DRAM is abbreviation of Dynamic Random Access Memory. DRAM is volatile memory electronic devices such as personal computer, cell phone, pad, etc. DRAM (Dynamic Random Access Memory) becomes an important component for a device is after the Bill Gates and Paul Allen found Microsoft Corporation which makes the personal computer software operation system DOS (disk operation system) in 1975. Personal computer industry is booming after Apple Incorporation and Microsoft Corporation have launched the personal computer and computer operation system to this world.

More than 1,100 TEM images illustrate the science of ULSI The natural outgrowth of VLSI (Very Large Scale Integration), Ultra Large Scale Integration (ULSI) refers to semiconductor chips with more than 10 million devices per chip. Written by three renowned pioneers in their field, ULSI Semiconductor Technology Atlas uses examples and TEM (Transmission Electron Microscopy) micrographs to explain and illustrate ULSI process technologies and their associated problems. The first book available on the subject to be illustrated using TEM images, ULSI Semiconductor Technology Atlas is logically divided into four parts: * Part I includes basic introductions to the ULSI process, device construction analysis, and TEM sample preparation * Part II focuses on key ULSI modules--ion implantation and defects, dielectrics and isolation structures, silicides/salicides, and metallization * Part III examines integrated devices, including complete planar DRAM, stacked cell DRAM, and trench cell DRAM, as well as SRAM as examples for process integration and development * Part IV emphasizes special applications, including TEM in advanced failure analysis, TEM in advanced packaging development and UBM (Under Bump Metallization) studies, and high-resolution TEM in microelectronics This innovative guide also provides engineers and managers in the microelectronics industry, as well as graduate students, with: * More than 1,100 TEM images to illustrate the science of ULSI * A historical introduction to the technology as well as coverage of the evolution of basic ULSI process problems and issues * Discussion of TEM in other advanced microelectronics devices and materials, such as flash memories, SOI, SiGe devices, MEMS, and CD-ROMs

A modern, comprehensive introduction to DRAM for students and practicing chip designers Dynamic Random Access Memory (DRAM) technology has been one of the greatestdriving forces in the advancement of solid-state technology. With its ability to produce high product volumes and low pricing, it forces solid-state memory manufacturers to work aggressively to cut costs while maintaining, if not increasing, their market share. As a result, the state of the art continues to advance owing to the tremendous pressure to get more memory chips from each silicon wafer, primarily through process scaling and clever design. From a team of engineers working in memory circuit design, DRAM Circuit Design gives students and practicing chip designers an easy-to-follow, yet thorough, introductory treatment of the subject. Focusing on the chip designer rather than the end user, this volume offers expanded, up-to-date coverage of DRAM circuit design by presenting both standard and high-speed implementations. Additionally, it explores a range of topics: the DRAM array, peripheral circuitry, global circuitry and considerations, voltage converters, synchronization in DRAMs, data path design, and power delivery. Additionally, this up-to-date and comprehensive book features topics in high-speed design and architecture and the ever-increasing speed requirements of memory circuits. The only book that covers the breadth and scope of the subject under one cover, DRAM Circuit Design is an invaluable introduction for students in courses on memory circuit design or advanced digital courses in VLSI or CMOS circuit design. It also serves as an essential, one-stop resource for academics, researchers, and practicing engineers.

An essential guide to understanding the Cisco IOS architecture In-depth coverage of Cisco's IOS Software architecture provides crucial information to: Prevent network problems and optimize performance through more efficient design and configuration Isolate and resolve network problems more quickly and easily Apply the appropriate packet switching method, such as process switching, fast switching, optimum switching, or Cisco Express Forwarding (CEF) Understand the hardware architecture, packet buffering, and packet switching processes for shared memory routers (Cisco 1600, 2500, 3600, 4000, 4500, and 4700 series) Understand the hardware architecture, packet buffering, and packet switching processes for the Cisco 7200 series routers Understand the hardware architecture, packet buffering, and packet switching processes for the Cisco 7500 series routers Understand the hardware architecture, packet buffering, and packet switching processes for the Cisco GSR 12000 series routers Further your knowledge of how IOS Software implements Quality of Service (QoS) Inside Cisco IOS Software Architecture offers crucial and hard-to-find information on Cisco's Internetwork Operating System (IOS) Software. IOS Software provides the means by which networking professionals configure and manage Cisco networking devices. Beyond understanding the Cisco IOS command set, comprehending what happens inside Cisco routers will help you as a network designer or engineer to perform your job more effectively. By understanding the internal operations of IOS Software, you will be able to take architectural considerations into account when designing networks and isolate problems more easily when troubleshooting networks. Inside Cisco IOS Software Architecture provides essential information on the internal aspects of IOS Software at this level, and it is an invaluable resource for better understanding the intricacies of IOS Software and how it affects your network. Inide Cisco IOS Software Architecture begins with an overview of operating system concepts and the IOS Software infrastructure, including processes, memory management, CPU scheduling, packet buffers, and device drivers, as well as a discussion of packet switching architecture with detailed coverage of the various platform-independent switching methods, including process switching, fast switching, optimum switching, and Cisco Express Forwarding (CEF). The book then delves into the intricate details of the design and operation of platform-specific features, including the 1600, 2500, 4x00, 3600, 7200, 7500, and GSR Cisco routers. Finally, an overview of IOS Quality of Service (QoS) is provided, including descriptions of several QoS methods, such as priority queuing, custom queuing, weighted fair queuing, and modified deficit round robin.

