process Technology, thoroughly examines real-time logic to GDSII (a file format used to transfer data of semiconductor physical layout), analog/mixed signal design, physical verification, and technology CAD (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability at the nanoscale, power supply network design and analysis, design modeling, and much more. Save on the complete set.

Focusing on the use of microlithography techniques in microelectronics manufacturing, this volume is one of a series addressing a rapidly growing field affecting the integrated circuit industry. New applications in such areas as sensors, actuators and biomedical devices, are described.

Now in its eleventh edition, DeGarmo's Materials and Processes in Manufacturing has been a market-leading text on manufacturing and manufacturing processes courses for more than fifty years. Authors J T. Black and Ron Kohser have continued this book's long and distinguished tradition of exceedingly clear presentation and highly practical approach to materials and processes, presenting mathematical models and analytical equations only when they enhance the basic understanding of the material. Completely revised and updated to reflect all current practices, standards, and materials, the eleventh edition has new coverage of additive manufacturing, lean engineering, and processes related to ceramics, polymers, and plastics.

The second of two volumes in the Electronic Design Automation for Integrated Circuits Handbook, Second Edition, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology thoroughly examines real-time logic (RTL) to GDSII (a file format used to transfer data of semiconductor physical layout) design flow, analog/mixed signal design, physical verification, and technology computer-aided design (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability (DFM) at the nanoscale, power supply network design and analysis, design modeling, and much more. New to This Edition: Major updates appearing in the initial phases of the design flow, where the level of abstraction keeps rising to support more functionality with lower non-recurring engineering (NRE) costs Significant revisions reflected in the final phases of the design flow, where the complexity due to smaller and smaller geometries is compounded by the slow progress of shorter wavelength lithography New coverage of cutting-edge applications and approaches realized in the decade since publication of the previous edition—these are illustrated by new chapters on 3D circuit integration and clock design Offering improved depth and modernity, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology provides a valuable, state-of-the-art reference for electronic design automation (EDA) students, researchers, and professionals.

Nanoscale pattern transfer technology using molds is a rapidly advancing area and one that has seen much recent attention due to its potential for use in nanotechnology industries and applications. However, because of these rapid advances, it can be difficult to keep up with the technological trends and the latest cutting-edge methods. In order to fully understand these pioneering technologies, a comprehensive understanding of the basic science and an overview of the techniques are required. Nanoimprint Technology: Nanotransfer for Thermoplastic and Photocurable Polymers covers the latest nanotransfer science based on polymer behaviour. Polymer fluid dynamics are described in detail, and injection moulding, nanoimprint lithography and micro contact printing are also discussed. Cutting-edge nanotransfer technologies and applications are also considered and future trends in industry are examined. Key features: • Covers the fundamentals of nanoimprint technology • Presents cutting-edge techniques and applications • Provides industrial examples and describes the mold fabrication process • Considers nanotransfer of thermoplastics by simulation • Describes the design and evaluation of UV curable polymer Nanoimprint Technology: Nanotransfer for Thermoplastic and Photocurable Polymers is a comprehensive reference for industry engineers as well as graduate and undergraduate students, and is a useful source of information for anyone looking to improve their understanding of nanotransfer mechanisms and methods.