A comprehensive reference on the properties, selection, processing, and applications of the most widely used nonmetallic engineering materials. Section 1, General Information and Data, contains information applicable both to polymers and to ceramics and glasses. It includes an illustrated glossary, a collection of engineering tables and data, and a guide to materials selection. Sections 2 through 7 focus on polymeric materials--plastics, elastomers, polymer-matrix composites, adhesives, and sealants--with the information largely updated and expanded from the first three volumes of the Engineered Materials Handbook. Ceramics and glasses are covered in Sections 8 through 12, also with updated and expanded information. Annotation copyright by Book News, Inc., Portland, OR

This reference book makes it easy for anyone involved in materials selection, or in the design and manufacture of metallic structural components to quickly screen materials for a particular application. Information on practically all ferrous and nonferrous metals including powder metals is presented in tabular form for easy review and comparison between different materials. Included are chemical compositions, physical and mechanical properties, manufacturing processes, applications, pertinent specifications and standards, and test methods. Contents Overview: Glossary of metallurgical terms Selection of structural materials (specifications and standards, life cycle and failure modes, materials properties and design, and properties and applications) Physical data on the elements and alloys Testing and inspection Chemical composition and processing characteristics

This unique and practical book provides quick and easy access to data on the physical and chemical properties of all classes of materials. The second edition has been much expanded to include whole new families of materials while many of the existing families are broadened and refined with new material and up-to-date information. Particular emphasis is placed on the properties of common industrial materials in each class. Detailed appendices provide additional information, and careful indexing and a tabular format make the data quickly accessible. This book is an essential tool for any practitioner or academic working in materials or in engineering.

This work offers a comprehensive source of information on metallographic techniques and their application to the study of metals, ceramics, and polymers. It contains an extensive collection of micro- and macrographs.

Designed for advanced undergraduate students and as a useful reference book for materials researchers, Physical Properties of Materials, Third Edition establishes the principles that control the optical, thermal, electronic, magnetic, and mechanical properties of materials. Using an atomic and molecular approach, this introduction to materials science offers readers a wide-ranging survey of the field and a basis to understand future materials. The author incorporates comments on applications of materials science, extensive references to the contemporary and classic literature, and 350 end-of-chapter problems. In addition, unique tutorials allow students to apply the principles to understand applications, such as photocopying, magnetic devices, fiber optics, and more. This fully revised and updated Third Edition includes new materials and processes, such as topological insulators, 3-D printing, and more information on nanomaterials. The new edition also now adds Learning Goals at the end of each chapter and a Glossary with more than 500 entries for quick reference.

This reference covers principles, processes, types of coatings, applications, performance, and testing and analysis of thermal spray technology. It will serve as an introduction and guide for those new to thermal spray, and as a reference for specifiers and users of thermal spray coatings and thermal spray experts. Coverage encompasses basics of th

Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.

This volume focuses on the practical application of processes for manufacturing plastic products. It includes information on design for manufacturability (DFM), material selection, process selection, dies, molds, and tooling, extrusion, injection molding, blow molding, thermoforming, lamination, rotational molding, casting, foam processing, compression and transfer molding, fiber reinforced processing, assembly and fabrication, quality, plant engineering and maintenance, management.