This book includes basic methodologies, review of basic electrical rules and how they apply, design rules, IC planning, detailed checklists for design review, specific layout design flows, specialized block design, interconnect design, and also additional information on design limitations due to production requirements.*Practical, hands-on approach to CMOS layout theory and design*Offers engineers and technicians the training materials they need to stay current in circuit design technology.*Covers manufacturing processes and their effect on layout and design decisions

Beginning and experienced programmers will use this comprehensive guide to persistent memory programming. You will understand how persistent memory brings together several new software/hardware requirements, and offers great promise for better performance and faster application startup times—a huge leap forward in byte-addressable capacity compared with current DRAM offerings. This revolutionary new technology gives applications significant performance and capacity improvements over existing technologies. It requires a new way of thinking and developing, which makes this highly disruptive to the IT/computing industry. The full spectrum of industry sectors that will benefit from this technology include, but are not limited to, in-memory and traditional databases, AI, analytics, HPC, virtualization, and big data. Programming Persistent Memory describes the technology and why it is exciting the industry. It covers the operating system and hardware requirements as well as how to create development environments using emulated or real persistent memory hardware. The book explains fundamental concepts; provides an introduction to persistent memory programming APIs for C, C++, JavaScript, and other languages; discusses RMDA with persistent memory; reviews security features; and presents many examples. Source code and examples that you can run on your own systems are included. What You’ll Learn Understand what persistent memory is, what it does, and the value it brings to the industry Become familiar with the operating system and hardware requirements to use persistent memory Know the fundamentals of persistent memory programming: why it is different from current programming methods, and what developers need to keep in mind when programming for persistence Look at persistent memory application development by example using the Persistent Memory Development Kit (PMDK)Design and optimize data structures for persistent memoryStudy how real-world applications are modified to leverage persistent memoryUtilize the tools available for persistent memory programming, application performance profiling, and debugging Who This Book Is For C, C++, Java, and Python developers, but will also be useful to software, cloud, and hardware architects across a broad spectrum of sectors, including cloud service providers, independent software vendors, high performance compute, artificial intelligence, data analytics, big data, etc.

Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic. - Provides guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics - Includes coverage of environmentally friendly 'green encapsulants' - Presents coverage of faults and defects, and how to analyze and avoid them

Materials Processing: A Unified Approach to Processing of Metals, Ceramics and Polymers, Second Edition is the first textbook to bring the fundamental concepts of materials processing together in a unified approach that highlights the overlap in scientific and engineering principles. It teaches students the key principles involved in the processing of engineering materials, specifically metals, ceramics and polymers, from starting or raw materials through to the final functional forms. Its self-contained approach is based on the state of matter most central to the shaping of the material: melt, solid, powder, dispersion and solution, and vapor. With this approach, students learn processing fundamentals and appreciate the similarities and differences between the materials classes. This fully updated edition includes expanded coverage on additive manufacturing, as well as adding a new section on machining. The organization has been modified and a greater emphasis has been placed on the fundamentals of processing and manufacturing methods. This book can be utilized by upper-level undergraduates and beginning graduate students in Materials Science and Engineering who are already schooled in the structure and properties of metals, ceramics and polymers, and are ready to apply their knowledge to materials processing. It will also appeal to students from other engineering disciplines who have completed an introductory materials science and engineering course. - Includes comprehensive coverage on the fundamental concepts of materials processing - Provides coverage of metals, ceramics, and polymers in one text - Presents examples of both standard and newer additive manufacturing methods throughout - Gives students an overview on the methods that they will likely encounter in their careers

This issue covers papers relating to advanced semiconductor products that are true representatives of nanoelectronics have reached below 100 nm. Depending on the application, the nanosystem may consist of one or more of the following types of functional components: electronic, optical, magnetic, mechanical, biological, chemical, energy sources, and various types of sensing devices. As long as one or more of these functional devices is in 1-100 nm dimensions, the resultant system can be defined as nanosystem. Papers will be in all areas of dielectric issues in nanosystems. In addition to traditional areas of semiconductor processing and packaging of nanoelectronics, emphasis will be placed on areas where multifunctional device integration (through innovation in design, materials, and processing at the device and system levels) will lead to new applications of nanosystems.