The book is intended for digital and system design engineers with emphasis on design and system architecture. The book is broadly divided into two sections - chapters 1 through 10, focusing on the digital design aspects and chapters 11 through 20, focusing on the system aspects of chip design. It comes with real-world examples in Verilog and introduction to SystemVerilog Assertions (SVA).

A systematic description of microelectronic device design. Topics range from the basics to low-power and ultralow-voltage designs, subthreshold current reduction, memory subsystem designs for modern DRAMs, and various on-chip supply-voltage conversion techniques. It also covers process and device issues as well as design issues relating to systems, circuits, devices and processes, such as signal-to-noise and redundancy.

SOC test design and its optimization is the topic of Introduction to Advanced System-on-Chip Test Design and Optimization. It gives an introduction to testing, describes the problems related to SOC testing, discusses the modeling granularity and the implementation into EDA (electronic design automation) tools. The book is divided into three sections: i) test concepts, ii) SOC design for test, and iii) SOC test applications. The first part covers an introduction into test problems including faults, fault types, design-flow, design-for-test techniques such as scan-testing and Boundary Scan. The second part of the book discusses SOC related problems such as system modeling, test conflicts, power consumption, test access mechanism design, test scheduling and defect-oriented scheduling. Finally, the third part focuses on SOC applications, such as integrated test scheduling and TAM design, defect-oriented scheduling, and integrating test design with the core selection process.

Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.

From basic architecture, interconnection, and parallelization to power optimization, this book provides a comprehensive description of emerging multicore systems-on-chip (MCSoCs) hardware and software design. Highlighting both fundamentals and advanced software and hardware design, it can serve as a primary textbook for advanced courses in MCSoCs design and embedded systems. The first three chapters introduce MCSoCs architectures, present design challenges and conventional design methods, and describe in detail the main building blocks of MCSoCs. Chapters 4, 5, and 6 discuss fundamental and advanced on-chip interconnection network technologies for multi and many core SoCs, enabling readers to understand the microarchitectures for on-chip routers and network interfaces that are essential in the context of latency, area, and power constraints. With the rise of multicore and many-core systems, concurrency is becoming a major issue in the daily life of a programmer. Thus, compiler and software development tools are critical in helping programmers create high-performance software. Programmers should make sure that their parallelized program codes will not cause race condition, memory-access deadlocks, or other faults that may crash their entire systems. As such, Chapter 7 describes a novel parallelizing compiler design for high-performance computing. Chapter 8 provides a detailed investigation of power reduction techniques for MCSoCs at component and network levels. It discusses energy conservation in general hardware design, and also in embedded multicore system components, such as CPUs, disks, displays and memories. Lastly, Chapter 9 presents a real embedded MCSoCs system design targeted for health monitoring in the elderly.

In Interconnect-centric Design for Advanced SoC and NoC, we have tried to create a comprehensive understanding about on-chip interconnect characteristics, design methodologies, layered views on different abstraction levels and finally about applying the interconnect-centric design in system-on-chip design. Traditionally, on-chip communication design has been done using rather ad-hoc and informal approaches that fail to meet some of the challenges posed by next-generation SOC designs, such as performance and throughput, power and energy, reliability, predictability, synchronization, and management of concurrency. To address these challenges, it is critical to take a global view of the communication problem, and decompose it along lines that make it more tractable. We believe that a layered approach similar to that defined by the communication networks community should also be used for on-chip communication design. The design issues are handled on physical and circuit layer, logic and architecture layer, and from system design methodology and tools point of view. Formal communication modeling and refinement is used to bridge the communication layers, and network-centric modeling of multiprocessor on-chip networks and socket-based design will serve the development of platforms for SoC and NoC integration. Interconnect-centric Design for Advanced SoC and NoC is concluded by two application examples: interconnect and memory organization in SoCs for advanced set-top boxes and TV, and a case study in NoC platform design for more generic applications.

The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

Ready-to-use building blocks for integrated circuit design. Why start coding from scratch when you can work from this library of pre-tested routines, created by an HDL expert? There are plenty of introductory texts to describe the basics of Verilog, but Verilog Designer's Library is the only book that offers real, reusable routines that you can put to work right away. Verilog Designer's Library organizes Verilog routines according to functionality, making it easy to locate the material you need. Each function is described by a behavioral model to use for simulation, followed by the RTL code you'll use to synthesize the gate-level implementation. Extensive test code is included for each function, to assist you with your own verification efforts. Coverage includes: Essential Verilog coding techniques Basic building blocks of successful routines State machines and memories Practical debugging guidelines Although Verilog Designer's Library assumes a basic familiarity with Verilog structure and syntax, it does not require a background in programming. Beginners can work through the book in sequence to develop their skills, while experienced Verilog users can go directly to the routines they need. Hardware designers, systems analysts, VARs, OEMs, software developers, and system integrators will find it an ideal sourcebook on all aspects of Verilog development.

ESD Protection Device and Circuit Design for Advanced CMOS Technologies is intended for practicing engineers working in the areas of circuit design, VLSI reliability and testing domains. As the problems associated with ESD failures and yield losses become significant in the modern semiconductor industry, the demand for graduates with a basic knowledge of ESD is also increasing. Today, there is a significant demand to educate the circuits design and reliability teams on ESD issues. This book makes an attempt to address the ESD design and implementation in a systematic manner. A design procedure involving device simulators as well as circuit simulator is employed to optimize device and circuit parameters for optimal ESD as well as circuit performance. This methodology, described in ESD Protection Device and Circuit Design for Advanced CMOS Technologies has resulted in several successful ESD circuit design with excellent silicon results and demonstrates its strengths.