Advanced Polyimide Materials: Synthesis, Characterization and Applications summarizes and reviews recent research and developments on several key PI materials. A wide array of PI materials are included, including high performance PI films for microelectronic fabrication and packaging, display and space applications, fiber-reinforced PI composites for structural applications in aerospace and aviation industries, and PI photoresists for integrated circuit packaging. The chemical features of PI are also described, including semi-alicyclic PIs, fluorinated PIs, phosphorous-containing PIs, silicon-containing PIs and other new varieties, providing a comprehensive overview on PI materials while also summarizing the latest research. The book serves as a valuable reference book for engineers and students working on polymer materials, microelectronics manufacturing and packaging in industries such as aerospace and aviation. - Reviews the latest research, development and future prospective of polyimides - Describes the progress made in the research on polyimide materials, including polyimide films, matrices for carbon fiber composites, coatings for microelectronics and display devices, forms and fibers - Presents a highly organized work that is composed of different sections that are easily compared

Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons. Filled with contributions from some of the field's leading experts,Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions. Discusses specific company standards and their development results Content relates to practice as well as to contemporary and future challenges in electronics system integration and packaging Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research.

This volume chronicles the proceedings of the Third International Symposium on Polyimides and Other High Temperature Polymers: Synthesis, Characterization, and Applications, held in Orlando, December 17-19, 2003. This volume is divided into three parts. Part 1. “Synthesis, Properties and Bulk Characterization”; Part 2 “Hybrids and Composites” and Part 3 “Applications and General Papers”. The topics covered include: Synthesis, characterization and processing (including some novel approaches) of a variety of polyimides and other high temperature polymers; structure-property relationships; hybrids and nanocomposites using these materials and their characterization, properties and applications; segmental dynamics in polyimide materials; photoalignable polyimides; photoconductivity and photosensitivity of polyimides; ultrafiltration membranes from polyetherimide; polyimide as a tunneling barrier; polymer materials for nonlinear optical applications; alignment of SWNTs in rigid-rod polymer compositions; surface modification of polyimide; adhesion of Cu to polyimide surfaces; and polyimide erosion in a low Earth orbit space environment.

Polyimide is one of the most efficient polymers in many industries for its excellent thermal, electrical, mechanical, and chemical properties as well as its easy processability. In the electronic and electrical engineering industries, polyimide has widely been used for decades thanks to its very good dielectric and insulating properties at the high electric field and at high temperatures of around 200°C in long term-service. Moreover, polyimide appears essential for the development of new electronic devices where further considerations such as high power density, integration, higher temperature, thermal conduction management, energy storage, reliability, or flexibility are required in order to sustain the growing global electrical energy consumption. This book gathers interdisciplinary chapters on polyimide in various topics through state-of-the-art and original ongoing research.

The feature of polyimides and other heterocyclic polymers are now well-established and used for long term temperature durability in the range of 250 - 350'C. This book will review synthesis, mechanisms, ultimate properties, physico-chemical properties, processing and applications of such high performance materials needed in advanced technologies. It presents interdisciplinary papers on the state of knowledge of each topic under consideration through a combination of overviews and original unpublished research. The volume contains eleven chapters divided into three sections: Chemistry; Chemical and Physical Properties; and Applications.

Carbon materials are exceptionally diverse in their preparation, structure, texture, and applications. In Advanced Materials Science and Engineering of Carbon, noted carbon scientist Michio Inagaki and his coauthors cover the most recent advances in carbon materials, including new techniques and processes, carbon materials synthesis, and up-to-date descriptions of current carbon-based materials, trends and applications. Beginning with the synthesis and preparation of nanocarbons, carbon nanotubes, and graphenes, the book then reviews recently developed carbonization techniques, such as templating, electrospinning, foaming, stress graphitization, and the formation of glass-like carbon. The last third of the book is devoted to applications, featuring coverage of carbon materials for energy storage, electrochemical capacitors, lithium-ion rechargeable batteries, and adsorptive storage of hydrogen and methane for environmental protection, photocatalysis, spilled oil recovery, and nuclear applications of isotropic high-density graphite.

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

• One of very few books available to cover this subject area. • A practical book with a wealth of detail.This book covers the major manufacturing processes for polymer matrix composites with an emphasis on continuous fibre-reinforced composites. It covers the major fabrication processes in detail.Very few books cover the details of fabrication and assembly processes for composites. This book is intended for the engineer who wants to learn more about composite processing: any one with some experience in composites should be able to read it. The author, who has 34 years experience in the aerospace industry, has intentionally left out mathematical models for processes so the book will be readable by the general engineer. It differs from other books on composites manufacturing in focussing almost solely on manufacturing processes, while not attempting to cover materials, test methods, mechanical properties and other areas of composites.

Discover a one-stop resource for in-depth knowledge on epoxy composites from leading voices in the field Used in a wide variety of materials engineering applications, epoxy composites are highly relevant to the work of engineers and scientists in many fields. Recent developments have allowed for significant advancements in their preparation, processing and characterization that are highly relevant to the aerospace and automobile industry, among others. In Epoxy Composites: Fabrication, Characterization and Applications, a distinguished team of authors and editors deliver a comprehensive and straightforward summary of the most recent developments in the area of epoxy composites. The book emphasizes their preparation, characterization and applications, providing a complete understanding of the correlation of rheology, cure reaction, morphology, and thermo-mechanical properties with filler dispersion. Readers will learn about a variety of topics on the cutting-edge of epoxy composite fabrication and characterization, including smart epoxy composites, theoretical modeling, recycling and environmental issues, safety issues, and future prospects for these highly practical materials. Readers will also benefit from the inclusion of: A thorough introduction to epoxy composites, their synthesis and manufacturing, and micro- and nano-scale structure formation in epoxy and clay nanocomposites An exploration of long fiber reinforced epoxy composites and eco-friendly epoxy-based composites Practical discussions of the processing of epoxy composites based on carbon nanomaterials and the thermal stability and flame retardancy of epoxy composites An analysis of the spectroscopy and X-ray scattering studies of epoxy composites Perfect for materials scientists, polymer chemists, and mechanical engineers, Epoxy Composites: Fabrication, Characterization and Applications will also earn a place in the libraries of engineering scientists working in industry and process engineers seeking a comprehensive and exhaustive resource on epoxy composites.

Written to educate readers about recent advances in the area of new materials used in making products. Materials and their properties usually limit the component designer. * Presents information about all of these advanced materials that enable products to be designed in a new way * Provides a cost effective way for the design engineer to become acquainted with new materials * The material expert benefits by being aware of the latest development in all these areas so he/she can focus on further improvements