Conceptual Design of Multichip Modules and Systems treats activities which take place at the conceptual and specification level of the design of complex multichip systems. These activities include the formalization of design knowledge (information modeling), tradeoff analysis, partitioning, and decision process capture. All of these functions occur prior to the traditional CAD activities of synthesis and physical design. Inherent in the design of electronic modules are tradeoffs which must be understood before feasible technology, material, process, and partitioning choices can be selected. The lack of a complete set of technology information is an especially serious problem in the packaging and interconnect field since the number of technologies, process, and materials is substantial and selecting optimums is arduous and non-trivial if one truly wants a balance in cost and performance. Numerous tradeoff and design decisions have to be made intelligently and quickly at the beginning of the design cycle before physical design work begins. These critical decisions, made within the first 10% of the total design cycle, ultimately define up to 80% of the final product cost. Conceptual Design of Multichip Modules and Systems lays the groundwork for concurrent estimation level analysis including size, routing, electrical performance, thermal performance, cost, reliability, manufacturability, and testing. It will be useful both as a reference for system designers and as a text for those wishing to gain a perspective on the nature of packaging and interconnect design, concurrent engineering, computer-aided design, and system synthesis.

The general understanding of design is that it should lead to a manufacturable product. Neither the design nor the process of manufacturing is perfect. As a result, the product will be faulty, will require testing and fixing. Where does economics enter this scenario? Consider the cost of testing and fixing the product. If a manufactured product is grossly faulty, or too many of the products are faulty, the cost of testing and fixing will be high. Suppose we do not like that. We then ask what is the cause of the faulty product. There must be something wrong in the manufacturing process. We trace this cause and fix it. Suppose we fix all possible causes and have no defective products. We would have eliminated the need for testing. Unfortunately, things are not so perfect. There is a cost involved with finding and eliminating the causes of faults. We thus have two costs: the cost of testing and fixing (we will call it cost-1), and the cost of finding and eliminating causes of faults (call it cost-2). Both costs, in some way, are included in the overall cost of the product. If we try to eliminate cost-1, cost-2 goes up, and vice versa. An economic system of production will minimize the overall cost of the product. Economics of Electronic Design, Manufacture and Test is a collection of research contributions derived from the Second Workshop on Economics of Design, Manufacture and Test, written for inclusion in this book.

The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.

During the ten years since the appearance of the groundbreaking, bestselling first edition of The Electronics Handbook, the field has grown and changed tremendously. With a focus on fundamental theory and practical applications, the first edition guided novice and veteran engineers along the cutting edge in the design, production, installation, operation, and maintenance of electronic devices and systems. Completely updated and expanded to reflect recent advances, this second edition continues the tradition. The Electronics Handbook, Second Edition provides a comprehensive reference to the key concepts, models, and equations necessary to analyze, design, and predict the behavior of complex electrical devices, circuits, instruments, and systems. With 23 sections that encompass the entire electronics field, from classical devices and circuits to emerging technologies and applications, The Electronics Handbook, Second Edition not only covers the engineering aspects, but also includes sections on reliability, safety, and engineering management. The book features an individual table of contents at the beginning of each chapter, which enables engineers from industry, government, and academia to navigate easily to the vital information they need. This is truly the most comprehensive, easy-to-use reference on electronics available.

When it comes to electronics, demand grows as technology shrinks. From consumer and industrial markets to military and aerospace applications, the call is for more functionality in smaller and smaller devices. Culled from the second edition of the best-selling Electronics Handbook, Microelectronics, Second Edition presents a summary of the current state of microelectronics and its innovative directions. This book focuses on the materials, devices, and applications of microelectronics technology. It details the IC design process and VLSI circuits, including gate arrays, programmable logic devices and arrays, parasitic capacitance, and transmission line delays. Coverage ranges from thermal properties and semiconductor materials to MOSFETs, digital logic families, memory devices, microprocessors, digital-to-analog and analog-to-digital converters, digital filters, and multichip module technology. Expert contributors discuss applications in machine vision, ad hoc networks, printing technologies, and data and optical storage systems. The book also includes defining terms, references, and suggestions for further reading. This edition features two new sections on fundamental properties and semiconductor devices. With updated material and references in every chapter, Microelectronics, Second Edition is an essential reference for work with microelectronics, electronics, circuits, systems, semiconductors, logic design, and microprocessors.

Today's professionals are constantly striving to create sensor technology and systems with lower cost and higher efficiency. Miniaturization and standardization have become critical drivers for cost reduction in the design and development process, giving rise to a new era of smart sensors and actuators. These devices contain more components, but normally provide significant cost savings due to wider applicability and mass production. This first-of-its-kind resource presents methods for cost optimization of smart microsystems to help you select highly cost-efficient implementation variants. Written by leading experts, the book offers detailed coverage of the key topics that you need to understand for your work in the field, such as methods for cost estimation, holistic design optimization, a methodology for a cost-driven design, and applied cost optimization. This practical book focuses on fundamental cost influences rather than absolute numbers, helping you appreciate relative values which reflect the competitive advantage of the various design implementations. Moreover, you find specific recommendations on which cost-reduction methods will be most advantageous in varying situations. This forward-looking volume provides keen insight into the underlying factors which drive the current economics and determine future trends of smart microsystems.

Comprehensive Materials Processing, Thirteen Volume Set provides students and professionals with a one-stop resource consolidating and enhancing the literature of the materials processing and manufacturing universe. It provides authoritative analysis of all processes, technologies, and techniques for converting industrial materials from a raw state into finished parts or products. Assisting scientists and engineers in the selection, design, and use of materials, whether in the lab or in industry, it matches the adaptive complexity of emergent materials and processing technologies. Extensive traditional article-level academic discussion of core theories and applications is supplemented by applied case studies and advanced multimedia features. Coverage encompasses the general categories of solidification, powder, deposition, and deformation processing, and includes discussion on plant and tool design, analysis and characterization of processing techniques, high-temperatures studies, and the influence of process scale on component characteristics and behavior. Authored and reviewed by world-class academic and industrial specialists in each subject field Practical tools such as integrated case studies, user-defined process schemata, and multimedia modeling and functionality Maximizes research efficiency by collating the most important and established information in one place with integrated applets linking to relevant outside sources

This book provides an introduction to the cost modeling for electronic systems that is suitable for advanced undergraduate and graduate students in electrical, mechanical and industrial engineering, and professionals involved with electronics technology development and management. This book melds elements of traditional engineering economics with manufacturing process and life-cycle cost management concepts to form a practical foundation for predicting the cost of electronic products and systems. Various manufacturing cost analysis methods are addressed including: process-flow, parametric, cost of ownership, and activity based costing. The effects of learning curves, data uncertainty, test and rework processes, and defects are considered. Aspects of system sustainment and life-cycle cost modeling including reliability (warranty, burn-in), maintenance (sparing and availability), and obsolescence are treated. Finally, total cost of ownership of systems, return on investment, cost-benefit analysis, and real options analysis are addressed.

Advantages of MCMs over traditional packaging methods for electronic-based applications in computers, aviation, and the military. Introduction to Multichip Modules discusses both custom built MCMs and programmable MCMs and their role in reducing cost and improving turnaround time. An invaluable resource for students and professionals in electrical engineering who design MCMs and MCM-based systems, and for those in computer science who develop CAD tools for MCMs, this.